Download: Aluminum Electrolytic Capacitor/HFQ Radial lead type Discontinued

Aluminum Electrolytic Capacitor/HFQ Radial lead type Discontinued

Series: HFQ Type : A ■ Features Endurance :105°C 1000 to 2000h Low impedance (1/3 to 1/4 of Series HFE) ■Specification Operating Temp. Range -55 to + 105°C Rated W.V. Range 6.3 to 63 V .DC Nominal Cap. Range 6 .8 to 15000µFCapacitance ±20 % (120Hz/+20°C) DC leakage current I < 0.01 CV or 3 (µ A) after 3 minutes W.V. 6.3 10 16 25 35 50 63 Dissipation Factor tan δ 0.22 0.19 0.16 0.14 0.12 0.10 0.08 (max.) (120Hz /+20°C) Add 0.02 per 1000µF for products of 1000µF or more Characteristics at Low Impedance at -10°C, 100kHz < 200 % of initial specified value at +20°C,100kHz. Temperature (Impedance ratio at 100kHz) After following life test with DC voltage and +105±2°C ripple current value applied. (The sum of DC and ripple peak voltage shall not exceed the rated working voltage), the capacitors shall meet the limits specified below. Endurance Duration:1000 hours (φ4 to 8), 2000 hours (φ10 to 18) post test requirements at +20°C Capacitance change ±20% of the initial measured value D.F. <200% of the initial specified value DC leakage current < initial specified value After storage for 1000 hours at +105±2°C with no voltage applied and then being stabilized at Shelf life +20°C, capacitor shall meet the limits specified in “Endurance”. ■ Explanation of Part NumberECAFQProduct Code R.W.V. code Series Code Capacitance code Option ■ Dimensions in mm (not to scale) Vinyl sleeve φ10< φ8> φd±0.05 (>6.3mmdia) Safety vent

L

L <16:L+1.0 max 14 min min φD+0.5 max φD+0.5 max L >20:L+2.0 max Body Dia. φD456.3 8 10 12.5 16 18 Body Length L 15 to25 30 to 40 Lead Dia. φd 0.45 0.5 0.5 0.6 0.6 0.6 0.8 0.8 0.8 Lead space P 1.5 2 2.5 3.55557.5 7.5 ■ Frequency correction factor for ripple current W.V. Capacitance Frequency(Hz) (V.DC) (µF) 60 120 1k 10k 100k 6.8 to 330 0.55 0.65 0.85 0.90 1.0 0.70 0.75 0.90 0.95 1.0 6.3 to 63 390 to 1000 1200 to 2200 0.75 0.80 0.90 0.95 1.0 2700 to 15000 0.80 0.85 0.95 1.00 1.0 – EE26 – P± 0.5 P± 0.5,

Aluminum Electrolytic Capacitor/HFQ

■ Case size / Impedance / Ripple current Discontinued W.V.(V.DC) 6.3 (0J) 10 (1A) Ripple current Ripple current Case size Capacitance Impedance (100kHz) Impedance (100kHz) (W) (100kHz) Capacitance (+105°C) (Ω) (100kHz) (φD×L) (µF) (+105°C)-10°C +20°C (mA) (µF) -10°C +20°C (mA) 4 × 11 68 2.000 1.000 120 47 2.000 1.000 120 5 × 11 100 1.300 0.650 175 82 1.300 0.650 175 5 × 15 150 0.920 0.460 235 100 0.920 0.460 235 6.3 × 11.2 220 0.600 0.300 290 180 0.600 0.300 290 6.3 × 15 330 0.400 0.200 400 220 0.400 0.200 400 8 × 11.5 470 0.340 0.170 445 330 0.340 0.170 445 8 × 15 680L❉ 0.240 0.120 575 470L❉ 0.240 0.120 575 8 × 20 1000 0.180 0.090 760 680 0.180 0.090 760 10 × 12.5 680 0.240 0.120 625 470 0.240 0.120 625 10 × 16 820 0.180 0.090 795 560 0.180 0.090 795 10 × 20 1200L❉ 0.130 0.065 1015 1000L❉ 0.130 0.065 1015 10 × 25 1500 0.110 0.055 1190 1200 0.110 0.055 1190 10 × 30 2200L❉ 0.090 0.045 1440 1500L❉ 0.090 0.045 1440 12.5 × 15 1200 0.130 0.065 1010 1000 0.130 0.065 1010 12.5 × 20 2200 0.084 0.042 1400 1800 0.084 0.042 1400 12.5 × 25 2700 0.068 0.034 1690 2200 0.068 0.034 1690 12.5 × 30 3900 0.060 0.030 1950 2700 0.060 0.030 1950 12.5 × 35 4700L❉ 0.048 0.024 2220 3300L❉ 0.048 0.024 2220 12.5 × 40 5600L❉ 0.042 0.021 2390 3900L❉ 0.042 0.021 2390 16 × 15 2700S❉ 0.092 0.046 1360 1800S❉ 0.092 0.046 1360 16 × 20 4700 0.068 0.034 1730 3300 0.068 0.034 1730 16 × 25 5600 0.056 0.028 2070 3900 0.056 0.028 2070 16 × 31.5 6800 0.050 0.025 2350 5600 0.050 0.025 2350 16 × 35.5 8200 0.044 0.022 2550 6800L❉ 0.044 0.022 2550 16 × 40 12000 0.036 0.018 2900 8200L❉ 0.036 0.018 2900 18 × 15 3300 0.076 0.038 1620 2200S❉ 0.076 0.038 1620 18 × 20 5600S❉ 0.056 0.028 2000 3900S❉ 0.056 0.028 2000 18 × 25 6800S❉ 0.050 0.025 2200 5600S❉ 0.050 0.025 2200 18 × 31.5 10000 0.046 0.023 2800 6800 0.046 0.023 2800 18 × 35.5 12000S❉ 0.042 0.021 2900 8200 0.042 0.021 2900 18 × 40 15000 0.034 0.017 3000 10000 0.034 0.017 3000 W.V.(V.DC) 16 (1C) 25 (1E) Case size Ripple currentCapacitance Impedance (100kHz) Capacitance Impedance (100kHz) Ripple current (Ω) (100kHz) (Ω) (100kHz) (φD×L) (µF) (+105°C) (µF) (+105°C)-10°C +20°C (mA) -10°C +20°C (mA) 4 × 11 39 2.000 1.000 120 27 2.000 1.000 120 5 × 11 56 1.300 0.650 175 39 1.300 0.650 175 5 × 15 82 0.920 0.460 235 56 0.920 0.460 235 6.3 × 11.2 120 0.600 0.300 290 82 0.600 0.300 290 6.3 × 15 180 0.400 0.200 400 120 0.400 0.200 400 8 × 11.5 270 0.340 0.170 445 180 0.340 0.170 445 8 × 15 330L❉ 0.240 0.120 575 220L❉ 0.240 0.120 575 8 × 20 470 0.180 0.090 760 330 0.180 0.090 760 10 × 12.5 330 0.240 0.120 625 220 0.240 0.120 625 10 × 16 390 0.180 0.090 795 270 0.180 0.090 795 10 × 20 680L❉ 0.130 0.065 1015 470L❉ 0.130 0.065 1015 10 × 25 820 0.110 0.055 1190 560 0.110 0.055 1190 10 × 30 1200L❉ 0.090 0.045 1440 820L❉ 0.090 0.045 1440 12.5 × 15 680 0.130 0.065 1010 470 0.130 0.065 1010 12.5 × 20 1200 0.084 0.042 1400 820 0.084 0.042 1400 12.5 × 25 1500 0.068 0.034 1690 1000 0.068 0.034 1690 12.5 × 30 2200L❉ 0.060 0.030 1950 1500L❉ 0.060 0.030 1950 12.5 × 35 2700L❉ 0.048 0.024 2220 1800L❉ 0.048 0.024 2220 12.5 × 40 3300L❉ 0.042 0.021 2390 2200L❉ 0.042 0.021 2390 16 × 15 1500S❉ 0.092 0.046 1360 820S 0.092 0.046 1360 16 × 20 2200 0.068 0.034 1730 1500 0.068 0.034 1730 16 × 25 2700 0.056 0.028 2070 1800 0.056 0.028 2070 16 × 31.5 3900 0.050 0.025 2350 2700 0.050 0.025 2350 16 × 35.5 4700L❉ 0.044 0.022 2550 3300L❉ 0.044 0.022 2550 16 × 40 5600 0.036 0.018 2900 3900L❉ 0.036 0.018 2900 18 × 15 1800 0.076 0.038 1620 1200 0.076 0.038 1620 18 × 20 3300S❉ 0.056 0.028 2000 2200S❉ 0.056 0.028 2000 18 × 25 3900S❉ 0.050 0.025 2200 2700S❉ 0.050 0.025 2200 18 × 31.5 4700 0.046 0.023 2800 3300 0.046 0.023 2800 18 × 35.5 6800 0.042 0.021 2900 3900 0.042 0.021 2900 18 × 40 8200 0.034 0.017 3000 4700 0.034 0.017 3000 ❉ L or S in case size table are optional codes. – EE27 –,

Aluminum Electrolytic Capacitor/HFQ

■ Case size / Impedance / Ripple current Discontinued W.V.(V.DC) 35 (1V) 50 (1H) Case size Ripple currentCapacitance Impedance (100kHz) Capacitance Impedance (100kHz) Ripple current (Ω) (100kHz) (100kHz) (φD×L) (µF)•@ (+105° (Ω) C) (+105°C) -10°C +20°C (µF)(mA) -10°C +20°C (mA) 4 × 11 18 2.000 1.000 120 10 5.000 2.500 90 5 × 11 27 1.300 0.650 175 18 2.600 1.300 155 5 × 15 39 0.920 0.460 235 27 1.800 0.900 215 6.3 × 11.2 56 0.600 0.300 290 33 1.200 0.600 260 6.3 × 15 82 0.400 0.200 400 56 0.800 0.400 360 8 × 11.5 120 0.340 0.170 445 68 0.600 0.300 410 8 × 15 150L❉ 0.240 0.120 575 100 0.460 0.230 500 8 × 20 220 0.180 0.090 760 150 0.320 0.160 670 10 × 12.5 150 0.240 0.120 625 82 0.460 0.230 510 10 × 16 180 0.180 0.090 795 120 0.320 0.160 640 10 × 20 330L❉ 0.130 0.065 1015 220L❉ 0.220 0.110 890 10 × 25 390 0.110 0.055 1190 270 0.180 0.090 1040 10 × 30 560L❉ 0.090 0.045 1440 390L❉ 0.150 0.075 1300 12.5 × 15 330 0.130 0.065 1010 220 0.260 0.130 920 12.5 × 20 560 0.084 0.042 1400 330 0.160 0.080 1200 12.5 × 25 680 0.068 0.034 1690 470 0.140 0.070 1440 12.5 × 30 1000L❉ 0.060 0.030 1950 560 0.120 0.060 1680 12.5 × 35 1200L❉ 0.048 0.024 2220 680L❉ 0.100 0.050 1850 12.5 × 40 1500L❉ 0.042 0.021 2390 820L❉ 0.086 0.043 2010 16 × 15 560S❉ 0.092 0.046 1360 390 0.168 0.084 1270 16 × 20 1000 0.068 0.034 1730 680 0.106 0.053 1470 16 × 25 1200 0.056 0.028 2070 820 0.088 0.044 1810 16 × 31.5 1800 0.050 0.025 2350 1000 0.066 0.033 2120 16 × 35.5 2200L❉ 0.044 0.022 2550 1200L❉ 0.056 0.028 2260 16 × 40 2700L❉ 0.036 0.018 2900 1500L❉ 0.052 0.026 2410 18 × 15 820 0.076 0.038 1620 470S❉ 0.140 0.070 1470 18 × 20 1500 0.056 0.028 2000 680S❉ 0.100 0.050 1810 18 × 25 1800S❉ 0.050 0.025 2200 1000S❉ 0.082 0.041 2000 18 × 31.5 2200 0.046 0.023 2800 1200 0.062 0.031 2220 18 × 35.5 2700 0.042 0.021 2900 1500 0.054 0.027 2460 18 × 40 3300 0.034 0.017 3000 1800 0.050 0.025 2560 W.V.(V.DC) 63 (1J) Impedance (100kHz) Ripple current Case size Capacitance (Ω) (100kHz) (φD×L) (µF) (+105°C)-10°C +20°C (mA) 4 × 11 6.8 7.000 3.500 80 5 × 11 12 4.000 2.000 145 5 × 15 18 2.600 1.300 200 6.3 × 11.2 22 2.000 1.000 240 6.3 × 15 39 1.400 0.700 330 8 × 11.5 56 0.760 0.380 370 8 × 15 82 0.600 0.300 450 8 × 20 100L❉ 0.380 0.190 600 10 × 12.5 68 0.600 0.300 470 10 × 16 100 0.380 0.190 580 10 × 20 150L❉ 0.280 0.140 820 10 × 25 180 0.240 0.120 950 10 × 30 270L❉ 0.190 0.095 1110 12.5 × 15 150 0.320 0.160 890 12.5 × 20 220 0.190 0.095 1140 12.5 × 25 330 0.180 0.090 1420 12.5 × 30 390 0.160 0.080 1620 12.5 × 35 470L❉ 0.130 0.065 1780 12.5 × 40 560L❉ 0.120 0.060 1950 16 × 15 270 0.200 0.100 1220 16 × 20 470 0.140 0.070 1450 16 × 25 560 0.120 0.060 1750 16 × 31.5 680 0.100 0.050 2050 16 × 35.5 820 0.084 0.042 2220 16 × 40 1000L❉ 0.068 0.034 2370 18 × 15 330S❉ 0.170 0.085 1410 18 × 20 560S❉ 0.130 0.065 1750 18 × 25 680S❉ 0.114 0.057 1940 18 × 31.5 1000 0.096 0.048 2110 18 × 35.5 1200 0.082 0.041 2300 18 × 40 1500 0.066 0.033 2510 – EE28 –,

Application Guidelines 1.2 Operating Temperature and Life Expectancy

(1) Expected life is affected by operating temperature. 1. Circuit Design Generally, each 10°C reduction in temperature Ensure tha t operational and mounting condit ions will double the expected life. Use capacitors at follw the specified conditions detailed in the catalog t he l owestpossibletempera tu re be low the and specification sheets. maximum guaranteed temperature. 1.1 Operating Temperature and Frequency (2) I f operat ing condi t ions exceed the maximum Elect ro ly t ic capac i tor e lectrica l parameters are guaran teed l imit, rap id e Iectrica l parameter normally specified at 20°C temperature and 120Hz deterioration will occur, and irreversible damage frequency. These parameters vary with changes in will result. t emperatureandfrequency. Circuitdes igne rs Check for maximum capacitor operating tempera- should take these changes into consideration. tures including ambient temperature, internal (1) Effects of operat ing temperature on electr ical capacitor temperature rise caused by ripple current, parameters and theeffec tsofrad ia ted heat f rom power a)At h igher temperatures, leakage current and transistors, IC?s or resistors. capac i tance increase while equivalent series Avoid placing components which could conduct resistance(ESR) decreases. heat to the capacitor from the back side of the circuit b)At lower tempera tures, leakage current and board. capac i tance decrease while equivalent series (3)The formula for calculating expected Iife at lower resistance(ESR) increases. operating temperatures is as fllows; (2) Effects of frequency on e lectr ica l parameters T1-T2 a ) Athigherfrequencies, capacitanceandL2 = L1x210where, impedance decrease while tan δ increases. b)At lower frequencies, r ipple current generated L1: Guaranteed life (h) at temperature, T1° C heat will r ise due to an increase in equivalent L2: Expected life (h) at temperature,T2°C ser ies resistance (ESR). T1: Maximum operating temperature (°C) T 2: Actual operating temperature, ambient temperature + temperature rise due to ripple currentheating(°C) A quick eference capacitor guide for estimating exected life is included for your reference. ■ Expected Life Estimate Quick Reference Guide ■ Failure rate curve 120 1. 85°C2000h 2.105°C1000h 1102343.105°C2000h 100 4.105°C5000h 90 Initial failure period 1 Random failure period Wear failure period 50 Life Time (h) 2000 5000 10,000 20,000 50,000 100,000 200,00024h operat- ion Years12345720 Time 8h/d3610 15 20 30Years – EE16 – Capacitor Ambient Temperature Failure rate, ■ Typical failure modes and their factors Faliure mode Faliure mechanism (internal phenomenon) Production factor Application factor Overvoltage applied Vent operates Increase in Increase in inter-• • internal pressure nal temperature • Excessive ripple current Capacitance Reduced anode foil reduction capacitance • Reverse voltage applied • • • • • tan d increase Reduced cathode foil capacitance • Severe charging-discharging AC voltage applied • Defect of oxide film • • Used for a high temperature Deterioration of • Insufficient oxide film • electrolyte Leakage current • • Used for a long period of time increase Electrolyte evapora- tion • Metal particles in capacitor • • Stress applied to leads Short circuit Insulation breakdown of film • or electrolytic paper Burr(s) on foil leads Leads improperly connected Leads improperly connected • Mechanical stress Open • • Use of Halogenated solvent Corrosion Infiltration of Cl • Use of adhesive Use of coating material – EE17 –, 1.3 Common Application Conditions to Avoid The vinyl sleeve of the capacitor can be damaged The following misapplication load condit ions willifsolderpassesthroughaleadholefo r cause rapid deter iorat ion to capacitor electr ical subsequently processed parts. Special care when parameters. ln addi t ion, rapid heat ing and gas locating hole positions in proximity to capacitors is generation within the capacitor can occur causing recommended. the pressure relief vent to operate and resuItant (3) Circuit Board Hole Spacing leakage of electrolyte. Under extreme conditions, The circuit board holes spacing should match the explosion and fire could result. Leakinq electrolyte capacitor lead wire spacing within the specified is combustible and electrically conductive. tolerances. Incorrect spacing can cause excessive (1) Reverse Voltaqe lead wire stress during the insertion process. This DC capacitors have polarity. Verify correct polarity may resuIt in premature capacitor failure due to before inser tion. For circuits with changing or short or open circuit, increased leakage current, uncertain polarity,use DC bipolar capacitors. DC or electrolyte leakage. bipolar capacitors are not suitable for use in AC (4)Land/Pad Pattern circuits. The circuit board land/pad pattern size for chip (2) Charqe/Discharqe Applications capacitors is specified in the following table. Standard capacitors are not suitable for use in repeating charge/discharge appl icat ions. For [ Table of Board Land Size vs. Capacitor Size ] charqe/discharqe applications consult us and advise actual conditions. (3) Overvoltage Do not appIy voltaqes exceeding the maximum c specified rated voltages. Voltage up to the surge voltage rating are acceptable for short periods of time. Ensure that the sum of the DC voltage andbabBoard land part the superimposed AC r ipple vo l tage does not exceed the rated voltage. (mm) (4) Ripple Current SizeabcDo not apply ripple currents exceeding the maximum A(φ3) 0.6 2.2 1.5 specified value. For high ripple current applications, B(φ4) 1.0 2.5. 1.6 use a capacitor designed for high rippIe currents C(φ5) 1.5 2.8 1.6 or contact us with your requirements. D(φ6.3) 1.8 3.2 1.6 Ensure that allowable ripple currents superimposed E(φ8 x 6.2L) 2.2 4.0 1.6 on low DC bias voltages do not cause reverse voltage F(φ8 x 10.2L) 3.1 4.0 2.0 conditions. G(φ10 x 10.2L) 4.6 4.1 2.0 Among others, when the size a is wide , back fillet can 1.4 Using Two or More Capacitors in Series not be made, decreasing fitting strength. or Parallel (1) Capacitors Connected in Parallel ❉ Decide considering mounting condition, solderability The circuit resistance can closely approximate the andfitting strength, etc. based on the design ser ies resistance of the capacitor causing an standards of your company. imbalance of r ipple current loadswithin the capacitors. Careful design of wiring methods can minimize the possibility of excessive ripple currents applied to a capacitor. (2) Capacitors Connected in Series Normal DC leakage current differences among capacitors can cause voltage imbalances. The use of voltage divider shunt resistors with consideration to leakage currents, can prevent capacitor voltage imbaIances. 1.5 Capacitor Mounting Considerations (1) DoubIe - Sided Circuit Boards Avoid wir ing Pattern runs which pass between the mounted capacitor and the circuit board. When dipping into a solder bath, excess solder may collect under the capac i tor by capi l laryact ion and shortcircuit the anode and cathode terminals. (2) Circuit Board Hole Positioning – EE18 –, (5)Clearance for Case Mounted Pressure 2.Capacitor Handling Techniques

Relief Vents 2.1 Considerations Before Using

Capacitors with case mounted pressure relief vents (1) Capacitors have a finite life. Do not reuse or require sufficient clearance to allow for proper vent recycle capacitors from used equipment. operation. The minimum clearances are dependent (2) Transient recovery voltage may be generated in on capacitor diameters as follows. the capacitor due to dielectric absorption. If f6.3 to f16 mm : 2 mm minimum, required, this voltage can be discharged with a f18 to f35 mm : 3 mm minimum. resistor with a value of about 1 kΩ. f40 mm or greater: 5 mm minimum (3) Capacitors stored for long periods of time may (6)Clearance for Seal Mounted Pressure exhibit an increase in leakage current. This can

Relief Vents be corrected by gradually applying rated voltage

A hole in the circuit board directly under the seal in series with a resistor of approximately 1 kΩ. vent location is required to allow proper release (4) If capacitors are dropped, they can be damaged of pressure. mechanically or electrically. Avoid using dropped (7)Wiring Near the Pressure Relief Vent capacitors. Avoid locating high voltage or high current wiring (5) Dented or crushed capacitors should not be or circuit board paths above the pressure relief used. The seal integrity can be compromised vent. Flammable, high temperature gas exceeding and loss of electrolyte/shortened life can result. 100°C may be released which could dissolve the wire insulation and ignite. 2.2 Capacitor Insertion (8)Circuit Board Patterns Under the Capacitor (1) Verify the correct capacitance and rated voltage Avoid circuit board runs under the capacitor as of the capacitor. electrolyte leakage could cause an electrical short. (2) Verify the correct polarity of the capacitor before (9)Screw Terminal Capacitor Mounting inserting. ● Do not orient the capacitor with the screw terminal (3) Verify the correct hole spacing before insertion side of the capacitor facing downwards. (land pattern size on chip type) to avoid stress ● Tighten the terminal and mounting bracket screws on the terminals. withinthetorquerangespecifiedinthe(4) Ensure that the auto insertion equipment lead specification. clinching operation does not stress the capacitor leads where they enter the seal of the capacitor. For chip type capacitors, excessive mounting 1.6Electrical Isolation of the Capacitor pressure can cause high leakage current, short Completely isolate the capacitor as follows. circuit, or disconnection. ● Between the cathode and the case (except for axially leaded B types) and between the anode terminal and other circuit paths. 2.3 Manual Soldering ● Between the extra mounting terminals (on T types) (1) Observe tempera tu re and t ime so lde r ing and the anode terminal, cathode terminal, and specifications or do not exceed temperatures of other circuit paths. 350°C for 3 seconds or less. (2) If lead wires must be formed to meet terminal board hole spacing, avoid stress on the leadwire 1.7 Capacitor Sleeve where it enters the capacitor seal. The vinyl sleeve or laminate coating is intended for (3) If a soldered capacitor must be removed and marking and identification purposes and is not meant reinserted, avoid excessive stress to the capacitor to electrically insulate the capacitor. leads. The s leev ing may split or crack if immersed into (4) Aviod touching the tip of the soldering iron to the solvents such as toluene or xylene, and then exposed capacitor, to prevent melting of the vinyl sleeve. to high temperatures. Always consider safety when designing equipment and circuits. Plan for worst case failure modes such as short circuits and open circuits which could occur during use. (1)Provide protection circuits and protection devices to allow safe failure modes. (2)Design redundant or secondary circuits where possible to assure continued operation in case of main circuit failure. – EE19 –, 2.4 Flow Soldering (1) Don not immerse the capaci tor body into the 2.6 Other Soldering Considerations solder bath as excessive internal pressure could Rap id tempera ture r ises dur ing the preheat result. operation and resin bonding operation can cause (2) Observe proper soldering conditions (temperature, cracking of the capacitor vinyl sleeve. For heat time, etc.). Do not exceed the specified limits. curing, do not exceed 150°C for a maximum time of (3) Do not allow other parts or components to touch 2 minutes. the capacitor during soldering. 2.5 Reflow Soldering for Chip Capacitors 2.7 Capacitor Handling after Soldering (1) For reflow, use a thermal conduction system such (1) Avoid movement of the capacitor after soldering as infrared radiation (IR) or hot blast. Vapor heat to prevent excessive stress on the leadwires transfer systems (VPS) are not recommended. where they enter the seal. (2) Observe proper soldering conditions (temperature, (2) Do not use the capacitor as a handle when time, etc.). Do not exceed the specified limits. moving the circuit board assembly. (3) Reflow should be performed one time. Consult us for additional reflow restrictions. (3) Avoid striking the capacitor after assembly to prevent failure due to excessive shock. 5(s) Peak 2.8 Circuit Board Cleaning temperature 200 (1) Circuit boards can be immersed or ultrasonically cleaned using suitable cleaning solvents for up 160°C 150to5minutesandupto60° Cmaximum120(s) Time in temperatures. The boards should be thoroughly 200°C or more 100 rinsed and dried. Recommended c lean ing so l ventsinc lude 50 Pine Alpha ST-100S, Sunelec B-12, DK Beclear CW-5790, Aqua Cleaner 210SEP, Cold Cleaner Time P3-375, Telpen Cleaner EC-7R, Clean-thru 750H, Chip capacitor reflow guaranteed condition Clean-thru 750L, Clean thru 710M, Techno 240 Cleaner 219, Techno Care FRW-17, Techno Care FRW-1, Techno Care FRV-1, IPA (isopropyl 230 alcohol) ✽ The use of ozone depleting cleaning agents are 210 not recommended in the interest of protecting the environment. 0 10 20 30 40 50 60 Time in 200°C or more (s) (2) Avoid using the following solvent groups unless (φ3 to 6.3φ) specifically allowed for in the specification; 240 ● Halogenated cleaning solvents: except for solvent resistant capacitor types, halogenated solvents can permeate the seal and cause internal 220 capaci tor corrosion and failure. For solvent res is tan t capac i to rs , ca re fullyfollow the 210 temperature and t ime requi rements of the specificaion. 1-1-1 trichloroe thane should never 0 10 20 30 40 50 60 be used on any aluminium electrolytic capacitor. Time in 200°C or more (s) ● Alkali solvents: could attack and dissolve the (φ8 to φ10) aluminum case.

EB Series ● Petroleum based solvents: deterioration of the

240 rubber seal could result. ● Xylene: deterioration of the rubber seal could 230 result. ● Acetone: removal of the ink markings on the vinyl sleeve could result. ✽ Temperaturemeasuringmethod: Measure010 20 30 40 50 60 temperature in assuming quantitative production, by Time in 200°C or more (s) (φ10 to φ18) sticking the thermo-couple to the capacitor upper part with epoxy adhesives. – EE20 – Peak temperature (°C) Peak temperature (°C) Peak temperature (°C) Parts upper part temperature (°C), (3) A thorough drying after cleaning is required to 3.2 Electrical Precautions remove residual cleaning solvents which may be trapped between the capacitor and the circuit (1) Avoid touching the terminals of the capacitor as board. Avoid drying temperatures which exceed possible electric shock could result. The exposed the maximum rated temperature of the capacitor. aluminium case is not insulated and could also (4) Monitor the contamination levels of the cleaning cause electric shock if touched. solvents during use by electrical conductivity, pH, (2)Avoid shortcircuiting the area be tween the specific gravity, or water content. Chlorine levels capacitor terminals with conductive materials can rise with contamination and adversely affect including liquids such as acids or alkaline solutions. the performance of the capacitor. ✽ Please consult us for additonal information about 4.Emergency Procedures acceptable cleaning solvents or cleaning methods. (1) I f the pressure rel ief vent of the capaci tor Type Series Cleaning permitted operates, immediately turn off the equipment and Surface mount type V(Except EB disconnect from the power source. This wil l Series) L minimize addi t ional damage caused by the Lead type Bi-polar SU L vaporizing electrolyte. M (2) Avoid contact with the escaping electrolyte gasL(~ 100V) which can exceed 100°C temperatures. KA L If electrolyte or gas enters the eye, immediately Bi-polar KA L flush the eye with large amounts of water. FB L If electrolyte or gas is ingested by mouth, gargle FC L with water. If electrolyte contacts the skin, wash GA L with soap and water. NHG L(~ 100V) EB L(~ 100V) 5. Long Term Storage TA L Snap-in type TS UP L(~ 100V) Leakage current of a capacitor increases with long TS HA L(~ 100V) storage times. The aluminium oxide film deteriorates as a funct ion of temperature and t ime. I f used 2.9 Mounting Adhesives and Coating Agents without reconditioning, an abnormally high current will be required to restore the oxide film. This current When using mounting adhesives or coating agents to surge could cause the circuit or the capacitor to fail. control humidity, avoid using materials containing Capacitor should be reconditioned by applying rated ha logena ted so lven ts . A l so , avo id the useofvoltage in series with a 1000 Ω , current l imiting chloroprene based polymers. resistor for a time period of 30 minutes. ✽ After applying adhesives or coatings, dry thoroughly to prevent residual solvents from being trapped 5.1 Environmental Conditions (Storage) between the capacitor and the circuit board. Capacitors should not be stored in the following environments. 3.Precautions for using capacitors (1) Temperature exposure above 35°C or below 15 °C. (2) Direct contact with water, salt water, or oil. 3.1 Environmental Conditions (3) High humidity condit ions where water could Capaci tors should not be used in the fo l lowing condense on the capacitor. environments. (4) Exposure to toxic gases such as hydrogen (1) Temperature exposure above the maximum rated sulf ide,sulfuric acid, nitr ic acid, chlorine, or or below the minimum rated temperature of the ammonia. capacitor. (5) Exposure to ozone, radiation, or ultraviolet rays. (2) Direct contact with water, salt water, or oil. (6) V ibra t ion and shock conditions exceed ing (3) High humidi ty condi t ions where water could specified requirements. condense on the capacitor. (4) Exposure to toxic gases such as hydrogen sulfide, sulfuric acid, nitric acid, chlorine, or ammonia. (5) Exposure to ozone, radiation, or ultraviolet rays. (6) Vibrationandshockconditionsexceedingspecified requirements. – EE21 –, 6.Capacitor Disposal When disposing of capaci tors, use one of the following methods. ● Inc inera teaftercrush ing the capac i tororpuncturing the can wall (to prevent explosion due to internal pressure rise). Capacitors should be incinerated at high temperatures to prevent the release of toxic gases such as chlorine from the polyvinyl chloride sleeve, etc. ● Dispose of as solid waste. ● Locallawsmayhavespecificdisposalrequirements which must be followed. The application guidelines above are taken from: Technical Report EIAJ RCR-2367 issued by the Japan Electronic Industry Association, Inc. - Guideline of notabilia for aluminium electrolytic capacitors with non-solid electrolytic for use in electronic equipment. Refer to this Technical Report for additional details. – EE22 –]

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