Download: INTEGRATED CIRCUITS DATA SHEET TDA8560Q 2 × 40 W/2 Ω stereo BTL car radio power amplifier with diagnostic facility Product specification 1996 Jan 08 Supersedes data of March 1994

INTEGRATED CIRCUITS

DATA SHEET TDA8560Q

2 × 40 W/2 Ω stereo BTL car radio power amplifier with diagnostic facility Product specification 1996 Jan 08 Supersedes data of March 1994 File under Integrated Circuits, IC01, FEATURES • Thermally protected • Requires very few external components • Reverse polarity safe • High output power • Electrostatic discharge protection • 4 Ω and2Ωload impedance • No switch-on/switch-off plop • Low output offset voltage • Flexible leads • Fixed gain • Low thermal resistance. • Diagnostic facility (distortion, short-circuit and temperature detection) GENERAL DESCRIPTION • Good ripple rejection The TDA8560Q is an integrated class-B output amplifier in • Mode select switch (operating, mute and standby) a 13-lead single-in-line (SIL) power package. • Load dump protection It contains 2 × 40 W/2 Ω amplifiers in BTL configuration. • Short-circuit safe to ground, to VP and across the load The device is primarily developed for car radio • applications.Low power dissipation in any short-circuit condition QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP operating supply voltage 6.0 14.4 18 V IORM repetitive peak output current − − 7.5 A Iq(tot) total quiescent current − 115 − mA Isb standby current − 0.1 100 µA Isw switch-on current − − 40 µA ZI input impedance 25 30 − kΩ Po output power RL = 4 Ω; THD = 10% − 25 − W RL = 2 Ω; THD = 10% − 40 − W SVRR supply voltage ripple rejection Rs = 0 Ω − 45 − dB αcs channel separation Rs = 10 kΩ − 50 − dB Gv closed loop voltage gain 39 40 41 dB Vno noise output voltage Rs = 0 Ω − − 250 µV ∆VO DC output offset voltage − − 200 mV ORDERING INFORMATION

PACKAGE

TYPE NUMBER NAME DESCRIPTION VERSION TDA8560Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 1996 Jan 08 2,

BLOCK DIAGRAM

VP1 VP2 3 10 1 mute switch input 1 Cm TDA8560Q VA 4 output 1A

Ω PROTECTIONS

18 kΩ Load dump power stage Soar Thermal Short - circuit mute switch Cm Reverse polarity VA 6 30 output 1B kΩ

Ω

18 kΩ power stage

VP

stand-by mode switch switch stand-by reference VA voltage 15 kΩ x1 mute DIAGNOSTIC 12 diagnostic switch INTERFACE output 15 kΩ mute reference voltage input 2 mute switch Cm VA 9 output 2B

Ω

18 kΩ power stage mute switch Cm VA 7 output 2A kΩ

Ω

input 18 kΩ reference power stage voltage258GND1 GND2 MEA856 - 1 ground (signal) power ground (substrate)

Fig.1 Block diagram.

1996 Jan 08 3, PINNING FUNCTIONAL DESCRIPTION SYMBOL PIN DESCRIPTION The TDA8560Q contains two identical amplifiers and can be used for bridge applications. The gain of each amplifier IN11input 1 is fixed at 40 dB. Special features of the device are as GND(S) 2 signal ground follows. VP1 3 supply voltage 1 OUT 1A 4 output 1A Mode select switch (pin 11) GND1 5 power ground 1 • Standby: low supply current (<100 µA) OUT 1B 6 output 1B • Mute: input signal suppressed OUT 2A 7 output 2A • Operating: normal on condition. GND2 8 power ground 2 Since this pin has a very low input current (<40 µA), a low OUT 2B 9 output 2B cost supply switch can be applied. VP2 10 supply voltage 2 To avoid switch-on plops, it is advised to keep the amplifier MODE 11 mode switch input in the mute mode during ≥100 ms (charging of the input VDIAG 12 diagnostic output capacitors at pin 1 and pin 13). IN 2 13 input 2 This can be achieved by: • Microprocessor control • External timing circuit (see Fig.7). Diagnostic output (pin 12) DYNAMIC DISTORTION DETECTOR (DDD) IN11At the onset of clipping of one or more output stages, the dynamic distortion detector becomes active and pin 12 GND(S) 2 goes low. This information can be used to drive a sound VP1 3 processor or DC volume control to attenuate the input OUT 1A 4 signal and thus limit the distortion. The output level of pin 12 is independent of the number of channels that are GND1 5 clipping (see Fig.3). OUT 1B 6 OUT 2A 7 TDA8560Q GND2 8 OUT 2B9V10 handbook, halfpageV MGA721 P2 O MODE 11 0 VDIAG 12 IN 2 13 V12

VP

MEA855 - 1 t Fig.2 Pin configuration. Fig.3 Distortion detector waveform. 1996 Jan 08 4, SHORT-CIRCUIT PROTECTION During this short-circuit condition, pin 12 is low for 20 ms and high for 50 µs (see Fig.4). When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the output stages are The power dissipation in any short-circuit condition is switched off until the short-circuit is removed and the very low. device is switched on again, with a delay of approximately 20 ms, after removal of the short-circuit. During this TEMPERATURE DETECTION short-circuit condition, pin 12 is continuously low. When the virtual junction temperature Tvj reaches 150 °C, When a short-circuit across the load of one or both pin 12 will become continuously low. channels occurs the output stages are switched off during approximately 20 ms. After that time it is checked during OPEN COLLECTOR OUTPUT approximately 50 µs to see whether the short-circuit is still present. Due to this duty cycle of 50 µs/20 ms the average Pin 12 is an open collector output, which allows pin 12 of current consumption during this short-circuit condition is more devices being tied together. very low (approximately 40 mA). handbook, full pagewidthcurrent MGA722 in output stage t short-circuit over the load V12 20 ms

VP

t 50µsFig.4 Short-circuit waveform. 1996 Jan 08 5, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage operating − 18 V non-operating − 30 V load dump protection during 50 ms; tr ≥ 2.5 ms − 45 V Vpsc AC and DC short-circuit safe voltage − 18 V Vpr reverse polarity − 6 V IOSM non-repetitive peak output current − 10 A IORM repetitive peak output current − 7.5 A Ptot total power dissipation − 60 W Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +85 °C Tvj virtual junction temperature − 150 °C THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air 40 K/W Rth j-c thermal resistance from junction to case (see Fig.5) 1.3 K/W output 1 output 2 handbook, halfpage virtual junction 2.2 K/W 2.2 K/W 0.2 K/W MBA624 case Fig.5 Equivalent thermal resistance network. 1996 Jan 08 6, DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measured in Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VP supply voltage note 1 6.0 14.4 18 V Iq quiescent current RL = ∞ − 115 180 mA Operating condition V11 mode switch voltage level 8.5 − VP V I11 mode switch current V11 = 14.4 V − 15 40 µA VO DC output voltage note 2 − 7.0 − V ∆VO DC output offset voltage − − 200 mV Mute condition V11 mode switch voltage level 3.3 − 6.4 V VO DC output voltage note 2 − 7.0 − V ∆VO DC output offset voltage − − 200 mV Standby condition V11 mode switch voltage level 0 − 2 V Isb standby current − 0.1 100 µA Diagnostic output V12 diagnostic output voltage any short-circuit or clipping − − 0.6 V Notes 1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V. 2. At 18 V < VP < 30 V the DC output voltage ≤1⁄2VP. 1996 Jan 08 7, AC CHARACTERISTICS VP = 14.4 V; RL = 2 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Po output power THD = 0.5% 25 30 − W THD = 10% 33 40 − W THD = 30% 45 55 − W Po output power VP = 13.2 V THD = 0.5% − 25 − W THD = 10% − 35 − W THD total harmonic distortion Po = 1 W − 0.1 − % V12 ≤ 0.6 V; note 1 − 10 − % B power bandwidth THD = 0.5%; − 20 to 20000 − Hz Po = −1 dB with respect to 25 W flr low frequency roll-off at −1 dB; note 2 − 25 − Hz fhr high frequency roll-off at −1 dB 20 − − kHz Gv closed loop voltage gain 39 40 41 dB SVRR supply voltage ripple rejection on note 3 40 − − dB mute note 3 50 − − dB standby note 3 80 − − dB Zi input impedance 25 30 38 kΩ Vno noise output voltage on note 4 − 200 250 µV on note 5 − 250 − µV mute note 6 − 135 − µV αcs channel separation note 7 45 − − dB ∆Gv channel unbalance − − 1 dB Vo output voltage in mute note 8 − − 5 mV Notes 1. Dynamic distortion detector active. 2. Frequency response externally fixed. 3. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω. 4. B = 20 Hz to 20 kHz; Rs = 0 Ω. 5. B = 20 Hz to 20 kHz; Rs = 10 kΩ. 6. B = 20 Hz to 20 kHz; independent of Rs. 7. Po = 25 W; Rs = 10 kΩ. 8. Vi = Vi(max) = 1 V (RMS). 1996 Jan 08 8, AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Po output power THD = 0.5% 16 19 − W THD = 10% 21 25 − W THD = 30% 28 35 − W Po output power VP = 13.2 V THD = 0.5% − 15 − W THD = 10% − 21 − W THD total harmonic distortion Po = 1 W − 0.1 − % 1996 Jan 08 9, QUALITY SPECIFICATION Quality in accordance with “Quality reference handbook SNW-FQ-611E”, if this type used as an audio amplifier. This handbook can be ordered using the code 9397 750 00192. TEST AND APPLICATION INFORMATION mode switch VP 14.4 V 100 2200 11 3 10 nF µF 470 nF input 1 30 RL kΩ

VP

ground (signal) TDA8560Q 10 kΩ (1) 12 diagnostic output reference voltage 470 nF input29kΩ RL58MEA857 - 1 power ground (substrate) (1) To avoid high energy switching pulses which can feedback to the inputs it is advisable to ensure that the value of the resistor at pin 12 is ≥10 kΩ. Fig.6 Stereo BTL test/application diagram. 1996 Jan 08 10, Diagnostic output Special care must be taken in the printed-circuit board layout to separate pin 12 from pin 1 and pin 13, to minimize the crosstalk between the diagnostic output and V the inputs. handbook, halfpage P Mode select switch 10 kΩ 10 kΩ To avoid switch-on plops, it is advised to keep the amplifier in the mute mode during >100 ms (charging of the input capacitors at pin 1 and pin 13). mode select The circuit in Fig.7 slowly ramps up the voltage at the switch 47 µF mode select switch pin when switching on and results in 100 kΩ fast muting when switching off. MGA708 Fig.7 Mode select switch circuitry. MGA904 10 2

THD

(%) (1) 10 1 (2) (3) 10 2 10 2 101110 Po (W) 10 (1) f = 10 kHz. (2) f = 1 Hz. (3) f = 100 Hz. Fig.8 Total harmonic distortion as a function of output power; VP = 14.4 V; RL = 2 Ω. 1996 Jan 08 11, MGA905 handboPok, full pagewidtho (W) 50 (1) (2) 30 (3) 8 10 12 14 16VP(V) 18 (1) THD = 30%. (2) THD = 10%. (3) THD = 0.5%. Fig.9 Output power as a function of supply voltage; f = 1 kHz; RL = 2 Ω. MGA906 Po (W) 10 102 103 104 f (Hz) 105 Fig.10 Output power as a function of frequency; THD = 0.5%; VP = 14.4 V; RL = 2 Ω. 1996 Jan 08 12, MGA907

THD

(%) (1) 10 1 (2) (3) 10 2 10 102 103 104 f (Hz) 105 (1) Po = 0.1 W. (2) Po = 1 W. (3) Po = 10 W. Fig.11 Total harmonic distortion as a function of frequency; VP = 14.4 V; RL = 2 Ω. MGA908

SVRR

(dB) (1) (2) 10 102 103 104 f (Hz) 105 (1) On condition. (2) Mute condition. Fig.12 Ripple rejection as a function of frequency; VP = 14.4 V; Vripple = 2 V (p-p); Rs = 0 Ω. 1996 Jan 08 13, MGA910 α cs (dB) 10 102 103 104 f (Hz) 105 Fig.13 Channel separation as a function of frequency; VP = 14.4 V; Po = 25 W; RL = 2 Ω; Rs = 10 kΩ. MGA909 handbook, full pagewidth Iq (mA) 8 10 12 14 16 VP (V) 18 Fig.14 Quiescent current as a function of supply voltage; RL = ∞. 1996 Jan 08 14, PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave x Dh

D

Eh view B: mounting base side d A2

B

j E

A

L3LQc113 Z e1wMme2vMbpe0510 mm scale DIMENSIONS (mm are the original dimensions) UNITAAbcD(1) d D E(1) (1)2phee1e2EhjLL3mQvwxZmm 17.0 4.6 0.75 0.48 24.0 20.0 10 12.2 3.4 1.7 5.08 6 3.4 12.4 2.4 2.1 0.8 2.00 15.5 4.2 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 4.3 0.25 0.031.8 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION PROJECTION ISSUE DATE IEC JEDEC EIAJ 92-11-17 SOT141-6 95-03-11 1996 Jan 08 15, SOLDERING The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the Introduction specified maximum storage temperature (Tstg max). If the There is no soldering method that is ideal for all IC printed-circuit board has been pre-heated, forced cooling packages. Wave soldering is often preferred when may be necessary immediately after soldering to keep the through-hole and surface mounted components are mixed temperature within the permissible limit. on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for Repairing soldered joints printed-circuits with high population densities. In these Apply a low voltage soldering iron (less than 24 V) to the situations reflow soldering is often used. lead(s) of the package, below the seating plane or not This text gives a very brief insight to a complex technology. more than 2 mm above it. If the temperature of the A more in-depth account of soldering ICs can be found in soldering iron bit is less than 300 °C it may remain in our “IC Package Databook” (order code 9398 652 90011). contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jan 08 16]

15