Download: Disassembly and Assembly Instructions
Disassembly and Assembly Instructions 11-1. Disassembly121) Remove screws at 6 points. 1) Disassemble left and right of REAR locking part *Caution! using tool.(2 points) Be careful not to make scratch and molding damage . 3 4 1) Disassemble up and down of REAR locking part using tool.(2 points) 1) Disassemble REAR. by lifting it from FRONT ASS'Y. Be careful not to make scratch and molding damage! 11-1561) Detach SIDE FPCB from LCD BRACKET 1) Remove screws at 2 points. 2) Hold up SUB BOARD and Detach SUB *Caution! CONNECTOR from MAIN BOARD Be careful not to make scratch and molding damage *Ca...
Author:
Richard Shared: 7/30/19
Downloads: 752 Views: 1622
Content
Disassembly and Assembly Instructions 11-1. Disassembly121) Remove screws at 6 points. 1) Disassemble left and right of REAR locking part *Caution! using tool.(2 points) Be careful not to make scratch and molding damage . 3 4 1) Disassemble up and down of REAR locking part using tool.(2 points) 1) Disassemble REAR. by lifting it from FRONT ASS'Y. Be careful not to make scratch and molding damage! 11-1, 5 6 1) Detach SIDE FPCB from LCD BRACKET 1) Remove screws at 2 points. 2) Hold up SUB BOARD and Detach SUB *Caution! CONNECTOR from MAIN BOARD Be careful not to make scratch and molding damage *Caution! Be careful to not to tear the FPCB. 7 8 1) Detach LCD FPCB, CAMERA FPCB, AND COAXIAL 1) Hold up MAIN BOARD and Detach KEY FPCB CABLE from MAIN BOARD CONNECTOR from MAIN BOARD Be careful to not to tear the FPCB. Be careful to not to tear the Slide FPCB. 11-2, 9 10 1) Detach TSP FPCB from LCD. 1) Disassemble LCD ASS'Y by twisit the hook from 2) Disassemble INTENNA from FRONT. FRONT ASS'Y. *Caution! Be careful to not to tear the TSP FPCB. *Caution! Be careful to not to tear the FPCB 11 12 1) Hold up LCD HOOK 4 POINTS and Detach LCD 1) Hold up LCD MODULE from LCD BRACKET
MODULE
2) Remove screws at 2 points. *Caution! Be careful to not to tear the LCD FPCB 11-3, 11-2. Assembly121) Assemble LCD BRACKET + KEY FPCB. 1) CHECK LCD BRACKET and KEY FPCB. 3 4 1) Insert LCD FPCB at LCD BRACKET hole 1) Attach BLACK SHEET and attach LCD MODULE. 2) Attach MOTOR and SIDE FPCB *Caution! Be careful to not to tear the LCD FPCB. 11-4, 56②①③1) Hold up MAIN BOARD and Attach KEY FPCB 1) Assemble LCD ASS'Y by pressing 5 points hook CONNECTOR to MAIN BOARD from the FRONT. 2) Attach LCD FPCB, CAMERA FPCB, AND COAXIAL *Caution! Be careful to not to tear the LCD FPCB. CABLE to MAIN BOARD 1) Hold up SUB BOARD and Attach SUB 1) Drive Screws at 2 points with torque CONNECTOR to MAIN BOARD 1.3 +/- 0.1 Kgf/㎠. 2) Attach SLIDE FPCB to LCD BRACKET. 11-5, 9 10 1) Drive Screws at 6 points with torque 1.3 +/- 0.1 Kgf/㎠. 1) Assemble REAR. to FRONT ASS'Y *Caution! Be careful not to make scratch and molding damage 11-6]15
Similar documents

UMTS TELEPHONE SGH-M310 UMTS TELEPHONE CONTENTS 1. Safety Precautions 2. Specification 3. Product Function 4. Array course control 5. Exploded View and Parts list 6. MAIN Electrical Parts List 7. Disassembly and Assembly Instructions 8. Block Diagrams 9. PCB Diagrams 10. Chart of Troubleshooting 11.

GSM TELEPHONE SGH-U100 GSM TELEPHONE CONTENTS 1. Specification 2. Exploded View and Parts list 3. Chart of Troubleshooting 4. Array course control 5. Block Diagrams 6. PCB Diagrams 7. MAIN Electrical Parts List 8. Reference data 9. Safety Precautions 10. Product Function Contents 1. Specification 1-

GSM TELEPHONE SGH-U600 GSM TELEPHONE CONTENTS 1. Specification 2. Exploded View and Parts list 3. Chart of Troubleshooting 4. Array course control 5. Block Diagrams 6. PCB Diagrams 7. MAIN Electrical Parts List 8. Reference data 9. Safety Precautions 10. Product Function Contents 1. Specification 1-

GSM TELEPHONE SGH-U700 GSM TELEPHONE CONTENTS 1. Specification 2. Exploded View and Parts list 3. Chart of Troubleshooting 4. Array course control 5. Block Diagrams 6. PCB Diagrams 7. MAIN Electrical Parts List 8. Reference data 9. Safety Precautions 10. Product Function Contents 1. Specification 1-

TDA7294 100V - 100W DMOS AUDIO AMPLIFIER WITH MUTE/ST-BY VERY HIGH OPERATING VOLTAGE RANGE (±40V) MULTIPOWER BCD TECHNOLOGY DMOS POWER STAGE HIGH OUTPUT POWER (UP TO 100W MU- SIC POWER) MUTING/STAND-BY FUNCTIONS NO SWITCH ON/OFF NOISE NO BOUCHEROT CELLS VERY LOW DISTORTION Multiwatt15 VERY LOW NOISE

SYNCHRONOUS 64K x 32 SRAM BURST SRAM +3.3V SUPPLY, PIPELINED, SINGLE PIPELINED OUTPUT CYCLE DESELECT, BURST COUNTER FEATURES GENERAL DESCRIPTIO N • Fast access times: 5, 6, 7, and 8ns The Galvantech Synchronous Burst SRAM family • Fast clock speed: 100, 83, and 66 MHz employs high-speed, low power C

Features • Compatible with MCS-51 Products • 2 Kbytes of Reprogrammable Flash Memory Endurance: 1,000 Write/Erase Cycles • 2.7 V to6VOperating Range • Fully Static Operation: 0 Hz to 24 MHz • Two-Level Program Memory Lock • 128 x 8-Bit Internal RAM • 15 Programmable I/O Lines • Two 16-Bit Timer/Coun

Features • Compatible with MCS-51 Products • 4 Kbytes of In-System Reprogrammable Flash Memory Endurance: 1,000 Write/Erase Cycles • Fully Static Operation: 0 Hz to 24 MHz • Three-Level Program Memory Lock • 128 x 8-Bit Internal RAM • 32 Programmable I/O Lines • Two 16-Bit Timer/Counters • Six Inter

Features • Compatible with MCS-51™ Products • 4K Bytes of Reprogrammable Flash Memory - Endurance: 1,000 Write/Erase Cycles • 2.7V to 6V Operating Range • Fully Static Operation: 0 Hz to 12 MHz • Three-Level Program Memory Lock • 128 x 8-Bit Internal RAM • 32 Programmable I/O Lines • Two 16-Bit Time

Multi-layer ceramic chip capacitors MCH15 (1005 (0402) size, chip capacitor) !Features !External dimensions (Units : mm) 1) Small size (1.0 x 0.5 x 0.5 mm) makes it perfect for lightweight portable devices. 2) Comes packed either in tape to enable automatic mounting or in bulk cases. 3) Precise unif

Multi-layer ceramic chip capacitors MCH18 (1608 (0603) size, chip capacitor) !Features !External dimensions (Units : mm) 1) Small size (1.6 x 0.8 x 0.8 mm) makes it perfect for lightweight portable devices. 2) Comes packed either in tape to enable automatic mounting or in bulk cases. 3) Barrier laye

Packaging Surface-mount type Package Code packaging direction Basic ordering specification unit TL Embossed tape Pin 1 is nearest to the sprocket hole. 13000 pcs EMT3 TBL Embossed tape Pin 1 is nearest to the sprocket hole. 15000 pcs T106 Embossed tape Pin 1 is nearest to the sprocket hole. 13000 pc

HITACHI RF Wireless Products for Mobile Communications Hitachi RF Solutions • Developed using Advanced Technologies MOSFET, HEMT, BiCMOS, Bipolar, SOI, GaAs MESFET, and MMIC • Wide Ra nge of Products Power Amplifiers, RF Integration Blocks, UpConverters, Down Converter, High Power MOSFET for PA, Pha

Overview of RF/Wireless ICs RF Power Amplifier Module Nomenclature Hitachi offers silicon solutions for international wireless communication standards, including cellular AMPS, CDPD, ETACS, IS.136 TDMA and GSM. To enable our customers to produce PF XXXXX X - XX innovative wireless designs, we provid

RF/Wireless Products Description Hitachi offers superior RF solu- management switches, LCD con- • PF1411B: 900MHz Cellular tions for a variety of wireless trollers/ drivers, and memory prod- GSM power module, 3.5V, communication standards, includ- ucts (SRAM, Flash devices and high efficiency ing AM

Tantalum capacitors Chip tantalum capacitors with built–in open–function TCFG series Semiconductor manufacturing technology has been used to include a temperature fuse in TCFG series capacitors. These capacitors feature low impedance and are ideal for digital circuits and low–voltage circuits in por

19-1463; Rev 0; 5/99 KIT MAN UAL EVALUA TION EET LOWS D ATA SH FOL +3.6V, 1W Autoramping Power General Description Features The MAX2235 low-voltage, silicon RF power amplifier ♦ 800MHz to 1000MHz Operation (PA) is designed for use in the 900MHz frequency band. It operates directly from a single +2.7

19-4797; Rev 0; 2/99 MANUA L ION KIT EVALUA T DATA SH EET FOLLOW S General Description Features The MAX2470/MAX2471 are flexible, low-cost, high- ♦ +2.7V to +5.5V Supply Range reverse-isolation buffer amplifiers for applications with discrete and module-based VCO designs. Both feature ♦ Input Freque

19-1384; Rev 1; 2/99 KIT EVALUA TION DATA S HEET FOLLOW S 400MHz to 2500MHz SiGe General Description Features The MAX2640/MAX2641 are low-cost, ultra-low-noise ♦ Wide Operating Frequency Range amplifiers designed for applications in the cellular, PCS, MAX2640: 400MHz to 1500MHz GPS, and 2.4GHz ISM f

Technical Note UHF BAND GaAs POWER AMPLIFIER Specifications are subject to change without notice. DESCRIPTION PIN CONFIGURATION (TOP VIEW) MGF7168C is a monolithic microwave integrated circuit for use in UHF-band power amplifier. FEATURES Pi GND - Low voltage operation Vg1 Vd=3.2V - High output powe

Gerstweg 2, 6534 AE Nijmegen, The Netherlands Report nr. : RNR-T45-97-B-0920 Author : T.F. Buss Date : 20-11-97 Department : P.G. Transistors & Diodes, Development 400MHz LOW NOISE AMPLIFIER WITH THE BFG540W/X Abstract: This application note contains an example of a Low Noise Amplifier with the BFG5