Download: DIGITAL CAMERA SDC-80 SERVICE Manual

SERVICE MANUAL SDC-80 DIGITAL CAMERA SDC-80 SERVICE Manual DIGITAL CAMERA CONTENTS 1. Introduction 2. Specifications 3. Disassembly and Reassembly 4. Exploded View and Parts List 5. Adjustment 6. Electrical Parts List 7. PCB Diagrams 8. Wiring Diagram 9. Schematic Diagrams © Samsung Electronics Co.,Ltd. Jan. 2000 Printed in Korea AD68-00079L UPDATE LOG SHEET Application Data Page Part # Note(Cause & Solution) S/Bulletin # Use this page to keep any special servicing information. (Service Bulletin, etc.) If only parts number changes, Just change parts number directly on parts list. And if you ne...
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SERVICE MANUAL SDC-80

DIGITAL CAMERA SDC-80 SERVICE Manual

DIGITAL CAMERA CONTENTS 1. Introduction 2. Specifications 3. Disassembly and Reassembly 4. Exploded View and Parts List 5. Adjustment 6. Electrical Parts List 7. PCB Diagrams 8. Wiring Diagram 9. Schematic Diagrams © Samsung Electronics Co.,Ltd. Jan. 2000 Printed in Korea AD68-00079L,

UPDATE LOG SHEET

Application Data Page Part # Note(Cause & Solution) S/Bulletin # Use this page to keep any special servicing information. (Service Bulletin, etc.) If only parts number changes, Just change parts number directly on parts list. And if you need more information, please see the service bulletin, 1. Introduction 1-1. Camera Adjustment Program 1-1-1. About the Program The program is to adjust a camera and diagnose a fault when the unit is serviced. The program isn't provid- ed for customers and only service center to check the camera setting without disassembling and read/mod- ify the camera control value. Some functions not required in service center aren't used. 1. Provision for program The program isn't provided with the additional disc and must be downloaded from Single. 2. System Requirements 1. IBM compatible PC (pentium standard) 2. Windows 95 & Mouse 3. Video Card supported more than 256 color 4. 5MB Hard disk space 3. Program Functions 1. SSFDC(SMART MEDIA) FORMAT, DELETE ALL 2. FUNCTION KEY TEST 3. LCD PIXEL TEST 4. LOGO TEST 5. CONTROL LED TEST, LCD PANEL TEST 6. MACRO MODE CHECK, VIDEO JACK TEST, STROBO (FLASH) JACK CHECK 7. OSD (ON SCREEN DISPLAY) OFF 8. PC SHOT, SELF TIMER SHOT 9. AE ADJUSTMENT 10. 3100K, 5100K WHITE BALANCE ADJUSTMENT 11. JPEG, THUMBNAIL DOWN LOAD 12. BACK FOCUS ADJUSTMENT MODE 13. POWER CONSTANT ON 14. RS-232C CHANGER TEST 15. NTST, PAL CONVERT ADJUSTMENT 4.Installing Program 1. Unzip the Dscstudi.zip file downloaded from Single in a folder. 2. Execute the Setup.exe file in the unzipped files. 3. Install as dialog box's message. 4. After completing the installation, check to run the DSCStudio.exe file in the folder where program is installed. * Generally, it is created in C:\Program files\Samsung\DSCStudio. Samsung Electronics 1-1, Introduction 1-1-2. DSCStudio Description • Program start : Turn on PC for Windows Connect PC with camera Power on camera Execute DSCStudio.exe in Windows Start DSC Set up Communication studio. port and communication speed.(see Figure 4) (Figure 1) Initial screen dialog box (Figure 2) Choice screen dialog box

TAP

(Figure 3) Basic communication dialog box About TAP : • Camera Adjustment I : (see Figure 5) •Camera Adjustment II : (see Figure 6) • View Graphic File : (see Figure 7) •Test Options : (see Figure 8) • PGM for Manufacturing : (see Figure 9) 1-2 Samsung Electronics, Introduction (Figure 5) Camera Adjustment I • Describe the relevant things only in (Figure 4). 1. In the DCAM_PARAMETER, the DTL_Glain value is used for HeXa value. For instance, if DTL_Gain=2631720 is translated into HeXa, it means 0x282828. So y=0x28, Cr=0x28 and Cb=0x28. 2. In the LCD_Control, the settings are EVR value and also affect LCD output. 3. The Color Bar ON/OFF option can be used to display color bar with LCD and VIDEO OUT. 4. The Update option can be used to write the currently displayed number with EEPROM. 5. The Restore option can be used to restore to the first loaded value (EEPROM value before updating). 6. The Format option can be used to write the EEPROM default value saved in dscdtuio007.ini. of the window folder. ("0xff" is the initially empty EEPROM value.) Note) The Format is similar to the Format with LCD option without LCD control value. 7. The Reload option can be used to display the currently recorded EEPROM value on the screen. *Note - The model set value is 007 in the PGM mode. However, error occurred when 80 sets are connected to adjust. - Make sure that the testing model is the same with the running model in program. 1-4 Samsung Electronics, Introduction (Figure 7) View Graphic File • The JPEG image can be displayed without any image edit program. 1. Click the Open button to display the file saved as a JPEG format. 2. Click the Slid Show button to display the file containing in the option at an specified interval. 1-6 Samsung Electronics, Introduction 11.Black Level Adj: 12.AE Adjustment: Adjust the Hall value automatically. 13.3100K W/B test : Set 3100K(incandescent light temperature) white balance. 14.5100K W/B test : Set 5100K(fluorescent light temperature) white balance. 15.Thumbnail Down load : Transfer thumbnail image in the smart media card into PC. 16.JPEG Down Load : Transfer image in the smart media card into PC. 17.Shot 0: Function SHUTTER in camera photo mode. 18.Shot 0: Function SHUTTER in camera photo mode. 19.Shot 0: Function SHUTTER in camera photo mode. (Figure 9) PGM for Manufacturing • Run the PI program. The settings of the Test Options (see Figure 7) are applied as a sequence. Click the START button to run. The edit function is enabled when Vs appear in the check boxes of Enable Scroll Inspect Item Window and Enable Scroll Information Window. 1-8 Samsung Electronics, 2. Specifications System Specifications CCD Progressive 0.85M pixel Number of pixels 1024 x 768 pixel (XGA) Color Depth 24 bits True Color Memory capacity Extra (smart media card 4MB/3.3V) Image Capacity Standard (quality-about 20/high quality-about 10) Lens Dual fixed focus F:2.8f = 6.6 Focus Length Normal (50cm ~ ) Macro (5 ~ 50cm) View Finder OVF (optical view finder) & color LCD Shutter Speed Electric Shutter (1/8 ~ 1/2000) Exposure Auto / Manual White Balance Auto Video Out Both NTSC type & PAL type Power Source 5.0V:A type battery, 3.6V:Li-ion charger PC Interface Serial Transmission (RS 232C : Max 115.2kbps) Compression Standard JPEG Support O/S MS-Windows 95, 98 S/W CD-Rom (TWAIN Driver, iPhotoExpress) Dimensions 102 x 75 x 40 (Length x Height x Width) Net Weigh Less than 199g (not including battery pack) Standard Shooting Full Size Shooting : 1152 x 864 (SQ/HQ) Basic Shooting Mode General Shooting VGA Size Shooting : 640 x 480 (SQ/HQ) B/W Shooting Full Size B/W : 1152 x 854 (SQ/HQ) Full Size Division : 1152x 864 (SQ/HQ) Multi Shooting Special Shooting - 4 ~ 16 Images Division Mode Continuous VGA Size continuation : 640 x 480 (SQ/HQ) Shooting - 3 ~ 6 Images Division Normal Playback One Image at a time, full size playback Magnified Playback 4 times magnified playback by parts Play Mode Multi Playback 6 images-divided multi playback Automatic Playback Automatic interval playback Selective Erase Erase selected images among divided images Erase Mode Full Erase Erase all the memories Erase Prevention Prevent accidental erase of precious images Setting Mode Menu bar type control for each status Transmission Mode PC interfacing only mode - Direct interfacing mode Others - Manual adjust mode : adjusting exposure - Navigation key control : 4-direction movement and selection ✤ The technical specifications and design may be changed without notice. Samsung Electronics 2-1, Specifications

MEMO

2-2 Samsung Electronics, 3. Disassembly and Reassembly 3-1. Cabinet Disassembly 3-1-1. Ass’y CASE-TOP Removal Remove the INLAY. Remove the CASE-TOP. Remove 2 screws. Remove 1 screw. Remove the INLAY. Fig. 3-1 Ass’y CASE-TOP Removal Samsung Electronics 3-1, Disassemblr and Reassembly 3-1-2. Ass’y CASE-BOTTOM Removal Remove the CASE-BOTTOM. Remove 1 screw. Remove 3 screws. Fig. 3-2 Ass’y CASE-BOTTOM Removal 3-2 Samsung Electronics, Disassemblr and Reassembly 3-1-4. Ass’y CASE-FRONT Removal Remove 2 screws. Remove the CASE-FRONT. * Be careful to assemble MACRO-LEVER with LENS-MACRO when assembling the case-front. Fig. 3-4 Ass’y CASE-FRONT Removal 3-4 Samsung Electronics, Disassemblr and Reassembly 3-1-6. Ass’y MAIN Removal Remove the ASSY-MAIN. Remove the 3screws. Remove the FPC-MAIN from MAIN-PCB. Fig. 3-6 Ass’y MAIN Removal 3-6 Samsung Electronics, Disassemblr and Reassembly 3-3. Connector Diagrams ¡¨BATT + ¡¨ ¡¨BATT - ¡¨

Fig. 3-9 Connector Diagrams

NO. CONNECTOR DIRECTION CONNECTOR NO. 1 CN02 MAIN BOARD DC-BOARD CNP0321CN02 MAIN BOARD JACK BOARD CNJ0234CN03 MAIN BOARD ASSY-LENS LENS-FPC 5 10 CN05 MAIN BOARD REAR BOARD CNB01 11 12 CN04 MAIN BOARD FUNT-BOARD CNF01 13 14 CNL01 MAIN BOARD TFT-LCD LCD-FPC 15 16 CNF03 FUNT-BOARD ASSY-STROBO STROBO 6 CNP02 DC-BOARD JACK-BOARD CNJ0396CNP02 DC-BOARD BATTERY +, - BATTERY786CNB02 REAR-BOARD LCD-B/L HBL 18 3-8 Samsung Electronics, 4. Exploded View and Parts List 4-1. Cabinet Assembly 4-2 4-2. Parts List 4-3 Samsung Electronics 4-1,

Exploded View and Parts List

4-1 Cabinet Assembly 303 304 308 309 702 703 207 200 800 105 208 700 205 701 204 504 702 105 701 701 505701 610 600201 203 506202 701503 607 705 701 606 702 702 702 508 604 501 603 602 605 400 608 106 403 105 401 700 104 402 102 100 701 4-2 Samsung Electronics, Exploded View and Parts List Loc. No New Part No Description and Specification Remark Remark 505 AD64-00139A DOOR-LOCK;-,POM WHT,-,-,-,-,-,SDC-X80 506 AD61-00176A SPRING-DOOR BATT;-,SUS T=0.3,-,-,-,-,-,- 507 AD61-00174A HOLDER-BATT,R;-,ABS,-,-,-,SDC-X80 508 AD97-01067A ASSY-DC/DC BOARD;SDC-80,-,ASSY -DC/DC B 600 AD97-01065A ASSY-MAIN BOARD;SDC-80,-,ASSY -MAIN BOA 601 AD66-30597A LEVER-MACRO;-,ABS,HB,-,-,SDC-007 602 AD29-00003A FILTER-OLP;-,OG-BF458,O.L.P.F,-,-,TR 603 AD73-00016A RUBBER-CCD;SILICON,-,SDC-X80,- 604 AD61-00175A PLATE-CCD;-,AL PLATE T=0.8,-,-,SDC-X80 605 AD99-40009U ASSY-MAIN BOARD,c;SDC-X80,-,ASSY -MAIN B 606 AD63-00122A SHIELD-SUB;-,PBS T0.15,-,-,SDC-80 607 AD97-01702A ASSY-SHIELD CASE MAIN;SDC-80,-,- 608 AD97-00315A ASSY—DSC-LENS;SDC-007,ASSY,PANFOCUS 609 AD97-01472A ASSY-FPC MAIN;SDC-80,FPC MAIN,40*26*T0.6 610 AD41-00097A FFC—FUNC,22PIN;FLATCABLE,0.3,22,SDC-80 700 6002-001094 SCREW-TAPPING;CH(0.5),+,B,M1.7,L3.5,NI P 701 AC60-12128B SCREW-TAPTITE;-,BH,-,TAP,1.7,4,- 702 AD60-00014A SCREW-MACHINE;-,-,-,-,-,-,-,-,WHT 703 6001-001288 SCREW-MACHINE;CH(0.5),+,M1.7,L6.0,NI PLT 704 AC60-10024A SCREW-MACHINE;BH,+,M2,X3,FZW,FE,-,-,- 705 AH60-10112A SCREW-TAPTITE;PH,+,M2,L5,SN1,-,YEL 800 AD97-01491A ASSY-OVF-LENS;SDC-80,ASSY,- 4-4, 5. Adjustment 5-1. Camera Adjustment 5-1-1. Focus Adjustment • Adjusting in the Photo Mode 1. Connect the camera and TV to video output cable. Turn on the power and set to the PC mode. 2. Aim the Main board at the focus chart placed 2.5 meters away and perpendicular to the center of the lens. 3. Loose a fixing screw lightly positioned in front of a lever in the state of pulling back macro lever toward °ƒ (counterclockwise at the front). 4. Turn the focus adjusting lever until a lever is in focus through the TV screen (not to move the macro lever). 5. Tighten the fixing screw when the lever is in focus. * In the Photo mode, the state of the focus may be difficult to check. If it isn’t, you can adjust in Resume mode or with program for adjustment after taking a photograph. Fixing screw Focus Adjusting Lever 2.5 m

LENS

MAIN BOARD FOCUS CHART (Focus Adjustment) (Lens & Lever Position) • Adjusting with Program for Adjustment * If the program for adjustment is used, the 3 times magnified screen allows you exactly to adjust camera. 1. Connect the camera to TV and PC with video output cable and PC connecting cable. Turn on the power and set to the PC mode. 2. Aim the Main board at the focus chart placed 2.5 meters away and perpendicular to the center of the lens. 3. After running the program for adjustment on the PC to click the Focus Mode On button in the Camera Adjustment mode. 4. Repeat step 3 through 5 of “Adjusting in the Photo Mode”. 5. Click the Focus Mode On button and finish the program for adjustment. Samsung Electronics 5-1, Adjustment 5-1-2. MCLK Adjustment 1. Turn on camera power and set to Photo mode. 2. One adjustment point is TP1-MCLK. Adjust using CT301. 3. Connect probe of frequency counter with TP1. 4. Using CT301, adjust it so that MCLK is 54.00MHz+00Hz. (External view of PCB :Main Board component side) 5-1-3. Program for Adjustment 5-2 Samsung Electronics, Adjustment 5-2-3. Adjustment 1. PD 1) TPL6-OSC & OSC mode 2) - Connect the probe of oscilloscope to TPL-OSC. - Press the UP/DOWN button or the number buttons so that the A is 2.0µs ± 0.2µs (when NTSC). 3) Using the UPDATE button, store the adjusted value in the EEPROM. * Using OSC or CSHD, adjust the trigger. 2. BRIGHTNESS 1) TPL2-VG & RGB-AMP mode PD wave form 2) - Connect the probe of oscilloscope to TPL2-VG. - Press the UP/DOWN button or the number buttons so that the B level (between blacks) is 3.5 ± 0.1Vp-p. 3) Using the UPDATE button, store the adjusted value in the EEPROM. * Using FRP(or use No. 2 - 7 alignment wave form in common), adjust the trigger. 3. CONTRAST 1) TPL2-VG & CONTRAST mode 2) - Connect probe of oscilloscope to TPL2-VG. - Press the UP/DOWN button or the number buttons so that the C level (between black and white) is 3.0 ± 0.1Vp-p. 3) Using the UPDATE button, store the adjusted value in the EEPROM. BRIGHT wave form 4. R-BRIGHT 1) TP3-VR & R-BRT mode (Bright wave form) 2) - Connect the probe of oscilloscope to TP3-VR. - Press the UP/DOWN button or the number buttons so that the B level (between pedestals) is 3.5 ± 0.1Vp-p. 3) Using the UPDATE button, store the adjusted value in the EEPROM. 5. R-CONTRAST 1) TPL3-VR & R-CONT mode (Contrast wave form) 2) - Connect the probe of oscilloscope to TPL3-VR. - Press the UP/DOWN button or the number buttons so that the C level is 3.0 ± 0.1Vp-p. 3) Using the UPDATE button, store the adjusted value in the EEPROM. 6. B-BRIGHT CONTRAST wave form 1) TPL1-VB & B-BRT mode (Bright wave form) 2) - Connect the probe of oscilloscope to TPL1-VB. - Press the UP/DOWN button or the number buttons so that the B level is 3.5 ± 0.1Vp-p. 3) Using the UPDATE button, store the adjusted value in the EEPROM. 5-4 Samsung Electronics, Adjustment

MEMO

5-6 Samsung Electronics,

Electrical Parts List

6. Electrical Parts List Loc. No Part No Desc & Spec Remark Loc. No Part No Desc & Spec Remark AD97-01065A ASSY-MAIN BOARD C15 2203-000998 C-CERAMIC,CHIP;0.047nF,5%,50V,NP0,TP,160 B03 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C16 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 B04 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C17 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, B05 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C18 2404-000151 C-TA,CHIP;1uF,20%,16V,-,TP,3216,- B06 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C19 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, B07 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C211 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, B08 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, B09 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C31 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, B10 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C32 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 B11 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C33 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, B12 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C34 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- B13 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C41 2203-002793 C-CERAMIC,CHIP;1000nF,+80-20%,25V,Y5V,TP B14 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C42 2203-002793 C-CERAMIC,CHIP;1000nF,+80-20%,25V,Y5V,TP B15 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C43 2203-002793 C-CERAMIC,CHIP;1000nF,+80-20%,25V,Y5V,TP B17 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C44 2203-002793 C-CERAMIC,CHIP;1000nF,+80-20%,25V,Y5V,TP B19 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- REV.03change C47 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, B20 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C48 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, B21 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C51 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 B23 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C52 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 B25 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C53 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, BD41 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C54 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, BD42 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C60 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, BD61 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- C61 2203-001598 C-CERAMIC,CHIP;2200nF,+80-20%,16V,Y5V,TP C01 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C64 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- C02 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C65 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- C03 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C66 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- C04 2203-000681 C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160 C67 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C05 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 C68 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 C051 2203-000681 C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160 C69 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C06 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C71 2203-000357 C-CERAMIC,CHIP;0.15nF,5%,50V,NP0,TP,1608 C07 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C72 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 C08 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C73 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 C09 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- C74 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP, C10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C75 2203-001634 C-CERAMIC,CHIP;33nF,10%,50V,X7R,TP,1608, C12 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C81 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608

Samsung Electronics 6-1

,

Electrical Parts List

Loc. No Part No Desc & Spec Remark Loc. No Part No Desc & Spec Remark C82 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD37 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C83 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 CD38 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608 C84 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD39 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, C98 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP, CD40 2404-000156 C-TA,CHIP;1uF,20%,35V,-,TP,3528,1.4mm CD01 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CD42 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CD02 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 CL01 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD04 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 CL02 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD05 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL03 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD06 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL04 2203-000888 C-CERAMIC,CHIP;4.7nF,10%,50V,X7R,TP,1608 CD07 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL05 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CD08 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- CL06 2404-000151 C-TA,CHIP;1uF,20%,16V,-,TP,3216,- CD09 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- CL07 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL08 2203-001140 C-CERAMIC,CHIP;68nF,10%,16V,X7R,TP,1608, CD11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL09 2203-001140 C-CERAMIC,CHIP;68nF,10%,16V,X7R,TP,1608, CD12 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL10 2203-001140 C-CERAMIC,CHIP;68nF,10%,16V,X7R,TP,1608, CD13 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CD14 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL12 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 CD15 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL13 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 CD16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL16 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD17 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL17 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD18 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL18 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD21 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, CL19 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD22 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, CL20 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD23 2203-000041 C-CERAMIC,CHIP;0.01nF,0.25pF,50V,NP0,TP, CL21 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD24 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CL22 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD25 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL23 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD26 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL24 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD27 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 CL25 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD28 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL26 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 CD31 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL51 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CD32 2404-000212 C-TA,CHIP;3.3uF,20%,25V,-,TP,3528,- CL52 2404-000151 C-TA,CHIP;1uF,20%,16V,-,TP,3216,- CD33 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL53 2203-002605 C-CERAMIC,CHIP;0.008nF,0.25pF,50V,NP0,TP CD34 2404-000238 C-TA,CHIP;4.7uF,20%,20V,-,TP,3528,- CL54 2404-000151 C-TA,CHIP;1uF,20%,16V,-,TP,3216,- CD35 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL55 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CD36 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, CL56 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 6-2 Samsung Electronics,

Electrical Parts List

Loc. No Part No Desc & Spec Remark Loc. No Part No Desc & Spec Remark L71 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R09 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 LD01 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R10 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608 LD02 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R11 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608 LD21 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R13 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 LD31 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R14 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 LD32 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R15 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 LL01 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R16 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 LL02 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R161 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 LL61 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R17 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 LL62 2703-000425 INDUCTOR-SMD;27uH,5%,2x2.5x1.8mm R18 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 LL81 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R19 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608 LL82 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R20 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 LL83 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R21 2007-000309 R-CHIP;10ohm,5%,1/16W,DA,TP,1608 LM01 2703-000402 INDUCTOR-SMD;1uH,20%,3.2x2.5x2.2mm R22 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608 LM02 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm R23 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 Q01 0501-000218 TR-SMALL SIGNAL;2SC4081,NPN,200mW,UMT,TP R25 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 Q02 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- R26 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 Q41 0504-001035 TR-DIGITAL;KRA301,PNP,100mW,4.7K/4.7Kohm R29 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 Q42 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- R30 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 Q61 0504-001035 TR-DIGITAL;KRA301,PNP,100mW,4.7K/4.7Kohm R32 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 Q62 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- R33 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 Q99 0501-000218 TR-SMALL SIGNAL;2SC4081,NPN,200mW,UMT,TP R34 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 QD31 0505-000180 FET-SILICON;2SK1070PIETR,-,150MW,SOT R35 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 QL01 0501-000218 TR-SMALL SIGNAL;2SC4081,NPN,200mW,UMT,TP R36 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 QL71 0501-000218 TR-SMALL SIGNAL;2SC4081,NPN,200mW,UMT,TP R37 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 QL81 0501-000218 TR-SMALL SIGNAL;2SC4081,NPN,200mW,UMT,TP R38 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 QL82 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- R39 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R01 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R40 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R02 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R51 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 R03 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 R52 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 R04 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 R53 2007-000063 R-CHIP;150Kohm,1%,1/16W,DA,TP,1608 R05 2007-000643 R-CHIP;270ohm,5%,1/16W,DA,TP,1608 R54 2007-001125 R-CHIP;68Kohm,1%,1/16W,DA,TP,1608 R06 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608 R55 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R07 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 R56 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R08 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 R61 2007-000402 R-CHIP;150ohm,5%,1/16W,DA,TP,1608 6-4 Samsung Electronics,

Electrical Parts List

Loc. No Part No Desc & Spec Remark Loc. No Part No Desc & Spec Remark RL28 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 RL75 2007-000450 R-CHIP;180ohm,5%,1/16W,DA,TP,1608 RL29 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 RL81 2007-000125 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608 RL30 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 RL82 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 RL31 2007-000616 R-CHIP;24Kohm,5%,1/16W,DA,TP,1608 RL83 2007-000130 R-CHIP;39Kohm,5%,1/16W,DA,TP,1608 RL32 2007-000098 R-CHIP;56Kohm,5%,1/16W,DA,TP,1608 RL84 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 RL33 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 RL85 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RL34 2007-000086 R-CHIP;5.6Kohm,5%,1/16W,DA,TP,1608 RL91 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RL35 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608 RM01 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 RL36 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 RM03 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RL37 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 RM04 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RL38 2007-000100 R-CHIP;68Kohm,5%,1/16W,DA,TP,1608 RM05 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RL39 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 RM06 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 RL40 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608 RM08 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RL41 2007-000655 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608 RM09 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 RL52 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 X01 2801-003487 CRYSTAL-SMD;27MHz,30ppm,28-ABL,8.3pF,300 RL53 2007-000094 R-CHIP;22Kohm,5%,1/16W,DA,TP,1608 X02 2801-003696 CRYSTAL-SMD;16.5888MHz,50ppm,28-ABL,12pF RL54 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 FFUN AD41-00097A FFC-FUNC,22PIN;FLATCABLE,0.3,22,SDC-80 RL55 2007-000097 R-CHIP;47Kohm,5%,1/16W,DA,TP,1608 ICD32 0605-001022 CCD;COLOR,DIP,16P,450MIL,800K,4.65 RL56 2007-000772 R-CHIP;33Kohm,1%,1/16W,DA,TP,1608 LENS AD97-00315A ASSY-DSC-LENS;SDC-007,ASSY,PANFOCUS RL57 2007-000063 R-CHIP;150Kohm,1%,1/16W,DA,TP,1608 OLPF AD29-00003A FILTER-OLP;-,OG-BF458,O.L.P.F,-,-,TR RL58 2007-001161 R-CHIP;75Kohm,5%,1/16W,DA,TP,1608 FMAINAD97-01472A ASSY-FPC MAIN;SDC-80,FPC MAIN,40*26*T0.6 RL61 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 AD97-01069A ASSY-REAR BOARD;SDC-80,-,ASSY -REAR BOA RL62 2007-000097 R-CHIP;47Kohm,5%,1/16W,DA,TP,1608 CB01 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 RL63 2007-000100 R-CHIP;68Kohm,5%,1/16W,DA,TP,1608 CB02 2203-001408 C-CERAMIC,CHIP;0.27nF,5%,50V,NP0,TP,1608 RL64 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 CB03 2203-000681 C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160 RL65 2007-000094 R-CHIP;22Kohm,5%,1/16W,DA,TP,1608 CB04 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- RL66 2007-000100 R-CHIP;68Kohm,5%,1/16W,DA,TP,1608 CB041 2203-002793 C-CERAMIC,CHIP;1000nF,+80-20%,25V,Y5V,TP RL67 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608 CB05 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 RL68 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 CB051 2203-002376 C-CERAMIC,CHIP;2200nF,+80-20%,50V,Y5V,TP RL69 2007-000094 R-CHIP;22Kohm,5%,1/16W,DA,TP,1608 CB06 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 RL70 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 CB07 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, RL71 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 CB08 2301-001108 C-FILM,CHIP;22nF,5%,50V,TP,3.2x2.5x1.4,3 RL72 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 CB09 2203-005040 C-CERAMIC,CHIP;0.012nF,5%,3kV,NP0,TP,452 RL73 2007-000118 R-CHIP;390ohm,5%,1/16W,DA,TP,1608 CB10 2203-005040 C-CERAMIC,CHIP;0.012nF,5%,3kV,NP0,TP,452 RL74 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608 CB11 2404-000167 C-TA,CHIP;2.2uF,20%,16V,-,TP,3216,- 6-6 Samsung Electronics,

Electrical Parts List

Loc. No Part No Desc & Spec Remark Loc. No Part No Desc & Spec Remark CP19 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 DP06 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 CP21 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, DP22 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 CP211 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, DP23 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 CP212 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 ICC01 1203-001840 IC-BATTERY;3801,SOP,16P,150MIL,PLASTIC,- CP22 2203-001071 C-CERAMIC,CHIP;0.056nF,5%,50V,NP0,TP,160 ICP01 1203-001844 IC-DC/DC CONVERTER;M62212GP,SSOP,8P,150M CP23 2203-002376 C-CERAMIC,CHIP;2200nF,+80-20%,50V,Y5V,TP ICP21 1203-001844 IC-DC/DC CONVERTER;M62212GP,SSOP,8P,150M CP27 2404-000212 C-TA,CHIP;3.3uF,20%,25V,-,TP,3528,- ICP41 1203-001844 IC-DC/DC CONVERTER;M62212GP,SSOP,8P,150M CP28 2404-000212 C-TA,CHIP;3.3uF,20%,25V,-,TP,3528,- LC02 2703-001871 INDUCTOR-SMD;10UH,20%,6X6X2.8MM CP29 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, LED94 0601-001226 LED;CHIP,RED,1.2x0.8mm,660nm CP30 2404-000238 C-TA,CHIP;4.7uF,20%,20V,-,TP,3528,- LP01 2703-000402 INDUCTOR-SMD;1uH,20%,3.2x2.5x2.2mm CP301 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, LP02 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm CP302 2404-000238 C-TA,CHIP;4.7uF,20%,20V,-,TP,3528,- LP03 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm CP39 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, LP04 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm CP41 2203-001408 C-CERAMIC,CHIP;0.27nF,5%,50V,NP0,TP,1608 LP05 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm CP42 2203-000681 C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160 LP21 2703-000402 INDUCTOR-SMD;1uH,20%,3.2x2.5x2.2mm CP43 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,- LP23 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm CP44 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- LP24 2703-000396 INDUCTOR-SMD;10uH,10%,2.5x2x1.8mm CP441 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 LP42 2703-000414 INDUCTOR-SMD;22uH,20%,7x7x3.2mm CP442 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, LP43 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm CP45 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, LP44 2703-000402 INDUCTOR-SMD;1uH,20%,3.2x2.5x2.2mm CP46 2203-002376 C-CERAMIC,CHIP;2200nF,+80-20%,50V,Y5V,TP LP441 2703-000402 INDUCTOR-SMD;1uH,20%,3.2x2.5x2.2mm CP461 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 PP01 3601-001155 FUSE-SURFACE MOUNT;24V,4A,FAST-ACTING,CE CP47 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- PP02 3601-001155 FUSE-SURFACE MOUNT;24V,4A,FAST-ACTING,CE CP48 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, Q94 0504-000211 TR-DIGITAL;DTC143TU,NPN,200MW,4.7K,SC-70 CP49 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- QC01 0501-000682 TR-SMALL SIGNAL;FP102,PNP,-600MW,PCP4,TP CP50 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, QC02 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- CP51 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- QC04 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- CP52 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, QC05 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- DC01 0404-000150 DIODE-SCHOTTKY;EC10QS04,40V,1A,SMD,TP QC06 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- DC02 0404-000150 DIODE-SCHOTTKY;EC10QS04,40V,1A,SMD,TP QC07 0502-001054 TR-POWER;KSD1621,NPN,500mW,SOT-89,TP,14 DC03 0404-000150 DIODE-SCHOTTKY;EC10QS04,40V,1A,SMD,TP QP01 0504-001035 TR-DIGITAL;KRA301,PNP,100mW,4.7K/4.7Kohm DC11 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 QP011 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- DP03 0404-000144 DIODE-SCHOTTKY;SB01-05CP,50V,100mA,SOT-2 QP02 0502-001054 TR-POWER;KSD1621,NPN,500mW,SOT-89,TP,14 DP04 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 QP21 0504-001035 TR-DIGITAL;KRA301,PNP,100mW,4.7K/4.7Kohm DP05 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 QP211 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- 6-8 Samsung Electronics,

Electrical Parts List

Loc. No Part No Desc & Spec Remark Loc. No Part No Desc & Spec Remark DJ05 0403-001126 DIODE-ZENER;UDZ18D,18V,10%,200mW,UMD2,TP QF34 0504-001032 TR-DIGITAL;KRC404,NPN,100MW,47K/47K,SOT- DJ06 0403-001126 DIODE-ZENER;UDZ18D,18V,10%,200mW,UMD2,TP QF35 0504-001036 TR-DIGITAL;KRA304,PNP,100mW,47K/47Kohm,S DJ07 0403-001126 DIODE-ZENER;UDZ18D,18V,10%,200mW,UMD2,TP RF01 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608 DJ08 0404-000150 DIODE-SCHOTTKY;EC10QS04,40V,1A,SMD,TP RF011 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 RJ01 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RF02 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608 JJ01 3722-000465 JACK-DC POWER;1P/1C,PI4.4,AG,BLK,- RF04 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 JJ02 AD37-20001A JACK-PHONE;HSJ1456-012220,AU RF05 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 JJ03 AD37-20001A JACK-PHONE;HSJ1456-012220,AU RF10 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RF11 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RF12 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 No Loc. No Part No Desc & Spec 1 RS232 AD39-42001C CABLE-RS232C;9P,F,1000mm,PLUG 3.5•’,20m RF13 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 2 VIDEO AD39-40200B CABLE-RCA;DP,RCA(MONO),1000mm,AWG26,BLK, RF14 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 3 SSFDC 1107-001052 IC-FLASH MEMORY;4,4Mx8BIT,PAD,22P,37mm,5 RF15 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 4 STB AD97-01182A ASSY-STROBO;STB-80,STROBO,3.3V RF16 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 5 DISC AD46-00005A DISC-OPTICAL;120mm,PHOTODIO,CD,SDC-80 RF17 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 6 AD69-00104A BAG-SOFT-CASE;SC-C1,POLYESTER+NEOPRENE,- 7 AD69-00105A BAG-STROBO-CASE;SC-C2,POLYESTER+NEOPRENE RF18 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 8 AD66-00036A BELT-HAND GRIP;-,PE,-,-,-,-,SDC-80 RF31 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 9 KIB AD68-00178A MANUAL-USER;SDC-80,-,148,210,DOMESTIC,AR RF32 2007-000643 R-CHIP;270ohm,5%,1/16W,DA,TP,1608 10 ADAP AD44-00024A ADAPTOR;110/220VAC,50/60HZ,5.0VDC,1.0A RF33 2007-000097 R-CHIP;47Kohm,5%,1/16W,DA,TP,1608 11 BPACK AD43-00017A BATTERY PACK;IMP340848-1,3.8V,1000MA,SB- RF35 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 SWF013406-001021 SWITCH-ROTARY;12VDC,100mA,SP9T,NON SWF023404-000143 SWITCH-TACT;12V,50mA,260g,5.2x5.2x1.5mm, CF05 2401-003178 C-EDL;100000uF,-,5.5V,-,TP,10.5x5.5m CNF03AD61-00290A HOLDER-CONNECTOR BOTTOM;-,PBT,-,-,-,SDC- AD97-01068A ASSY-JACK BOARD;SDC-80,-,ASSY -JACK BOA BJ01 AC27-72001A CHIP-FERRITE BEAD;HF50ACB,322513-T,-,-,- BJ02 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- BJ03 3301-001051 CORE-FERRITE BEAD;AC,1.6X0.8X0.8mm,-,- CJ01 2404-000304 C-TA,CHIP;22uF,20%,6.3V,-,TP,3528,- CNJ02 3708-001236 CONNECTOR-FPC/FC/PIC;10P,0.5mm,SMD-A,SN CNJ03 3711-000456 CONNECTOR-HEADER;3WALL,4P,1R,1.25mm,SMD- DJ01 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 DJ02 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 DJ03 0401-001054 DIODE-SWITCHING;KDS160,85V,300mA,SOD-323 DJ04 0403-001126 DIODE-ZENER;UDZ18D,18V,10%,200mW,UMD2,TP 6-10 Samsung Electronics, 7. PCB Diagrams 7-1. Main PCB (Rev.02) 7-2 7-2. Main PCB (Rev.03) 7-4 7-3. B/L PCB 7-6 7-4. DC PCB 7-8 7-5. Function PCB 7-10 7-6. Jack PCB 7-11 < Main PCB > Samsung Electronics 7-1, PCB Diagrams 7-1. Main PCB (Rev.02) Conductor Side 7-2 Samsung Electronics, PCB Diagrams 7-2. Main PCB (Rev.03) Conductor Side 7-4 Samsung Electronics, PCB Diagrams 7-3. B/L PCB Conductor Side 7-6 Samsung Electronics, PCB Diagrams 7-4. DC PCB Conductor Side 7-8 Samsung Electronics, Exploded View and Parts List 7-5. Function PCB Conductor Side Component Side 7-10 Samsung Electronics, PCB Diagrams

MEMO

7-12 Samsung Electronics, 8. Wiring Diagram Samsung Electronics 8-1, Wiring Diagram

MEMO

8-2 Samsung Electronics, Schematic Diagrams 9. Schematic Diagrams 9-1. CCD Block 9-2 9-2. Drive Block 9-3 9-3. Process Block 9-4 9-4. Function Block 9-5 9-5. LCD Block 9-6 9-6. JACK Block 9-7 9-7. CCD Block 9-8 9-8. Drive Block 9-9 9-9. Process Block 9-10 9-10. Function Block 9-11 Samsung Electronics 9-1, Schematic Diagrams 9-1. Process Block (Rev.02,03) *Rev.02 *Rev.03 9-2 Samsung Electron9ic-2s, Schematic Diagrams 9-2. Drive Block (Rev.02,03) Samsung Electronics 9-3, Schematic Diagrams 9-3. Mevory Block (Rev.02) 9-4 Samsung Electronics, Schematic Diagrams 9-4. Memory Block (Rev.03) Samsung Electronics 9-5, Schematic Diagrams 9-5. LCD Block (Rev.02,03) 9-6 Samsung Electronics, Schematic Diagrams 9-6. Back Light Block (Rev.02,03) Samsung Electronics 9-7, Schematic Diagrams 9-7. DC Block (Rev.02,03) 9-8 Samsung Electronics, Schematic Diagrams 9-8. Charge Block (Rev.02,03) Samsung Electronics 9-9, Schematic Diagrams 9-9. Function Block (Rev.02,03) 9-10 Samsung Electronics, Schematic Diagrams 9-10. Jack Block (Rev.02,03) Samsung Electronics 9-11]
15

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SERVICE MANUAL Color Digital Camera VPC-AZ1EX VPC-AZ1E VPC-AZ1
FILE NO. SERVICE MANUAL Color Digital Camera VPC-AZ1EX (Product Code : 126 299 01) (Europe) (PAL General) VPC-AZ1E (Product Code : 126 299 02) (U.K.) VPC-AZ1 (Product Code : 126 299 03) (U.S.A.) (Canada) Contents 1. OUTLINE OF CIRCUIT DESCRIPTION ... 2 2. DISASSEMBLY ... 11 3. ELECTRICAL ADJUSTMENT
  ELECTRICAL ADJUSTMENT 3-1. Table for Servicing Tools 6-3. LCD RGB Offset Adjustment
ELECTRICAL ADJUSTMENT 3-1. Table for Servicing Tools 6-3. LCD RGB Offset Adjustment 6-4. LCD Blue Brightness Adjustment Ref. No. Name Number Part code 6-5. LCD Red Brightness Adjustment J-1 Pattern box (color viewer) 1 VJ8-0190 Note: If the lens, CCD and board in item 2-5, it is necessary to adjus
1-4. ST1 STROBE CIRCUIT DESCRIPTION
1-4. ST1 STROBE CIRCUIT DESCRIPTION 1. Charging Circuit 2. Light Emission Circuit When UNREG power is supplied to the charge circuit and the When RDY and TRIG signals are input from the ASIC expan- CHG signal from SY1 board becomes High (3.3 V), the charg- sion port, the stroboscope emits light. ing
SERVICE MANUAL Digital Movie Camera VPC-C40 VPC-C40EX
FILE NO. SERVICE MANUAL Digital Movie Camera VPC-C40 (Product Code : 168 033 01) (U.S.A.) (Canada) (Korea) (Taiwan) VPC-C40EX (Product Code : 168 033 02) (Europe) (South America) (China) (Australia) (Hong Kong) Contents (Russia) 1. OUTLINE OF CIRCUIT DESCRIPTION ... 3 (Middle East) 2. DISASSEMBLY ..
  DISASSEMBLY
DISASSEMBLY 2-1. REMOVAL OF CABINET LEFT, CP1 BOARD AND SY1 BOARD 1. Cover battery 9. Screw 1.7x32. Five screws 1.7x510. Shield CP1 3. Three screws 1.7x311. CP1 board 4. Cabinet left 12. Two connectors 5. Cover card 13. Two FPCs 6. Connector 14. Four screws 1.7x412 7. FPC 15. Connector 8. Screw 1.
SERVICE MANUAL Digital Camera VPC-AZ3EX VPC-AZ3
FILE NO. SERVICE MANUAL Digital Camera VPC-AZ3EX (Product Code : 126 621 01) (Europe) (PAL General) VPC-AZ3 (Product Code : 126 621 02) (U.S.A.) (Canada) Contents 1. OUTLINE OF CIRCUIT DESCRIPTION ... 2 2. DISASSEMBLY ... 10 3. ELECTRICAL ADJUSTMENT ... 12 4. USB STORAGE INFORMATION REGISTRATION ...
WARNING Do not use solder containing lead. Note:
WARNING Do not use solder containing lead. Note: This product has been manufactured using lead-free solder in If replacing existing solder containing lead with lead-free sol- order to help preserve the environment. der in the soldered parts of products that have been manufac- Because of this, be sur
  USB STORAGE INFORMATION REGISTRATION
USB STORAGE INFORMATION REGISTRATION USB storage data is important for when the camera is con- nected to a computer via a USB connection. If there are any errors in the USB storage data, or if it has not been saved, the USB specification conditions will not be sat- isfied, so always check and save
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS TABLE OF CONTENTS OVERALL WIRING & BLOCK DIAGRAMS Page OVERALL WIRING ... C3 OVERALL CIRCUIT ... C4 POWER CIRCUIT ... C5 STROBO CIRCUIT ... C5 CAMERA CIRCUIT ... C6 LENS DRIVER CIRCUIT ... C6 MAIN CIRCUIT ... C7 SYSTEM CONTROL CIRCUIT ... C8 CIRCUIT DIAGRAMS
WARNING Do not use solder containing lead. Note: This product has been manufactured using lead-free solder in If replacing existing solder containing lead with lead-free sol-
WARNING Do not use solder containing lead. Note: This product has been manufactured using lead-free solder in If replacing existing solder containing lead with lead-free sol- order to help preserve the environment. der in the soldered parts of products that have been manufac- Because of this, be sur
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS TABLE OF CONTENTS OVERALL WIRING & BLOCK DIAGRAMS Page OVERALL WIRING ... C3 OVERALL CIRCUIT ... C4 POWER CIRCUIT ... C5 STROBO CIRCUIT ... C5 CAMERA CIRCUIT ... C6 LENS CIRCUIT ... C6 MAIN CIRCUIT ... C7 SYSTEM CONTROL CIRCUIT ... C8 CIRCUIT DIAGRAMS CIRCUIT
SERVICE MANUAL Digital Movie Camera VPC-C6 VPC-C6EX
FILE NO. SERVICE MANUAL Digital Movie Camera VPC-C6 (Product Code : 168 034 01) (U.S.A.) (Canada) (Korea) (Taiwan) VPC-C6EX (Product Code : 168 034 02) (China) (South America) (Russia) (Middle East) (Africa) (Hong Kong) (Australia) (General) Contents 1. OUTLINE OF CIRCUIT DESCRIPTION ... 3 VPC-C6E 2
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS TABLE OF CONTENTS OVERALL WIRING & BLOCK DIAGRAMS Page OVERALL WIRING ... C3 OVERALL CIRCUIT ... C4 ASIC CIRCUIT ... C4 CAMERA CIRCUIT ... C5 LENS CIRCUIT ... C5 SYSTEM CONTROL CIRCUIT ... C6 STROBO CIRCUIT ... C7 POWER CIRCUIT ... C7 CIRCUIT DIAGRAMS MAIN &
  OUTLINE OF CIRCUIT DESCRIPTION
OUTLINE OF CIRCUIT DESCRIPTION 1-1. CCD CIRCUIT DESCRIPTION Pin 1 1. IC Configuration The CCD peripheral circuit block basically consists of the fol- lowing ICs. V IC903 (MN39830PLJ-A) CCD imager IC901 (AN20112A) V driver 6 IC905 (AD9996BBCZ) CDS, AGC, A/D converter, H driver, vertical TG 12 H 58P
VPC-E6EX VPC-E6EXW
FILE NO. SERVICE MANUAL Digital Camera VPC-E6 (Product Code : 168 026 01) (Canada) (Korea) (Taiwan) VPC-E6EX (Product Code : 168 026 02) VPC-E6EXW (Product Code : 168 026 04) (Europe) (South America) (China) (Australia) Contents (General) 1. OUTLINE OF CIRCUIT DESCRIPTION ... 2 2. DISASSEMBLY ... 10
WARNING Do not use solder containing lead. Note:
WARNING Do not use solder containing lead. Note: This product has been manufactured using lead-free solder in If replacing existing solder containing lead with lead-free sol- order to help preserve the environment. der in the soldered parts of products that have been manufac- Because of this, be sur
  DISASSEMBLY
DISASSEMBLY 2-1. REMOVAL OF CABINET FRONT AND CP1 BOARD 1. Three screws 1.7x510. Remove the solder. (microphone) 2. Three screws 1.7x411. Remove the solder. 3. Cabinet front 12. Three FPCs 4. Holder cover baria 13. Screw 1.7x35. Cover lens 14. Screw 1.7 x 3.5 6. FPC 15. Connector 7. Two screws 1.7
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS TABLE OF CONTENTS OVERALL WIRING & BLOCK DIAGRAMS Page OVERALL WIRING ... C3 OVERALL CIRCUIT ... C4 ASIC CIRCUIT ... C4 CAMERA CIRCUIT ... C5 LENS CIRCUIT ... C5 SYSTEM CONTROL CIRCUIT ... C6 STROBO CIRCUIT ... C7 POWER CIRCUIT ... C7 CIRCUIT DIAGRAMS MAIN &