Download: WARNING Do not use solder containing lead. Note:

WARNING Do not use solder containing lead. Note: This product has been manufactured using lead-free solder in If replacing existing solder containing lead with lead-free sol- order to help preserve the environment. der in the soldered parts of products that have been manufac- Because of this, be sure to use lead-free solder when carrying tured up until now, remove all of the existing solder at those out repair work, and never use solder containing lead. parts before applying the lead-free solder. Lead-free solder has a melting point that is 30 - 40°C (86 - 104°F) higher than solder containing ...
Author: Sean Shared: 8/19/19
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WARNING

Do not use solder containing lead. Note: This product has been manufactured using lead-free solder in If replacing existing solder containing lead with lead-free sol- order to help preserve the environment. der in the soldered parts of products that have been manufac- Because of this, be sure to use lead-free solder when carrying tured up until now, remove all of the existing solder at those out repair work, and never use solder containing lead. parts before applying the lead-free solder. Lead-free solder has a melting point that is 30 - 40°C (86 - 104°F) higher than solder containing lead, and moreover it does not contain lead which attaches easily to other metals. As a result, it does not melt as easily as solder containing lead, and soldering will be more difficult even if the temperature of the soldering iron is increased. The extra difficulty in soldering means that soldering time will increase and damage to the components or the circuit board may easily occur. Because of this, you should use a soldering iron and solder that satisfy the following conditions when carrying out repair work. Soldering iron Use a soldering iron which is 70 W or equivalent, and which lets you adjust the tip temperature up to 450°C (842°F). It should also have as good temperature recovery characteris- tics as possible. Set the temperature to 350°C (662°F) or less for chip compo- nents, to 380°C (716°F) for lead wires and similar, and to 420°C (788°F) when installing and removing shield plates. The tip of the soldering iron should have a C-cut shape or a driver shape so that it can contact the circuit board as flat or in a line as much as possible. Solder Use solder with the metal content and composition ratio by weight given in the table below. Do not use solders which do not meet these conditions. Metal content Tin (Sn) Silver (Ag) Copper (Cu) Composition 96.5 % 3.0 % 0.5 % ratio by weight Lead-free solder is available for purchase as a service tool. Use the following part number when ordering: Part name: Lead-free solder with resin (0.5 mm dia., 500 g) Part number: VJ8-0270 – 2 –, 1. OUTLINE OF CIRCUIT DESCRIPTION 1-1. CCD CIRCUIT DESCRIPTION Pin 1 1. IC Configuration The CCD peripheral circuit block basically consists of the fol- lowing ICs. V IC903 (MN39830PMJAA) CCD imager IC901 (AN20112A) V driver 6 IC905 (AD9948AKCP) CDS, AGC, A/D converter, H driver 12 H 58Pin 13 2. IC903 (CCD) Fig. 1-1.Optical Black Location (Top View) [Structure] Interline type CCD image sensor Optical size 1/2.5 type format Effective pixels 2864 (H) X 2160 (V) 1 øV6 2 øV5B Pixels in total 2934 (H) X 2171 (V) Photo diode 3 øV5A Optical black 4 øV4 Horizontal (H) direction: Front 12 pixels, Rear 58 pixels 5 øV3B Vertical (V) direction: Front 6 pixels, Rear 5 pixels 6 øV3A 7 øV3L Dummy bit number Horizontal : 28 Vertical :7 8 øV3R 9 øV2 10 øV1 VDD 13 11 øV1S VO 14 12 GND GND 2315 øV5R Horizontal shift register 24 øV5L 17 PT 18 SUBSW 19 øVsub 16 20 21 22 Fig. 1-2. CCD Block Diagram Pin No. Symbol Pin Description Waveform Voltage 1, 23, 24 V6, V5R , V5L Vertical register transfer clock -6.0 V, 0 V 2, 3 V5B, V5A Vertical register transfer clock -6.0 V, 0 V, 12 V V4, V3L, V3R, 4, 7, 8, 9, 11 V Vertical register transfer clock -6.0 V, 0 V2, V1S 5, 6, 10 V3B, V3A, V1 Vertical register transfer clock -6.0 V, 0 V, 12 V 14 VO Signal output DC Aprox. 12 V 13 VDD Circuit power DC 12 V 16 ØRG Reset gate clock 4.5 V, 7.8 V 12, 15 GND GND GND0V17 PT Protection transister bias DC -6.0 V 18 SUB SW Substrate control 0, 3.3 V (When importing allpicture element: 3.3 V) Aprox. 6 V 19 SUB Substrate clock DC (Different from every CCD) 20, 21 HL, H1 Horizontal register transfer clock 0 V, 3.3 V 22 H2 Horizontal register transfer clock 0 V, 3.3 V Table 1-1. CCD Pin Description When sensor read-out – 3 – øRG Output part Vertical shift register øHL øH1 øH2, 3. Part of IC905 (H Driver) and IC901 (V Driver) 4. IC905 (H Driver, CDS, AGC and A/D converter)

An H driver (part of IC905) and V driver (IC901) are neces- IC905 contains the functions of H driver, CDS, AGC and A/D

sary in order to generate the clocks (vertical transfer clock, converter. As horizontal clock driver for CCD image sensor, horizontal transfer clock and electronic shutter clock) which HØ1 (A and B) and HØ2 (A and B) are generated inside, and driver the CCD. output to CCD.

IC905 has the generation of horizontal transfer clock and the The video signal which is output from the CCD is input to pins

function of H driver, and is an inverter IC which drives the (27) of IC905. There are sampling hold blocks generated from horizontal CCDs (H1 and H2). In addition the XV1-XV6 sig- the SHP and SHD pulses, and it is here that CDS (correlated nals which are output from IC101 are vertical transfer clocks, double sampling) is carried out. and the XSG signal is superimposed onto XV1, XV3 and XV5 After passing through the CDS circuit, the signal passes at IC901 in order to generate a ternary pulse. In addition, the through the AGC amplifier (VGA: Variable Gain Amplifier). It

XSUB signal which is output from IC101 is used as the sweep is A/D converted internally into a 10-bit signal, and is then

pulse for the electronic shutter, and the RG signal which is input to ASIC (IC101). The gain of the VGA amplifier is con- output from IC905 is the reset gate clock. trolled by pin (31)-(33) serial signal which is output from ASIC (IC101).

VMSUB

OSUB 3-level10 7 VHH REFT REFB 2-level VL 5 16 OV5R 2-level VL 27 15 OV5L VREF 2-level 2-level 0~18 dB 6~42 dB OV2 24 18 OV3R 10 CCDIN CDS PxGA VGA 10-BIT DOUT 2-level 2-level ADC OV4 23 17 OV3L 2-level 2-level OV6 21 19 OV1S CLAMPINTERNAL CLOCKS HBLK VM 8 25 VM CLP/PBLK 3-level 3-level OV1 20 12 OV5A RG HORIZONTAL PRECISION4 DRIVERS TIMING CLI 3-level H1-H4 CORE RESET 28 11 OV5B Level 3-levelSUBCNT 1 SYNCconversion 14 OV3A AD9948 INTERNALGENERATOR REGISTERS 3-level VDC 3 13 OV3B HD VD SL SCK SDATA CH1 32 Levelconversion 6 VH V1 33 Levelconversion 26 VH V6 31 Levelconversion 4 GND Fig. 1-4. IC905 Block Diagram V4 30 Level Level conversion conversion 41 CH2 Level LevelV2 29 conversion conversion 40 V3 Level V5R 37 Levelconversion conversion 39 CH4 Level LevelV5L 38 conversion conversion 44 CH3 Level V3R 35 Levelconversion conversion 43 V5 Level V3L 36 Levelconversion conversion 42 CH5 Level LevelV1S 34 conversion conversion 2 SUB

Fig. 1-3. IC901 Block Diagram

– 4 –, 1-2. CP1 CIRCUIT DESCRIPTION 1. Circuit Description 2. Outline of Operation When the shutter opens, the reset signals and the serial sig- 1-1. Digital clamp nals (“take a picture” commands) from the 8-bit microproces- The optical black section of the CCD extracts averaged val- sor are input to ASIC (IC101) and operation starts. When the ues from the subsequent data to make the black level of the TG/SG drives the CCD, picture data passes through the A/D CCD output data uniform for each line. The optical black sec- and CDS, and is then input to the ASIC as 12-bit data. The tion of the CCD averaged value for each line is taken as the AF, AE, AWB, shutter, and AGC value are computed from this sum of the value for the previous line multiplied by the coeffi- data, and three exposures are made to obtain the optimum cient k and the value for the current line multiplied by the picture. The data which has already been stored in the SDRAM coefficient (k-1). is read by the CPU and color generation is carried out. Each pixel is interpolated from the surrounding data as being ei- 1-2. Signal processor ther R, G and B primary color data to produce R, G and B 1. γ correction circuit data. At this time, correction of the lens distortion which is a This circuit performs (gamma) correction in order to maintain characteristic of wide-angle lenses is carried out. After AWB a linear relationship between the light input to the camera and γ processing are carried out, a matrix is generated and and the light output from the picture screen. aperture correction is carried out for the Y signal, and the data is then compressed by the JPEG method by (JPEG) and 2. Color generation circuit is then written to card memory (SD card). This circuit converts the CCD data into RGB signals. When the data is to be output to an external device, it is taken data from the memory and output via the USB. When played 3. Matrix circuit back on the LCD and monitor, data is transferred from memery This circuit generates the Y signals, R-Y signals and B-Y sig- to the SDRAM, and the data elongated by JPEG decorder is nals from the RGB signals. displayed over the SDRAM display area. 4. Horizontal and vertical aperture circuit 3. LCD Block This circuit is used gemerate the aperture signal. LCD block is in the CP1 board, and it is constructed by VCOM generation circuit etc. The video signal from the ASIC are 8- 1-3. AE/AWB and AF computing circuit bit digital signal, and input to LCD directly. It is converted into The AE/AWB carries out computation based on a 256-seg- RGB signals at driver circuit in the LCD. ment screen, and the AF carries out computations based on The VCOM (common polar voltage: AC) and the R, G andBa11-segment screen. signals becomes greater, the display becomes darker; if the difference in potential is smaller, the element opens and the 1-4. SDRAM controller LCD become brighter. And also the timing pulse except the This circuit outputs address, RAS, CAS and AS data for con- video signal is input to LCD directly from ASIC. trolling the SDRAM. It also refreshes the SDRAM. 4. Lens drive block 1-5. Communication control 4-1. Shutter drive 1. SIO The shutter drive signal (SIN1 and SIN2) which is output from This is the interface for the 8-bit microprocessor. the ASIC is drived the shutter constant level driver (IC951), and then shutter is opened and closed. 2. PIO/PWM/SIO for LCD 8-bit parallel input and output makes it possible to switch be- 4-2. Iris drive tween individual input/output and PWM input/output. It is pre- The iris stepping motor drive signals (IIN1 and IIN2) which pared for 16-bit parallel output. are output from the ASIC (IC101) are used to drive by the motor driver (IC951). 1-6. TG/SG Timing generated for 6 million pixel CCD control. 4-3. Focus drive The focus stepping motor drive signals (FIN1, FIN2, FIN3 and 1-7. Digital encorder FIN4) which are output from the ASIC (IC101) are used to It generates chroma signal from color difference signal. drive by the motor driver (IC951). Detection of the standard focusing posit ions is carr ied out by means of the 1-8. JPEG encorder and decorder photointerruptor (AFPI) inside the lens block. It is compressed and elongated the data by JPEG system. 4-4. Zoom drive The zoom DC motor drive signals (ZIN1 and ZIN2) which are output from the ASIC (IC101) are used to drive by the motor driver (IC951). Detection of the zoom positions is carried out by means of photoreflector (ZMPI) inside the lens block. – 5 –, 1-3. PWA POWER CIRCUIT DESCRIPTION 1. Outline 3. Analog System Power Output This is the main power circuit, and is comprised of the follow- +12 V (A), +3.45 V (A) and -6.0 V (A) are output. Feedback for ing blocks. the +12 V (A) is provided to the switching controller (Pin (4) of Switching controller (IC501) IC501) so that PWM control can be carried out. Analog system power output (L5001, Q5001) 5 V power output (L5014, Q5008) 4. Digital 3.25 V Power Output Digital 3.25 V power output (L5006) VDD3 is output. Feedback for the VDD3 is provided to the Digital 1.2 V power output (L5007) swiching controller (Pin (54) of IC501) so that PWM control LCD 15 V system power output (L5005, Q5004) can be carried out. Backlight power output (L5008, Q5009) Motor system power output (IC531, L5301, Q5301) 5. Digital 1.2 V Power Output VDD1.2 is output. Feedback for the VDD1.2 is provided to the 2. Switching Controller (IC501) switching controller (Pin (52) of IC501) so that PWM control This is the basic circuit which is necessary for controlling the to be carried out. power supply for a PWM-type switching regulator, and is pro- vided with seven built-in channels, only CH1 (digital system 6. 5 V System Power Output 1.2 V), CH2 (digital 3.25 V), CH4 (LCD 15 V system), CH55Vis output. Feedback for the5Voutput is provided to the (analog system), CH6 (backlight system) and CH7 (5 V sys- switching controller (Pin (9) of IC501) so that PWM control to tem) are used. Feedback from digital system 1.2 V (D) (CH1), be carried out. 3.25 V (D) (CH2), LCD 15 V system (CH4), analog system (CH5), backlight system (CH6) and5Vsystem (CH7) power 7. LCD System Power Output supply outputs are received, and the PWM duty is varied so +15 V (L) is output. Feedback for the +15 V (L) is provided to that each one is maintained at the correct voltage setting level. the switching controller (Pin (2) of IC501) so that PWM con- Feedback for the backlight power (CH6) is provided to the trol to be carried out. both ends voltage of registance so that regular current can be controlled to be current that was setting. 8. Backlight Power Output Regular current is being transmitted to LED for LCD back- 2-1. Short-circuit protection circuit light. Feedback for the both ends voltage of registance that is If output is short-circuited for the length of time determined being positioned to in series LED are provided to the switch- by internal fixing of IC501 , all output is turned off. The control ing controller (Pin (6) of IC501) so that PWM control to be signal (P ON) are recontrolled to restore output. carried out. 9. Motor System Power Output 3.6 V is output. Feedback for the 3.6 V output is sent to pin (1) of IC531 for PWM control to be carried out. – 6 –, 1-4. STA STROBE CIRCUIT DESCRIPTION 1. Charging Circuit 2. Light Emission Circuit When UNREG power is supplied to the charge circuit and the When FLCLT signals are input from the ASIC expansion port, CHG signal from microprocessor becomes High (3.3 V), the the stroboscope emits light. charging circuit starts operating and the main electorolytic capacitor is charged with high-voltage direct current. 2-1. Emission control circuit However, when the CHG signal is Low (0 V), the charging When the FLCLT signal is input to Hi at the emission control circuit does not operate. circuit, Q5409 switches on and preparation is made to the light emitting. Moreover, when a FLCLT signal becomes Lo, 1-1. Charging switch the stroboscope stops emitting light. The CHG signal becomes High, Q5406 becomes ON and the charging circuit starts operating. 2-2. Trigger circuit The Q5409 is turned ON by the FLCLT signal and light emis- 1-2. Power supply filter sion preparation is preformed. Simultaneously, high voltage C5406 constitutes the power supply filter. They smooth out pulses of several kV are emitted from the trigger coil and ap- ripples in the current which accompany the switching of the plied to the light emitter. oscillation transformer. 2-3. Light emitting element 1-3. Oscillation circuit When the high-voltage pulse form the trigger circuit is ap- This circuit generates an AC voltage (pulse) in order to in- plied to the light emitting part, currnet flows to the light emit- crease the UNREG power supply voltage when drops in cur- ting element and light is emitted. rent occur. This circuit generates a drive pulse with a frequency of approximately 50-100 kHz. Because self-excited light omis- Beware of electric shocks. sion is used, the oscillation frequency changes according to the drive conditions. 1-4. Oscillation transformer The low-voltage alternating current which is generated by the oscillation control circuit is converted to a high-voltage alter- nating current by the oscillation transformer. 1-5. Rectifier circuit The high-voltage alternating current which is generated at the secondary side of T5401 is rectified to produce a high- voltage direct current and is accumulated at electrolytic ca- pacitor C5412. 1-6. Voltage monitoring circuit This circuit is used to maintain the voltage accumulated at C5412 at a constance level. After the charging voltage is divided and converted to a lower voltage by R5405 and R5406, it is output as the monitoring voltage VMONIT. When VMONIT voltage reaches a specified level, the CHG signal is switched to Low and charging is in- terrupted. – 7 –, 1-5. SYA CIRCUIT DESCRIPTION 1. Configuration and Functions For the overall configuration of the SYA block, refer to the block diagram. The SYA block centers around a 8-bit microprocessor (IC301), and controls camera system condition (mode). The 8-bit microprocessor handles the following functions. 1. Operation key input, 2. Clock control and backup, 3. Power ON/OFF, 4. Storobe charge control, 5. Signal input and output for zoom and lens control. Pin Signal I/O Outline 1 MRST O System reset 2 BUCKUP CTL O Backup battery charge control 3 SCAN IN1 I Key matrix input 4 SCAN OUT0 O Key matrix output 5 SCAN OUT1 O Key matrix output 6 SCAN OUT2 O Key matrix output 7 COMREQ I Command request 8 HOT LINE I Direct-coupled line to ASIC 9 BL ON O Backlight ON/OFF 10 LCD ON3 O D/D converter (LCD system) ON/OFF signal 3 11 LCD ON O D/D converter (LCD system) ON/OFF signal 12 P ON O D/D converter (digital system) ON/OFF signal 3 13 CHG ON O Strobe charge control 14 ZSREQ I SREQ 15 TSEN PULSE O Touch sensor pulse output 16 LCD PWM I - 17 VF LED O VF LED (L= lighting) 18 RxD6 O UART receiving for writing 19 TxD6 O UART transmission for writing 20 SO O Serial data output 21 SI O Serial data input 22 SCK O Serial clock output 23 AVREF I Analog standard voltage input terminal 24 AVSS - GND 25 VMONIT I Main condensor charge voltage detection 26 BATTERY I Battery voltage detection 27 T. SEN VOUT I Touch sensor voltage input 28 AV JACK I AV jack detection 29 ZUSBDET I USB connector detection 30 ZDC IN I External power detection 31 CARD I SD card detection 32 SCAN OUT3 O Keymatrix output 33 PLLEN O PLL oscillation ON/OFF 34 SCAN IN0 I Keymatrix input 35 SCAN IN2 I Keymatrix input 36 SCAN IN3 I Keymatrix input 37 BATT OFF I Battery OFF detection signal input 38 AVREF ON O AD VREF ON/OFF signal 39 SELF PRG O Writing control 40 RESET I Reset input 41 XCOUT O Clock oscillation terminal for clock See next page – 8 –, 42 XCIN I Clock oscillation terminal for clock (32.768 kHz) 43 FLMDO O Microprocessor Port 44 XOUT O Main clock oscillation terminal (not used) 45 XIN I Main clock oscillation terminal (not used) 46 VREF - Standard voltage 47 VSS - GND 48 VDD I VDD Table 5-1. 8-bit Microprocessor Port Specification 2. Internal Communication Bus The SYA block carries out overall control of camera operation by detecting the input from the keyboard and the condition of the camera circuits. The 8-bit microprocessor reads the signals from each sensor element as input data and outputs this data to the camera circuits (ASIC) or to the LCD display device as operation mode setting data. Fig. 5-1 shows the internal communication between the 8-bit microprocessor and ASIC. 8-bit micro processor ASIC

MRST

setting of HOT LINE external port

PLLEN SI SO

communi- cation SCK

SREQ COMREQ

Fig. 5-1 Internal Bus Communication System 3. Key Operaiton For details of the key operation, refer to the instruction manual.

SCAN

SCAN IN12OUT030- S1 S2 PW_ON 1 RIGHT DOWN SET - 2 UP LEFT MENU - 3 - WIDE TELE PLAY Table 5-2. Key Operation – 9 –, 4. Power Supply Control The 8-bit microprocessor controls the power supply for the overall system. The following is a description of how the power supply is turned on and off. When the battery is attached, IC955 is operating and creating 3.6 V, a regulated 3.2 V voltage is normally input to the 8-bit microprocessor (IC301) by IC302, clock counting and key scanning is carried out even when the power switch is turned off, so that the camera can start up again. When the power switch is off, the 8-bit microprocessor halts 8 MHz of the main clock, and operates 32.768 kHz of subclock. When the battery is removed, the 8-bit microprocessor power switches the lithum secondary battery for memory backup by IC302, and operates at low consumption. At this condition, the 8-bit microprocessor halts 8 MHz of the main clock, and operates 32.768 kHz clock counting by subclock. Also, the battery for backup is charged 16 hours from it to be attached. When the power switch is on, the 8-bit microprocessor starts processing. The 8-bit microprocessor first sets both the PON signal at pin (12) and the PAON signal (ASIC) to High, and then turn on the power circuit. After PON signal is to High, sets external port of ASIC after approximately 100 ms. According to setting of this external port, carry out setting of the operating frequency and oscillation control in the ASIC. Also, it starts communication with ASIC, and confirms the system is operative. When the through image is operating, set the PAON signal (ASIC) to High and then turn on the CCD. When the through image is playing, set the PAON signal to Low and then turn off the CCD. When LCD panel turns on, set LCD ON signal at pin (11) and LCD ON3 signal at pin (10) to High, and then turn on the power. Set BL ON signal at pin (9) to High, and turn on the backlight power. When the power switch is off, the lens will be stowed, and PON, PAON, LCDON and BLON signals to Low and the power supply to the whole system is halted. The 8-bit microprocessor halts oscillation of the main clock (8 MHz), and set operation mode of clock ocillation. ASIC, 8bit LCD

CCD

memory CPU MONITOR 12 V, -6 V Power supply voltage 1.50 V, 3.25 V 3.2 V 15 V, 5.0 V 3.45 V Power OFF OFF OFF 32KHz OFF Playback mode ON OFF 8MHz ON Shooting mode (LCD) ON OFF 8MHz ON Shooting mode (OVF) OFF OFF 8MHz OFF Shooting ON ON 8MHz ON USB connection ON OFF 8MHz OFF Table 5-3. Power supply control – 10 –, 2. DISASSEMBLY 2-1. REMOVAL OF CABI BACK 1. Two screws 1.7x611. Screw 1.7x42. Open the cover battery. 12. Screw 1.7x33. Screw 1.7x413. Screw 1.7x24. Cabinet bottom 14. Cabinet top & Cabi front 5. Cover battery 15. FPC 6. Stand 7. Three screws 1.7x48. Two screws 1.7x379. Cabi back 10. Screw 1.7x49cab614 12 When assembling, tighten the screws order. a → b → c 2, 5 NOTE: Discharge a strobe capacitor with the discharge jig (VJ8-0188) for41electric shock prevention. – 11 –, 2-2. REMOVAL OF LCD 1. Spacer under monitor 2. LCD 3. Remove the solder. 4. FPC 5. Two screws 1.4 x 3.5 6. Two screws 1.7x47. FPC 7 8. Holder monitor 1 9. Screw 1.7x210. Spring earth CP1 11. Unit, sw FPC63– 12 –, 2-3. REMOVAL OF CP1 BOARD AND LENS ASSEMBLY 1. Remove the solder. 9. CP1 board 17. Two screws 1.7x32. Buzzer 10. Remove the solder. 18. Holder strap 3. Remove the solder. 11. Condensor 19. Dec self LED 4. Remove the solder. 12. FPC 20. Spacer fuse 5. Spacer trigger 13. Three screws 1.4 x 3.5 21. Remove the solder. 6. Remove the solder. 14. Lens assembly 22. Assy, wire batt + 7. Remove the solder. 15. Assy flash 23. Terminal batt A 8. Screw 1.7x416. Spacer battery 24. Holder chassis 11 1014BD 7 21 20

BC

AbBa6cB12 168539BD 14 18 CB When assembling, tighten the screws order. 19 a → b → c

A

15 24 – 13 –, 2-4. REMOVAL OF CABI FRONT AND TB1 BOARD 1. Three screws 1.7x32. Cabinet top 3. Cabi front 4. Spacer flash 5. Screw 1.7 x 2.5216. Shield tape TB1 7. Screw 1.7 x 2.5 8. TB1 board 9. Spring shutter 10. Dec top LED 11. Button shutter 11 12. Button power57– 14 –, 2-5. BOARD LOCATION TB1 board CP1 board – 15 –]
15

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