Download: WARNING Do not use solder containing lead. Note:

WARNING Do not use solder containing lead. Note: This product has been manufactured using lead-free solder in If replacing existing solder containing lead with lead-free sol- order to help preserve the environment. der in the soldered parts of products that have been manufac- Because of this, be sure to use lead-free solder when carrying tured up until now, remove all of the existing solder at those out repair work, and never use solder containing lead. parts before applying the lead-free solder. Lead-free solder has a melting point that is 30 - 40°C (86 - 104°F) higher than solder containing ...
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WARNING

Do not use solder containing lead. Note: This product has been manufactured using lead-free solder in If replacing existing solder containing lead with lead-free sol- order to help preserve the environment. der in the soldered parts of products that have been manufac- Because of this, be sure to use lead-free solder when carrying tured up until now, remove all of the existing solder at those out repair work, and never use solder containing lead. parts before applying the lead-free solder. Lead-free solder has a melting point that is 30 - 40°C (86 - 104°F) higher than solder containing lead, and moreover it does not contain lead which attaches easily to other metals. As a result, it does not melt as easily as solder containing lead, and soldering will be more difficult even if the temperature of the soldering iron is increased. The extra difficulty in soldering means that soldering time will increase and damage to the components or the circuit board may easily occur. Because of this, you should use a soldering iron and solder that satisfy the following conditions when carrying out repair work. Soldering iron Use a soldering iron which is 70 W or equivalent, and which lets you adjust the tip temperature up to 450°C (842°F). It should also have as good temperature recovery characteris- tics as possible. Set the temperature to 350°C (662°F) or less for chip compo- nents, to 380°C (716°F) for lead wires and similar, and to 420°C (788°F) when installing and removing shield plates. The tip of the soldering iron should have a C-cut shape or a driver shape so that it can contact the circuit board as flat or in a line as much as possible. Solder Use solder with the metal content and composition ratio by weight given in the table below. Do not use solders which do not meet these conditions. Metal content Tin (Sn) Silver (Ag) Copper (Cu) Composition 96.5 % 3.0 % 0.5 % ratio by weight Lead-free solder is available for purchase as a service tool. Use the following part number when ordering: Part name: Lead-free solder with resin (0.5 mm dia., 500 g) Part number: VJ8-0270 – 2 –, 1. OUTLINE OF CIRCUIT DESCRIPTION 1-1. CCD CIRCUIT DESCRIPTION 1. IC Configuration 14 13 12 11 10987654321The CCD peripheral circuit block basically consists of the fol- lowing ICs. IC903 (ICX624AQN) CCD imager IC901 (CXD3443GA) V driverGBGBIC905 (AD9949AKCP) CDS, AGC, A/D converter, H driverRGRGGBGBRGRG2. IC903 (CCD) GBGBInterline type CCD image sensorRGRGOptical size 1/2.5 typeGBGBRGRGEffective pixels 2840 (H) x 2128 (V) GBGBPixels in total 2892 (H) x 2138 (V) RGRGOptical blackGBGBRGRG(Note) Horizontal (H) direction: Front 48 pixels, Rear 4 pixels Vertical (V) direction: Front 8 pixels, Rear 2 pixels Horizontal register Dummy bit number Horizontal : 28 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Pin 1 (Note) : Photo sensor V Fig. 1-2. CCD Block DiagramH4Pin 15 Fig. 1-1.Optical Black Location (Top View) Pin No. Symbol Pin Description Pin No. Symbol Pin Description 1 Vø1A Vertical register transfer clock 15 VOUT Signal output 2 Vø1B Vertical register transfer clock 16 VDD Circuit power 3 Vø2 Vertical register transfer clock 17 øRG Reset gate clock 4 Vø3A Vertical register transfer clock 18 Hø1B Horizontal register transfer clock 5 Vø3B Vertical register transfer clock 19 Hø2B Horizontal register transfer clock 6 VøST Horizontal addition control clock 20 GND GND 7 Vø4 Vertical register transfer clock 21 GND GND 8 Vø5A Vertical register transfer clock 22 GND GND 9 Vø5B Vertical register transfer clock 23 øSUB Substrate clock 10 VøHLD Horizontal addition control clock 24 CSUB Substrate bias 11 Vø6 Vertical register transfer clock 25 NC - 12 Vø7A Vertical register transfer clock 26 VL Protection transistor bias 13 Vø7B Vertical register transfer clock 27 Hø1A Horizontal register transfer clock 14 Vø8 Vertical register transfer clock 28 Hø2A Horizontal register transfer clock Table 1-1. CCD Pin Description – 3 – VOUT VØ8 VDD VØ7B ØRG VØ7A HØ1B VØ6 HØ2B VØHLD GND VØ5B Vertical register GND VØ5A GND VØ4 ØSUB VØST CSUB VØ3B NC VØ3A VL VØ2 HØ1A VØ1B HØ2A VØ1A, 3. IC905 (H Driver) and IC901 (V Driver) 4. IC905 (CDS, AGC Circuit and A/D Converter) An H driver (a part of IC905) and V driver (IC901) are neces- The video signal which is output from the CCD is input to sary in order to generate the clocks (vertical transfer clock, pins (27) of IC905. There are S/H blocks inside IC905 gener- horizontal transfer clock and electronic shutter clock) which ated from the XSHP and XSHD pulses, and it is here that driver the CCD. CDS (correlated double sampling) is carried out. IC905 has clock generating which drives horizontal CCD and After passing through the CDS circuit, the signal passes its drives function. These clocks are output from pin (14), (15), through the AGC amplifier. It is A/C converted internally into (18) and (19) of IC905. In addition the XV1-XV8 signals which a 12-bit signal, and is then input to IC101 of the CP1 circuit are output from IC101 are the vertical transfer clocks, and the board. The gain of the AGC amplifier is controlled by pin (31)- XSG1A, XSG1B, XSG3A, XSG3B, XSG5A, XSG5B, XSG7A (33) serial signal which is output from IC101 of the CP1 board. and XSG7B signals which are output is superimposed onto XV1, XV3, XV5 and XV7 at IC901 in order to generate a ter- nary pulse. In addition, the XSUB signal which is output from VRT VRB IC101 is used as the sweep pulse for the electronic shutter, and the RG signal which is output from pin (21) of IC905 is VREF 0~18 dB 6~42 dB the reset gate clock. 12 CCDIN CDS PxGA VGA 12-BIT DOUTADC

CLAMP INTERNAL

CLOCKS HBLK Input Buffer CLP/PBLK DVD1 C1 A4 VL2 RG HORIZONTAL PRECISION AVD1 A6 VH2 4 DRIVERS TIMINGL2 CLIH1-H4 CORE AVS1 L3 A10 VM2 XSUBN B1 C2 SUB AD9949 SYNC INTERNAL GENERATOR REGISTERS XSG9N D1 A2 V2 XV2N D2 HD VD SL SCK SDATA XSG7N E1 B4 V7A XV7N E2 XSG5N F1 A5 V5A Fig. 1-4. IC905 Block Diagram XV5N F2 XV3N G10 B6 V3A XSG3N F11 XV1N F10 A8 V1A XSG1N E11 XV4N E10 B8 V4 XV9N D11 A9 V9 XSG10N K9 C10 V6 XV6N K11 XSG8N J11 B9 V7B XV14N J10 XSG6N H11 B7 V5B XV13N H10 XV12N G2 A7 V3B XSG4N H1 XV11N H2 B5 V1B XSG2N J1 XV8N J2 A3 V8 XV10N K1 B3 V10 AVS2 B11 L4 VM1 AVD2 C11 L5 VH1 DVD2 L10 L7 VL1 Fig. 1-3. IC901 Block Diagram – 4 –, 1-2. CP1 CIRCUIT DESCRIPTION 1. Circuit Description 2. Outline of Operation 1-1. Digital clamp When the shutter opens, the serial signals (“take a picture” The optical black section of the CCD extracts averaged val- commands) from the 8-bit microprocessor is input to ASIC ues from the subsequent data to make the black level of the (IC101) and operation starts. When the TG/SG drives the CCD, CCD output data uniform for each line. The optical black sec- picture data passes through the A/D and CDS, and is then tion of the CCD averaged value for each line is taken as the input to the ASIC as 12-bit data. The AF, AE, AWB, shutter, sum of the value for the previous line multiplied by the coeffi- and AGC value are computed from this data, and three expo- cient k and the value for the current line multiplied by the sures are made to obtain the optimum picture. The data which coefficient (k-1). has already been stored in the SDRAM is read by the CPU and color generation is carried out. Each pixel is interpolated 1-2. Signal processor from the surrounding data as being either R, G and B primary 1. γ correction circuit color data to produce R, G and B data. At this time, correction This circuit performs (gamma) correction in order to maintain of the lens distortion which is a characteristic of wide-angle a linear relationship between the light input to the camera lenses is carried out. After AWB and γ processing are carried and the light output from the picture screen. out, a matrix is generated and aperture correction is carried out for the Y signal, and the data is then compressed by the 2. Color generation circuit JPEG method by (JPEG) and is then written to card memory This circuit converts the CCD data into RGB signals. (SD card). When the data is to be output to an external device, it is taken 3. Matrix circuit data from the memory and output via the USB. When played This circuit generates the Y signals, R-Y signals and B-Y sig- back on the LCD and monitor, data is transferred from memery nals from the RGB signals. to the SDRAM, and the data elongated by JPEG decorder is displayed over the SDRAM display area. 4. Horizontal and vertical aperture circuit This circuit is used gemerate the aperture signal. 3. LCD Block The LCD display circuit is located on the CP1 board, and 1-3. AE/AWB and AF computing circuit consists of components such as a power circuit and VCOM The AE/AWB carries out computation based on a 256-seg- control circuit. ment screen, and the AF carries out computations based on The signals from the ASIC are 8-bit digital signals, that is a 11-segment screen. input to the LCD directly. The 8-bit digital signals are con- verted to RGB signals inside the LCD driver circuit . LCD is 1-4. SDRAM controller input signals from ASIC directly to the LCD, and function such This circuit outputs address, RAS, CAS and AS data for con- as image quality are controlled. trolling the SDRAM. It also refreshes the SDRAM. Because the LCD closes more as the difference in potential between the VCOM (common polar voltage: AC) and the R, 1-5. Communication control G and B signals becomes greater, the display becomes darker; 1. SIO if the difference in potential is smaller, the element opens and This is the interface for the 8-bit microprocessor. the LCD become brighter. In addition, the timing pulses for signals other than the video 2. PIO/PWM/SIO for LCD signals are also input from the ASIC directory to the LCD. 8-bit parallel input and output makes it possible to switch be- tween individual input/output and PWM input/output. It is pre- pared for 16-bit parallel output. 1-6. TG/SG Timing generated for 6 million pixel CCD control. 1-7. Digital encorder It generates chroma signal from color difference signal. 1-8. JPEG encorder and decorder It is compressed and elongated the data by JPEG system. – 5 –, 4. Lens drive block 4-1. Shutter drive The shutter drive signals (SIN1 and SIN2) which are output from the ASIC are used to drive (SHUT (+) and SHUT (–)) the shutter constant level driver (IC951), and then shutter is opened and closed. 4-2. Iris drive The iris stepping motor drive signals (IIN1 and IIN2) which are output from the ASIC (IC101) are used to drive (IRIS (+) and IRIS (–)) by the motor driver (IC951), and are then used to drive the iris steps. 4-3. Focus drive The focus stepping motor drive signals (FIN1, FIN2, FIN3 and FIN4) which are output from the ASIC (IC101) are used to drive (AFSPM (1) +A, AFSPM (2) –A, AFSPM (3) +B and AFSPM (4) –B) by the motor driver (IC951). Detection of the standard focusing positions is carried out by means of the photointerruptor (AFPI) inside the lens block. 4-4. Zoom drive The zoom DC motor drive signals (ZIN1 and ZIN2) which are output from the ASIC (IC101) are used to drive (ZM (+) and ZM (–)) by the motor driver (IC951). Detection of the standard zooming positions is carried out by means of photoreflector (ZMPR_E) inside the lens block. Getting of the zoom positions is carried out by means of the photo-interrupter (ZMPI_E) by ASIC (IC101) is counting inside the lens block. – 6 –, 1-3. PWA POWER CIRCUIT DESCRIPTION 1. Outline 3. ch_1 Output System This is the main power circuit, and is comprised of the follow- 3.6 V is output. Feedback for the 3.6 V output is provided to ing blocks. the switching controller (Pin (36) of IC501) so that PWM con- Switching power control IC (IC501) trol can be carried out. Analog 12 V (A) output system (L5006, Q5001) While DSC is stopped, control switches to PFM control. Analog -7.5 V (A) output system (L5007, Q5004, IC503) Analog 3.25 V (A) output system (Q5009) 4. ch_2 Output System Digital 3.25 V (D) output system (L5003) 3.25 V (D) is output. Feedback for the 3.25 V (D) output is Digital 1.20 V (D) output system (L5004) provided to the switching controller (Pin (45) of IC501) so that Backlight output system (L5005, Q5002) PWM control can be carried out. Also, it is the source for 3.25 Boost power (L5301) V (A). 2. Switching Power Controller (IC501) 5. ch_3 Output System This is the basic circuit which is necessary for controlling the 1.20 V (D) is output. Feedback for the 1.20 V (D) output is power supply for a PWM-type switching regulator, and is pro- provided to the swiching controller (Pin (44) of IC501) so that vided with eight built-in channels. PWM control can be carried out. PWM/PFM switching step-up circuit …… 1 (ch_1) PWM drive step-up/step-down circuit …… 1 (ch_2) 6. ch_4 Output System PWM drive step-up and step-down circuit …… total 4 (ch_3 -7.5 V is output. Feedback for the inverter circuit output is and ch_5~ch_7) provided to the switching power controller (Pin (38) of IC501) PWM drive inverter circuit …… 1 (ch_4) so that PWM control can be carried out. This output is high Variable regulator …… 1 (ch_8) precision by IC503, and get to -7.5 V. Only ch_1 (starting IC, lens drive, 8-bit microprocessor and ch_3 source), ch_2 (digital 3.25 V), ch_3 (digital 1.20 V), ch_4 7. ch_5 Output System (analog -7.5 V), ch_5 (analog 12 V), ch_6 (not used), ch_7 12.0 V (A) is output. Feedback for the 12.0 V (A) is provided (backlight) and ch_8 (not used) are used. Feedback from 3.6 to the switching power controller (Pin (39) of IC501) so that V (ch_1), 3.25 V (ch_2), 1.20 V (ch_3), -7.5 V (ch_4) and 12.0 PWM control can be carried out. V (ch_5) power supply outputs are received, and the PWM duty is varied so that each one is maintained at the correct 8. ch_7 Output System voltage setting level. Regular current is being transmitted to LED for backlight. Step- Feedback for the backlight power (ch_7) is provided so that down in the voltage from the LED are feedback to the switch- regular current can be controlled to be current (approximately ing power controller (Pin (42) of IC501) so that PWM control 20 mA) that was setting. can be carried out. PWM/PFM switching can be carried out for ch_1, so that PFM The control signal (LCD PWM) from the 8-bit system can be operation is enabled when the DSC is stopped (when the used to adjust the backlight illumination. power is off) which provides greater efficiency at times of low loads (only the 8-bit microprocessor is driven). 2-1. Damage Prevention Circuit When a short-circuit is generated for a constant period of time, the capacitor that is connected to pin (1) of IC501 turns all output off. It is also equipped with an overheating protection circuit, so that when the element temperature becomes higher than a certain temperature, all output is turned off in the same way as for a short-circuit. To reset output, remove the cause of the problem and then resend a control signal. – 7 –, 1-4. CP1 STROBE CIRCUIT DESCRIPTION 1. Charging Circuit 2. Light Emission Circuit When UNREG power is supplied to the charge circuit and the When FLCLT signals are input from the ASIC expansion port, CHG signal from microprocessor becomes High (3.3 V), the the stroboscope emits light. charging circuit starts operating and the main electorolytic capacitor is charged with high-voltage direct current. 2-1. Emission control circuit However, when the CHG signal is Low (0 V), the charging When the FLCLT signal is input to Hi at the emission control circuit does not operate. circuit, Q5402 switches on and preparation is made to the light emitting. Moreover, when a FLCLT signal becomes Lo, 1-1. Charging switch the stroboscope stops emitting light. The CHG signal becomes High, Q5404 becomes ON and the charging circuit starts operating. 2-2. Trigger circuit The Q5402 is turned ON by the FLCLT signal and light emis- 1-2. Power supply filter sion preparation is preformed. Simultaneously, high voltage C5408 constitutes the power supply filter. They smooth out pulses of several kV are emitted from the trigger coil and ap- ripples in the current which accompany the switching of the plied to the light emitter. oscillation transformer. 2-3. Light emitting element 1-3. Oscillation circuit When the high-voltage pulse form the trigger circuit is ap- This circuit generates an AC voltage (pulse) in order to in- plied to the light emitting part, currnet flows to the light emit- crease the UNREG power supply voltage when drops in cur- ting element and light is emitted. rent occur. This circuit generates a drive pulse with a frequency of approximately 50-100 kHz. Because self-excited light omis- Beware of electric shocks. sion is used, the oscillation frequency changes according to the drive conditions. 1-4. Oscillation transformer The low-voltage alternating current which is generated by the oscillation control circuit is converted to a high-voltage alter- nating current by the oscillation transformer. 1-5. Rectifier circuit The high-voltage alternating current which is generated at the secondary side of T5401 is rectified to produce a high- voltage direct current and is accumulated at electrolytic ca- pacitor C5412 on the main circuit board. 1-6. Voltage monitoring circuit This circuit is used to maintain the voltage accumulated at C5412 at a constance level. After the charging voltage is divided and converted to a lower voltage by R5404 and R5405, it is output as the monitoring voltage VMONIT. When VMONIT voltage reaches a specified level, the CHG signal is switched to Low and charging is in- terrupted. – 8 –, 1-5. SYA CIRCUIT DESCRIPTION 1. Configuration and Functions For the overall configuration of the SYA block, refer to the block diagram. The SYA block centers around a 8-bit microprocessor (IC301), and controls camera system condition (mode). The 8-bit microprocessor handles the following functions. 1. Operation key input, 2. Clock control and backup, 3. Power ON/OFF, 4. Storobe charge control, 5. Signal input and output for zoom and lens control. Pin Signal I/O Outline 1 BATT_OFF I Battery OFF detection 2 SW_3.2 V ON O SW 3.2 V line ON 3 NOT USED O - 4 NOT USED O Always low output 5 CTRL I Lens power PFM/PWM mode switching (L= PFM, H= PWM) 6 RESET I Microprocessor reset terminal 7 XCOUT O Clock oscillation terminal for clock 8 XCIN I Clock oscillation terminal for clock 9 FLMD0 - Program writing control signal, mode lead-in 10 XOUT O Main clock oscillation terminal (4 MHz) 11 XIN I Main clock oscillation terminal (4 MHz) 12 REGC - Regulator output for internal operation 13 VSS - GND 14 EVSS - GND 15 VDD - Power terminal 16 EVDD - Power terminal 17 MRST O System reset (ASIC reset) 18 TRST O JTAG relation reset 19 T SEN LED O Touch sensor sensing LED ON 20 SELF_LED O Self LED ON 21 NOT USED I - 22 COMREQ I Communication signal to ASIC 23 HOT LINE O Not used. Always low output 24 PLLEN O ASIC PLL ON/OFF 25 SCAN IN4IKeymatrix input 26 SCAN IN3IKeymatrix input 27 SCAN IN2IKeymatrix input 28 SCAN IN1IKeymatrix input 29 SCAN IN0IKeymatrix input 30 P ON I D/D converter (digital system) ON/OFF 31 NAND_RESET O One NAND memory reset (L= reset) 32 USB CONNECT I USB insertion detection from CN110 33 NOT USED I Always input mode 34 SCAN OUT0OKeymatrix output 35 SCAN OUT1OKeymatrix output 36 SCAN OUT2OKeymatrix output 37 DOCK USB I USB insertion detection from printer dock 38 ZSREQ I Communication request signal from ASIC 39 TSEN_PULSE O Clock output for touch sensor (approx. 30 kHz) 40 LCD PWM O LCD backlight dimmer control signal 41 BL ON O LCD backlight ON/OFF signal See next page – 9 –, 42 RXD6 I Program writing reception data (UART) 43 TXD6 O Program writing reception data (UART) 44 NOT USED - - 45 NOT USED - - 46 NOT USED - - 47 AVREF I Internal A/D standard potential 48 AVSS - Analog GND (A/D GND) 49 BATTERY I Battery potential detection (A/D) 50 VMONIT I Strobo condensor charge potential detection (A/D) 51 ILLUMI I Illuminance sensor potential detection (A/D) 52 TOUCH_IN I Touch sensor input (A/D) 53 CARD I SD card insertion detection 54 AV JACK I AV cable insertion detection (L= detection) 55 NOT USED I Always input mode 56 NOT USED O Always low output 57 ST_CHG_ON O Strobo condensor charge start 58 SCK O Communication CLK to ASIC 59 SI I Reception data from ASIC 60 SO O Sending data to ASIC 61 BACKUPCTRL O Charge control to coin battery (L= charge) 62 FLMD0_SY O - 63 PW_TEST I Power compulsion ON at Low (test) 64 NC I Always input mode Table 5-1. 8-bit Microprocessor Port Specification 2. Internal Communication Bus The SYA block carries out overall control of camera operation by detecting the input from the keyboard and the condition of the camera circuits. The 8-bit microprocessor reads the signals from each sensor element as input data and outputs this data to the camera circuits (ASIC) or to the LCD display device as operation mode setting data. Fig. 5-1 shows the internal communication between the 8-bit microprocessor and ASIC. 8-bit micro processor ASIC setting of MRST external port PLLEN

SI SO

communi- cation SCK

SREQ COMREQ

Fig. 5-1 Internal Bus Communication System – 10 –, 3. Key Operaiton For details of the key operation, refer to the instruction manual.

SCAN

SCAN IN01234OUT 0 UP RIGHT DOWN LEFT OK 1 MENU GREEN TELE WIDE PLAY 2 1st (S1) 2nd (S2) - TEST PW_ON Table 5-2. Key Operation 4. Power Supply Control The 8-bit microprocessor controls the power supply for the overall system. The following is a description of how the power supply is turned on and off. When the battery is attached, IC501 is operating and creating 3.6 V, a regulated 3.2 V voltage is normally input to the 8-bit microprocessor (IC301) by IC302, clock counting and key scanning is carried out even when the power switch is turned off, so that the camera can start up again. When the power switch is off, the 8-bit microprocessor halts 4 MHz of the main clock, and operates 32.768 kHz of subclock. When the battery is removed, the 8-bit microprocessor power switches the lithum secondary battery for memory backup by IC302, and operates at low consumption. At this condition, the 8-bit microprocessor halts 4 MHz of the main clock, and operates 32.768 kHz clock counting by subclock. Also, the battery for backup is charged 10 hours from it to be attached. When the power switch is on, the 8-bit microprocessor starts processing. The 8-bit microprocessor first sets both the PON signal at pin (30) and the PAON signal (ASIC) to High, and then turn on the power circuit. After PON signal is to High, sets external port of ASIC after approximately 100 ms. According to setting of this external port, carry out setting of the operating frequency and oscillation control in the ASIC. Also, it starts communication with ASIC, and confirms the system is operative. When the through image is operating, set the PAON signal (ASIC) to High and then turn on the CCD. When the through image is playing, set the PAON signal to Low and then turn off the CCD. When LCD panel turns on, set BL ON signal at pin (41) to High, and turn on the backlight power. When the power switch is off, the lens will be stowed, and PON, PAON and BLON signals to Low and the power supply to the whole system is halted. The 8-bit microprocessor halts oscillation of the main clock (4 MHz), and set operation mode of clock ocillation (32.768 kHz). ASIC, 8bit LCD

CCD

memory CPU MONITOR 12 V, -7.5 V Power supply voltage 1.20 V, 3.25 V 3.2 V 3.25 V 3.25 V Power OFF OFF OFF 32 KHz OFF Playback mode ON OFF 4 MHz ON Shooting mode (LCD) ON OFF 4 MHz ON Shooting ON ON 4 MHz ON USB connection ON OFF 4 MHz OFF Table 5-3. Power supply control – 11 –]
15

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