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DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D119 1N4001ID to 1N4007ID Rectifiers Product specification 1996 Jun 10 Supersedes data of April 1992 File under Discrete Semiconductors, SC01 FEATURES DESCRIPTION This package is hermetically sealed and fatigue free as coefficients of • Glass passivated Cavity free cylindrical glass package (1) expansion of all used parts are • High maximum operating through Implotec technology. matched. temperature (1) Implotec is a trademark of Philips. • Low leakage current • Excellent stability • Available in ammo-pack. handbook, 4 columnskaMAM123 Fig...
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DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage M3D119 1N4001ID to 1N4007ID

Rectifiers

Product specification 1996 Jun 10 Supersedes data of April 1992 File under Discrete Semiconductors, SC01, FEATURES DESCRIPTION This package is hermetically sealed and fatigue free as coefficients of • Glass passivated Cavity free cylindrical glass package (1) expansion of all used parts are • High maximum operating through Implotec technology. matched. temperature (1) Implotec is a trademark of Philips. • Low leakage current • Excellent stability • Available in ammo-pack. handbook, 4 columnskaMAM123 Fig.1 Simplified outline (SOD81) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRRM repetitive peak reverse voltage 1N4002ID − 100 V 1N4003ID − 200 V 1N4004ID − 400 V 1N4005ID − 600 V 1N4006ID − 800 V 1N4007ID − 1000 V VR continuous reverse voltage 1N4002ID − 100 V 1N4003ID − 200 V 1N4004ID − 400 V 1N4005ID − 600 V 1N4006ID − 800 V 1N4007ID − 1000 V IF(AV) average forward current averaged over any 20 ms − 1.00 A period; Tamb = 75 °C; see Fig.2 averaged over any 20 ms − 0.75 A period; Tamb = 100 °C; see Fig.2 IFRM repetitive peak forward current − 10 A IFSM non-repetitive peak forward current half sinewave; 60 Hz − 20 A Tstg storage temperature −65 +175 °C Tj junction temperature −65 +175 °C 1996 Jun 10 2, ELECTRICAL CHARACTERISTICS Tj = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT VF forward voltage IF = 1 A; see see Fig.3 1.1 V VF(AV) full-cycle average forward voltage IF(AV) = 1 A 0.8 V IR reverse current VR = VRmax 10 µA VR = VRmax; Tamb = 100 °C 50 µA IR(AV) full-cycle average reverse current VR = VRRMmax; Tamb = 75 °C 30 µA THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 60 K/W Rth j-a thermal resistance from junction to ambient note 1 120 K/W Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.4. For more information please refer to the “General Part of Handbook SC01”. 1996 Jun 10 3, GRAPHICAL DATA MBH386 MBH385 1.5 10 handbook, halfpage handbook, halfpage

IF

(A) IF (A) 0.5 (1) (2) (3) 0 10−1 0 100 T (°C) 200 0 0.51V(V) 1.5amb F (1) Tamb = 100 °C. (2) Tamb = 20 °C. (3) Tamb = −50 °C. Fig.2 Maximum forward current as a function of Fig.3 Forward current as a function of forward ambient temperature. voltage; typical values. handbook, halfpage MGA200 Dimensions in mm. Fig.4 Device mounted on a printed-circuit board. 1996 Jun 10 4, PACKAGE OUTLINE 5 max handbook, full pagewidth 0.81 max 2.15 28 min 3.8 max 28 min MBC051max Dimensions in mm. Fig.5 SOD81.

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 10 5]
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