Download: DATA SHEET BA792 Band-switching diode

DISCRETE SEMICONDUCTORS DATA SHEET BA792 Band-switching diode Product specification 1996 Mar 13 File under Discrete Semiconductors, SC01 FEATURES • Ceramic SMD package • Low diode capacitance: max. 1.1 pF cathode markhandbook, 4 columnsakka• Low diode forward resistance: max. 0.7 Ω. APPLICATIONS • bottom view side view top view MAM139Low loss band-switching in VHF television tuners • Surface mount high-speed switching circuits. Marking code: L8. DESCRIPTION Fig.1 Simplified outline (SOD110) and symbol. Planar, high performance band-switching diode in a small ceramic SOD110 SMD package. LIMITIN...
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DISCRETE SEMICONDUCTORS

DATA SHEET BA792 Band-switching diode

Product specification 1996 Mar 13 File under Discrete Semiconductors, SC01,

FEATURES

• Ceramic SMD package • Low diode capacitance: max. 1.1 pF cathode markhandbook, 4 columnsakka• Low diode forward resistance: max. 0.7 Ω.

APPLICATIONS

• bottom view side view top view MAM139Low loss band-switching in VHF television tuners • Surface mount high-speed switching circuits. Marking code: L8. DESCRIPTION Fig.1 Simplified outline (SOD110) and symbol. Planar, high performance band-switching diode in a small ceramic SOD110 SMD package. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VR continuous reverse voltage − 35 V IF continuous forward current − 100 mA Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C 1996 Mar 13 2, ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT VF forward voltage IF = 100 mA 1.1 V IR reverse current VR = 20 V 10 nA VR = 20 V; Tamb = 75 °C 1 µA Cd diode capacitance VR = 3 V; f = 1 to 100 MHz; note 1 1.1 pF rD diode forward resistance IF = 3 mA; f = 200 MHz; note 1 0.7 Ω Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 315 K/W Note 1. Device mounted on a printed-circuit board measuring 11 × 25 × 1.6 mm. MOUNTING Wave soldering Reflow soldering Before wave soldering, attach SOD110 packages to the printed-circuit boards using a small dot of thermo-setting Follow standard reflow soldering techniques to ensure epoxy or UV-curing adhesive centred between the correct application of solder paste and placement of the soldering lands (see Fig.3). SOD110 package (see Fig.2). 3.00 handbook, halfpage 3.40 handbook, halfpage 1.25 1.25 1.00 1.00 MGC119 1.10 1.10 MGC126 Dimensions in mm. Dimensions in mm. Fig.2 SOD110 reflow soldering pattern. Fig.3 SOD110 wave soldering pattern. 1996 Mar 13 3, PACKAGE OUTLINE cathode mark 2.10 1.90 1.6 max MSA323 - 1 1.40 1.10 0.1 Dimensions in mm. Marking band indicates the cathode. Fig.4 SOD110.

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Mar 13 4,

NOTES

1996 Mar 13 5,

NOTES

1996 Mar 13 6,

NOTES

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Philips Semiconductors – a worldwide company

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