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Order this document SEMICONDUCTOR TECHNICAL DATA by BAV70WT1/D ANODE Motorola Preferred Device CATHODE 2 MAXIMUM RATINGS (TA = 25°C) Rating Symbol Max Unit 1 Reverse Voltage VR 70 Vdc Forward Current IF 200 mAdc CASE 419–02, STYLE 5 SC–70/SOT–323 Peak Forward Surge Current IFM(surge) 500 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR–5 Board(1) PD 200 mW TA = 25°C Derate above 25°C 1.6 mW/°C Thermal Resistance, Junction to Ambient RJA 0.625 °C/W Total Device Dissipation PD 300 mW Alumina Substrate(2) TA = 25°C Derate above 25°C 2.4 mW/°C Thermal Resista...
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Order this document SEMICONDUCTOR TECHNICAL DATA by BAV70WT1/D

ANODE Motorola Preferred Device CATHODE 2 MAXIMUM RATINGS (TA = 25°C) Rating Symbol Max Unit 1 Reverse Voltage VR 70 Vdc Forward Current IF 200 mAdc CASE 419–02, STYLE 5 SC–70/SOT–323 Peak Forward Surge Current IFM(surge) 500 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR–5 Board(1) PD 200 mW TA = 25°C Derate above 25°C 1.6 mW/°C Thermal Resistance, Junction to Ambient RJA 0.625 °C/W Total Device Dissipation PD 300 mW Alumina Substrate(2) TA = 25°C Derate above 25°C 2.4 mW/°C Thermal Resistance, Junction to Ambient RJA 417 °C/W Junction and Storage Temperature TJ, Tstg –55 to +150 °C DEVICE MARKING A4 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Reverse Breakdown Voltage V(BR) 70 — Vdc (I(BR) = 100 µAdc) Reverse Voltage Leakage Current (VR = 70 Vdc) IR1 — 5.0 µAdc (VR = 50 Vdc) IR2 — 100 nAdc Diode Capacitance CD — 1.5 pF (VR = 0, f = 1.0 MHz) Forward Voltage VF mVdc (IF = 1.0 mAdc) — 715 (IF = 10 mAdc) — 855 (IF = 50 mAdc) — 1000 (IF = 150 mAdc) — 1250 Reverse Recovery Time trr — 6.0 ns (IF = IR = 10 mAdc, RL = 100 Ω, IR(REC) = 1.0 mAdc) (Figure 1) Forward Recovery Voltage VRF — 1.75 V (IF = 10 mAdc, tr = 20 ns) (Figure 2) 1. FR–5 = 1.0 0.75 0.062 in. 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Motorola Small–Signal Transistors, FETs and Diodes Device Data 1 Motorola, Inc. 1997, BAV70 RS = 50 Ω

SAMPLING

I OSCILLOSCOPEF RL = 50 Ω tr tp

I

10% +IF trr OUTPUT PULSE

V

10% OF R90% 100

VR

INPUT PULSE

Figure 1. Recovery Time Equivalent Test Circuit

1 KΩ 450 Ω RS = 50 Ω

SAMPLING

BAV70 OSCILLOSCOPE RL = 50 Ω

I V

90%

VFR

10% t tr tp INPUT PULSE OUTPUT PULSE t

Figure 2.

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data, 100 10 TA = 150°C T = 125°C 1.0 A TA = 85°C TA = 85°C 0.1 1.0 TA = 25°C TA = 55°C T 0.01A = – 40°C TA = 25°C 0.1 0.001 0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 50 VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Forward Voltage Figure 4. Leakage Current

1.0 0.9 0.8 0.7 0.602468VR, REVERSE VOLTAGE (VOLTS)

Figure 5. Capacitance Motorola Small–Signal Transistors, FETs and Diodes Device Data 3

IF, FORWARD CURRENT (mA) CD, DIODE CAPACITANCE (pF) IR, REVERSE CURRENT (µA), MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total interface between the board and the package. With the design. The footprint for the semiconductor packages must correct pad geometry, the packages will self align when be the correct size to insure proper solder connection subjected to a solder reflow process. 0.025 0.025 0.65 0.65 0.075 1.9 0.035 0.9 0.028 0.7 inches mm SC–70/SOT–323 POWER DISSIPATION The power dissipation of the SC–70/SOT–323 is a function the equation for an ambient temperature TA of 25°C, one can of the collector pad size. This can vary from the minimum calculate the power dissipation of the device which in this pad size for soldering to the pad size given for maximum case is 200 milliwatts. power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction P = 150°C – 25°C = 200 milliwatts temperature of the die, RθJA, the thermal resistance from the D 0.625°C/W device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be The 0.625°C/W assumes the use of the recommended calculated as follows. footprint on a glass epoxy printed circuit board to achieveaT– T power dissipation of 200 milliwatts. Another alternative wouldJ(max) A PD = be to use a ceramic substrate or an aluminum core boardRθJA such as Thermal Clad. Using a board material such as The values for the equation are found in the maximum Thermal Clad, a power dissipation of 300 milliwatts can be ratings table on the data sheet. Substituting these values into achieved using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated • The soldering temperature and time should not exceed temperature of the device. When the entire device is heated 260°C for more than 10 seconds. to a high temperature, failure to complete soldering within a • When shifting from preheating to soldering, the short time could result in device failure. Therefore, the maximum temperature gradient should be 5°C or less. following items should always be observed in order to • After soldering has been completed, the device should minimize the thermal stress to which the devices are be allowed to cool naturally for at least three minutes. subjected. Gradual cooling should be used as the use of forced • Always preheat the device. cooling will increase the temperature gradient and result • The delta temperature between the preheat and in latent failure due to mechanical stress. soldering should be 100°C or less.* • Mechanical stress or shock should not be applied during • When preheating and soldering, the temperature of the cooling leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When * Soldering a device without preheating can cause excessive using infrared heating with the reflow soldering method, thermal shock and stress which can result in damage to the the difference should be a maximum of 10°C. device. 4 Motorola Small–Signal Transistors, FETs and Diodes Device Data,

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed or stainless steel with a typical thickness of 0.008 inches. circuit board, solder paste must be applied to the pads. A The stencil opening size for the surface mounted package solder stencil is required to screen the optimum amount of should be the same as the pad size on the printed circuit solder paste onto the footprint. The stencil is made of brass board, i.e., a 1:1 registration.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control actual temperature that might be experienced on the surface settings that will give the desired heat pattern. The operator of a test board at or near a central solder joint. The two must set temperatures for several heating zones, and a profiles are based on a high density and a low density board. figure for belt speed. Taken together, these control settings The Vitronics SMD310 convection/infrared reflow soldering make up a heating “profile” for that particular circuit board. system was used to generate this profile. The type of solder On machines controlled by a computer, the computer used was 62/36/2 Tin Lead Silver with a melting point remembers these profiles from one operating session to the between 177–189°C. When this type of furnace is used for next. Figure 6 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. solder reflow work, the circuit boards and solder joints tend to This profile will vary among soldering systems but it is a good heat first. The components on the board are then heated by starting point. Factors that can affect the profile include the conduction. The circuit board, because it has a large surface type of soldering system in use, density and types of area, absorbs the thermal energy more efficiently, then components on the board, type of solder used, and the type distributes this energy to the components. Because of this of board or substrate material being used. This profile shows effect, the main body of a component may be up to 30 temperature versus time. The line on the graph shows the degrees cooler than the adjacent solder joints. STEP 1 STEP 2 STEP 3 STEP 4 STEP 5 STEP 6 STEP 7 PREHEAT VENT HEATING HEATING HEATING VENT COOLING ZONE 1 “SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7 “RAMP” “RAMP” “SOAK” “SPIKE” 205° TO 219°C PEAK AT 200°C DESIRED CURVE FOR HIGH 170°C SOLDER JOINT MASS ASSEMBLIES 160°C 150°C 150°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS 140°C 100°C (DEPENDING ON 100°C MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 6. Typical Solder Heating Profile Motorola Small–Signal Transistors, FETs and Diodes Device Data 5,

PACKAGE DIMENSIONS A L

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 3 Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.

S B

1 2 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.071 0.087 1.80 2.20 B 0.045 0.053 1.15 1.35

VDC0.035 0.049 0.90 1.25

D 0.012 0.016 0.30 0.40

G G 0.047 0.055 1.20 1.40

H 0.000 0.004 0.00 0.10 J 0.004 0.010 0.10 0.25 K 0.017 REF 0.425 REF

RNJL0.026 BSC 0.650 BSCC N 0.028 REF 0.700 REF

R 0.031 0.039 0.80 1.00 0.05 (0.002) S 0.079 0.087 2.00 2.20

HKV0.012 0.016 0.30 0.40

STYLE 5: PIN 1. ANODE 2. ANODE

CASE 419-02 3. CATHODE ISSUE H SC–70/SOT–323

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: email is hidden – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 6 ◊ Motorola Small–Signal Transistors, FETs and Diodes DBeAvVic7e0W DTa1t/aD]
15

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