Download: DATA SHEET BAT18 Band-switching diode

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D088 BAT18 Band-switching diode Product specification 1996 Mar 13 Supersedes data of April 1991 File under Discrete Semiconductors, SC01 FEATURES DESCRIPTION PINNING • Continuous reverse voltage: Planar high performance PIN DESCRIPTION max. 35 V band-switching diode in a small 1 anode • Continuous forward current: rectangular plastic SOT23 SMD package. 2 not connectedmax. 100 mA 3 cathode • Low diode capacitance: max. 1.0 pF • Low diode forward resistance: max. 0.7 Ω. handbook, halfpa2ge121APPLICATION n.c. • Band switching. 3 3 MAM185 Marking...
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DISCRETE SEMICONDUCTORS

DATA SHEET

book, halfpage M3D088

BAT18 Band-switching diode

Product specification 1996 Mar 13 Supersedes data of April 1991 File under Discrete Semiconductors, SC01, FEATURES DESCRIPTION PINNING • Continuous reverse voltage: Planar high performance PIN DESCRIPTION max. 35 V band-switching diode in a small 1 anode • Continuous forward current: rectangular plastic SOT23 SMD package. 2 not connectedmax. 100 mA 3 cathode • Low diode capacitance: max. 1.0 pF • Low diode forward resistance: max. 0.7 Ω. handbook, halfpa2ge121APPLICATION n.c. • Band switching. 3 3 MAM185 Marking code: A2. Fig.1 Simplified outline (SOT23) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VR continuous reverse voltage − 35 V IF continuous forward current − 100 mA Tstg storage temperature −55 +125 °C Tj junction temperature − 125 °C ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT VF forward voltage IF = 100 mA; see Fig.2 − 1.2 V IR reverse current see Fig.3 VR = 20V − 100 nA VR = 20 V; Tj = 60 °C − 1 µA Cd diode capacitance f = 1 MHz; VR = 20 V; see Fig.4 0.8 1.0 pF rD diode forward resistance IF = 5 mA; f = 200 MHz; see Fig.5 0.5 0.7 Ω THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point 330 K/W Rth j-a thermal resistance from junction to ambient note 1 500 K/W Note 1. Device mounted on a FR4 printed-circuit board. 1996 Mar 13 2,

GRAPHICAL DATA

MBG312 MBG311 100 5 handbook, halfpage handboo1k,0 halfpageIR(nA) (1) (2) (3) 104IF(mA) 50 102 0 10−1 0 0.51VF(V) 1.5 0 50 100 Tj ( o C) 150 (1) Tj = 60 °C; typical values. VR = 20 V. (2) Tj = 25 °C; typical values. Solid line: maximum values. (3) Tj = 25 °C; maximum values. Dotted line: typical values.

Fig.2 Forward current as a function of Fig.3 Reverse current as a function of

forward voltage. junction temperature. MBG313 MBG314 1.5 2 handbook, halfpage handbook, halfpage Cd (pF) rD (Ω) 0.50010−1 1 10 2 2VR (V) 10 1 10 IF (mA) f = 1 MHz; Tj = 25 °C. f = 200 MHz; Tj = 25 °C.

Fig.4 Diode capacitance as a function of reverse Fig.5 Diode forward resistance as a function of

voltage; typical values. forward current; typical values. 1996 Mar 13 3, PACKAGE OUTLINE 3.0 dbook, full pagewidth 2.8

B

1.9 0.150 0.75 0.090 0.95 A 0.2MAB0.60210.1 10o max max 1.4 2.5 1.2 max 10o max 1.1 0 max 30o 0.48 0.1 0.1MABMBC846 max TOP VIEW Dimensions in mm. Fig.6 SOT23.

DEFINITIONS

Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Mar 13 4]
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