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DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D186 BC875; BC879 NPN Darlington transistors Product specification 1999 May 28 Supersedes data of 1997 Apr 22 FEATURES PINNING • High DC current gain (min. 1000) PIN DESCRIPTION • High current (max. 1 A) 1 base • Low voltage (max. 80 V) 2 collector • Integrated diode and resistor. 3 emitter APPLICATIONS handbook, halfpage • Relay drivers. 211DESCRIPTION 3 NPN Darlington transistor in a TO-92 (SOT54) plastic package. PNP complement: BC878. MAM307 3 Fig.1 Simplified outline (TO-92; SOT54) and symbol. LIMITING VALUES In accordance with the Absol...
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DISCRETE SEMICONDUCTORS

DATA SHEET

book, halfpage M3D186

BC875; BC879 NPN Darlington transistors

Product specification 1999 May 28 Supersedes data of 1997 Apr 22, FEATURES PINNING • High DC current gain (min. 1000) PIN DESCRIPTION • High current (max. 1 A) 1 base • Low voltage (max. 80 V) 2 collector • Integrated diode and resistor. 3 emitter

APPLICATIONS

handbook, halfpage • Relay drivers. 211DESCRIPTION 3 NPN Darlington transistor in a TO-92 (SOT54) plastic package. PNP complement: BC878. MAM307 3 Fig.1 Simplified outline (TO-92; SOT54) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter BC875 − 60 V BC879 − 100 V VCES collector-emitter voltage VBE = 0 BC875 − 45 V BC879 − 80 V VEBO emitter-base voltage open collector − 5 V IC collector current (DC) − 1 A ICM peak collector current − 2 A IB base current (DC) − 0.2 A Ptot total power dissipation Tamb ≤ 25 °C; note 1 − 0.83 W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Note 1. Transistor mounted on an FR4 printed-circuit board. 1999 May 28 2, THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 150 K/W Note 1. Transistor mounted on an FR4 printed-circuit board.

CHARACTERISTICS

Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICES collector cut-off current BC875 VBE = 0; VCE = 45 V − − 50 nA BC879 VBE = 0; VCE = 80 V − − 50 nA IEBO emitter cut-off current IC = 0; VEB = 4 V − − 50 nA hFE DC current gain IC = 150 mA; VCE = 10 V; see Fig.2 1000 − − IC = 0.5 A; VCE = 10 V; see Fig.2 2000 − − VCEsat collector-emitter saturation voltage IC = 0.5 A; IB = 0.5 mA − − 1.3 V IC = 1 A; IB = 1 mA − − 1.8 V VBEsat base-emitter saturation voltage IC = 1 A; IB = 1 mA − − 2.2 V fT transition frequency IC = 0.5 A; VCE = 5 V; f = 100 MHz − 200 − MHz Switching times (between 10% and 90% levels) ton turn-on time ICon = 500 mA; IBon = 0.5 mA; − 500 − ns t turn-off time IBoff = −0.5 mAoff − 1300 − ns 1999 May 28 3, MGD838 handbook, full pagewidth hFE 10−1 1 10 102 103 IC (mA) VCE = 10 V. Fig.2 DC current gain; typical values. 1999 May 28 4, PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads SOT54 c

E

dALbe21Deb1 L1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNITAbb1cDdEee1LL(1) 5.2 0.48 0.66 0.45 4.8 1.7 4.2 14.5 mm 5.0 0.40 0.56 0.40 4.4 1.4 3.6 2.54 1.27 12.7 2.5 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC EIAJ PROJECTION SOT54 TO-92 SC-43 97-02-28 1999 May 28 5,

DEFINITIONS

Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 May 28 6,

NOTES

1999 May 28 7,

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