Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY208 UHF amplifier module Objective specification 1996 May 22 File under Discrete Semiconductors, SC09

DISCRETE SEMICONDUCTORS DATA SHEET BGY208 UHF amplifier module Objective specification 1996 May 22 File under Discrete Semiconductors, SC09 FEATURES PINNING - SOT388A • 6.8 V nominal supply voltage PIN DESCRIPTION • 3.5 W output power 1 RF input • Easy output power control by DC voltage. 2 VC 3 VS APPLICATIONS 4 RF output • Digital cellular radio systems with Time Division Multiple Flange ground Access (TDMA) operation (GSM systems) in the 880 to 915 MHz frequency range. DESCRIPTION The BGY208 is a three-stage UHF amplifier module in a SOT388A package. The module consists of three NPN silicon ...
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DISCRETE SEMICONDUCTORS

DATA SHEET BGY208 UHF amplifier module

Objective specification 1996 May 22 File under Discrete Semiconductors, SC09, FEATURES PINNING - SOT388A • 6.8 V nominal supply voltage PIN DESCRIPTION • 3.5 W output power 1 RF input • Easy output power control by DC voltage. 2 VC 3 VS APPLICATIONS 4 RF output • Digital cellular radio systems with Time Division Multiple Flange ground Access (TDMA) operation (GSM systems) in the 880 to 915 MHz frequency range.

DESCRIPTION

The BGY208 is a three-stage UHF amplifier module in a SOT388A package. The module consists of three NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized1234ceramic substrate. Top view MSA486 Fig.1 Simplified outline. QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OF f VS VC PL Gp η ZS; ZL OPERATION (MHz) (V) (V) (W) (dB) (%) (Ω) Pulsed; δ = 1 : 8 880 to 915 6.8 ≤3.5 3.5 ≥30.7 typ. 45 50 1996 May 22 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VS DC supply voltage − 8.5 V VC DC control voltage − 4 V PD input drive power − 10 mW PL load power − 4 W Tstg storage temperature −40 +100 °C Tmb operating mounting base temperature −30 +100 °C

CHARACTERISTICS

ZS = ZL = 50 Ω; PD = 3 mW; VS = 6.8 V; VC ≤ 3.5 V; f = 880 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT IQ quiescent current VC = 0.5 V − − 100 µA IC control current adjust VC for PL = 3.5 W − − 500 µA PL load power VC = 3.5 V 3.5 − − W Gp power gain adjust VC for PL = 3.5 W 30.7 − − dB η efficiency adjust VC for PL = 3.5 W − 45 − % H2 second harmonic adjust VC for PL = 3.5 W − − −40 dBc H3 third harmonic adjust VC for PL = 3.5 W − − −40 dBc VSWRin input VSWR adjust VC for PL = 3.5 W − − 3 : 1 stability PD = 1.5 to 6 mW; VS = 5 to 8.5 V; − − −60 dBc VC = 0 to 3.5 V; PL ≤ 3.5 W; VSWR ≤ 6 : 1 through all phases isolation VC = 0.5 V − − −36 dBm control bandwidth 1 − − MHz Pn noise power PL = 3.5 W; bandwidth = 30 kHz; − − −85 dBm 20 MHz above transmitter band ruggedness VS = 8.5 V; adjust VC for PL = 3.5 W no degradation VSWR ≤ 10 : 1 through all phases 1996 May 22 3,

SOLDERING

The indicated temperatures are those at the solder MLB740 interfaces. 300 handbook, halfpage Advised solder types are types with a liquidus less than or Tmb equal to 210 °C. ( o C) Solder dots or solder prints must be large enough to wet the contact areas. Footprints for soldering should cover the module contact area +0.1 mm on all sides. Soldering can be carried out using a conveyor oven, a hot 100 air oven, an infrared oven or a combination of these ovens. Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. 0 0 100 200 300 t (s) 400 The maximum temperature profile and soldering time is indicated as follows (see Fig.2): t = 350 s at 100 °C Fig.2 Maximum allowable temperature profile. t = 300 s at 125 °C t = 200 s at 150 °C t = 100 s at 175 °C t = 50 s at 200 °C t = 5 s at 250 °C (maximum temperature). Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) • Triclean B/S • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 1996 May 22 4, PACKAGE OUTLINE handbook, full pagewidth 17.3 16.9 0.2 17.1 max 16.7 2.2 1.8 0.15 7.7 7.3 12.2 11.8 0.7 0.3 3.45 3.0512340.30 0.20 0.56 (4×) 0.46 0.25 M 2.3 1.9 5.08 5.08 2.54 (4×) MSA485 Dimensions in mm. Fig.3 SOT388A. 1996 May 22 5,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 22 6]
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