Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY203 UHF amplifier module Product specification 1996 May 23 Supersedes data of May 1994 File under Discrete Semiconductors, SC09

DISCRETE SEMICONDUCTORS DATA SHEET BGY203 UHF amplifier module Product specification 1996 May 23 Supersedes data of May 1994 File under Discrete Semiconductors, SC09 FEATURES PINNING - SOT342A • 6 V nominal supply voltage PIN DESCRIPTION • 3.2 W output power 1 RF input • Easy control of output power by pulsed DC voltage. 2 VC 3 VS1 APPLICATIONS 4 VS2 • Digital cellular radio systems with Time Division Multiple 5 RF output Access (TDMA) operation (GSM systems) in the Flange ground 880 to 915 MHz frequency range. DESCRIPTION The BGY203 is a four-stage UHF amplifier module in a SOT342A package. T...
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DISCRETE SEMICONDUCTORS

DATA SHEET BGY203 UHF amplifier module

Product specification 1996 May 23 Supersedes data of May 1994 File under Discrete Semiconductors, SC09, FEATURES PINNING - SOT342A • 6 V nominal supply voltage PIN DESCRIPTION • 3.2 W output power 1 RF input • Easy control of output power by pulsed DC voltage. 2 VC 3 VS1 APPLICATIONS 4 VS2 • Digital cellular radio systems with Time Division Multiple 5 RF output Access (TDMA) operation (GSM systems) in the Flange ground 880 to 915 MHz frequency range.

DESCRIPTION

The BGY203 is a four-stage UHF amplifier module in a SOT342A package. The module consists of four NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic substrate. 12345Top view MSA384 Fig.1 Simplified outline. QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OF f VS1; VS2 VC PL Gp η ZS; ZL OPERATION (MHz) (V) (V) (W) (dB) (%) (Ω) Pulsed; δ = 1 : 8 880 to 915 6 ≤3.5 3.2 ≥35 ≥35 50 1996 May 23 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS. MIN. MAX. UNIT VS1 DC supply voltage VC = 3.5 V − 8.5 V VS2 DC supply voltage VC = 3.5 V − 8.5 V VC DC control voltage − 4 V PD input drive power − 2 mW PL load power − 4 W Tstg storage temperature −40 +100 °C Tmb operating mounting base temperature −30 +100 °C

CHARACTERISTICS

ZS = ZL = 50 Ω; PD = 1 mW; VS1 = VS2 = 6 V; VC ≤ 3.5 V; f = 880 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT IQ1 + IQ2 total leakage current VC ≤ 0.5 V − 0.2 mA IC control current adjust VC for PL = 3.2 W − 0.5 mA PL load power 3.2 − W Gp power gain adjust VC for PL = 3.2 W 35 − dB η efficiency adjust VC for PL = 3.2 W 35 − % H2 second harmonic adjust VC for PL = 3.2 W − −40 dBc H3 third harmonic adjust VC for PL = 3.2 W − −40 dBc VSWRin input VSWR adjust VC for PL = 3.2 W − 2 : 1 stability PD = 0.5 to 2 mW; VS1 = VS2 = 5 to 8.5 V; − −60 dBc VC = 0 to 3.5 V; PL ≤ 3.5 W; VSWR ≤ 6 : 1 through all phases isolation VC ≤ 0.5 V − −36 dBm control bandwidth 1 − MHz Pn noise power PL = 3.2 W; bandwidth = 30 kHz; − −85 dBm 20 MHz above transmitter band ruggedness VS1 = VS2 = 8.5 V; adjust VC for PL = 3.5 W; no degradation VSWR ≤ 10 : 1 through all phases 1996 May 23 3, MGD434 MGD435 handbook, halfpage handbook, 4 h0alfpage P VS = 7.5 V

PL

L (dBm) (W) f = 880 MHz6V890 MHz 900 MHz 5.4 V 915 MHz5V−20 0 −40 1.5 2.0 2.5 3.0 3.5 1.5 2.0 2.5 3.0 3.5 VC (V) VC (V) ZS = ZL = 50 Ω; PD = 1 mW; f = 902 MHz; ZS = ZL = 50 Ω; PD = 1 mW; VS1 = VS2 = 6 V; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.

Fig.2 Load power as a function of control voltage; Fig.3 Load power as a function of control voltage;

typical values. typical values. MGD436 MGD437 handbook, halfpage 5handbook, halfpage PL PL (W) (W) 4 VS = 6V4890 MHz 5.4 V 915 MHz35V3221100870 890 910 930 −40 0 40 80 120 f (MHz) Tmb ( oC) ZS = ZL = 50 Ω; PD = 1 mW; VC = 3.5 V; ZS = ZL = 50 Ω; PD = 1 mW; VS1 = VS2 = 6 V; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. VC = 3.5 V; δ = 1 : 8; tp = 575 µs.

Fig.4 Load power as a function of frequency; Fig.5 Load power as a function of mounting base

typical values. temperature; typical values. 1996 May 23 4, MGD433 MLB637 10 50 50 handbook, halfpage handbook, halfpageH2, H3ηηη(%) (dBc) (%) 20 40 40 30 30 30 40 20 20 H2 50 10 10 H3 6000870 890 910 93001234f(MHz) PL (W) ZS = ZL = 50 Ω; PD = 1 mW; VS1 = VS2 = 6 V; ZS = ZL = 50 Ω; PD = 1 mW; VS1 = VS2 = 6 V; PL = 3.2 W; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. f = 902 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.

Fig.6 Harmonics and efficiency as functions Fig.7 Efficiency as a function of load power;

of frequency; typical values. typical values. MLB639 MLB640 0 20 35 20 handbook, halfpage handbook, halfpage gain phase gain phase (dB) (deg) (dB) (deg) phase 10 20 25 20 phase gain gain 20 60 15 60 30 100 5 100 10 102 103423f (kHz) 10 10 10 10 f (kHz) 10 ZS = ZL = 50 Ω; PD = 1 mW; VS1 = VS2 = 6 V; ZS = ZL = 50 Ω; PD = 1 mW; VS1 = VS2 = 6 V; PL = 35 dBm; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs. PL = 15 dBm; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.

Fig.8 Control bandwidth in terms of gain Fig.9 Control bandwidth in terms of gain

and phase shift as functions of and phase shift as functions of frequency; typical values. frequency; typical values. 1996 May 23 5, handbook, full pagewidth12345L1 C1 L2 R2 Z1 Z2 R1 C2 C3 MBD651 RF VC VS1 VS2 RF input output Fig.10 Test circuit. input output 50 VC VS1 VS2 MBD652 Dimensions in mm. Fig.11 Printed-circuit board layout. 1996 May 23 6, List of components (see Fig.10) COMPONENT DESCRIPTION VALUE CATALOGUE NO. C1 multilayer ceramic chip capacitor 470 pF − C2 tantalum capacitor 2.2 µF − C3 electrolytic capacitor 68 µF − L1, L2 1 turn 0.4 mm copper wire on grade 3B core 0.9 µH 4330 030 32221 Z1, Z2 stripline; note 1 50 Ω − R1 metal film resistor 80 Ω; 0.4 W − R2 metal film resistor 5 Ω; 0.4 W − Note 1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2); thickness 1⁄16 inch. 1996 May 23 7,

SOLDERING

The indicated temperatures are those at the solder interfaces. MLB740300 handbook, halfpage Advised solder types are types with a liquidus less than or

T

equal to 210 °C. mb ( o C) Solder dots or solder prints must be large enough to wet the contact areas. 200 Footprints for soldering should cover the module contact area +0.1 mm on all sides. Soldering can be carried out using a conveyor oven, a hot 100 air oven, an infrared oven or a combination of these ovens. Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. 0 0 100 200 300 t (s) 400 The maximum temperature profile and soldering time is indicated as follows (see Fig.12): t = 350 s at 100 °C Fig.12 Maximum allowable temperature profile. t = 300 s at 125 °C t = 200 s at 150 °C t = 100 s at 175 °C t = 50 s at 200 °C t = 5 s at 250 °C (maximum temperature). Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) • Triclean B/S • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 1996 May 23 8, PACKAGE OUTLINE handbook, full pagewidth 36.4 36.2 1.55 33.5 1.35 33.3 3.9 3.7 3.1 (4×) 2.9 5.1 4.9 11.5 11.3 6.8 6.4 2.6 1.2 MSA383123452.2 min 0.55 (5×) 0.45 0.25 M (5×) 0.30 0.1 3.0 0.20 2.8 5.08 10.16 10.16 5.08 Dimensions in mm. Fig.13 SOT342A. 1996 May 23 9,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 23 10]
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