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DISCRETE SEMICONDUCTORS DATA SHEET BGY1816 UHF amplifier module Preliminary specification 1996 Feb 05 File under Discrete Semiconductors, SC08b FEATURES DESCRIPTION • 26 V nominal supply voltage The BGY1816 is a three-stage UHF amplifier module in a • 16 W output power into a load of 50 Ω with an RF drive SOT365 package with a plastic cap. It consists of three power of 18 dBm. NPN silicon planar transistors mounted on a metallized ceramic AlN substrate, together with matching and bias circuitry. APPLICATION • Base station transmitting equipment operating in the 1805 to 1880 MHz frequency band....
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DISCRETE SEMICONDUCTORS
DATA SHEET BGY1816 UHF amplifier module
Preliminary specification 1996 Feb 05 File under Discrete Semiconductors, SC08b, FEATURES DESCRIPTION • 26 V nominal supply voltage The BGY1816 is a three-stage UHF amplifier module in a • 16 W output power into a load of 50 Ω with an RF drive SOT365 package with a plastic cap. It consists of three power of 18 dBm. NPN silicon planar transistors mounted on a metallized ceramic AlN substrate, together with matching and bias circuitry.APPLICATION
• Base station transmitting equipment operating in the 1805 to 1880 MHz frequency band. handbook, halfpage PINNING-SOT365 PIN DESCRIPTION 1 RF input1234MSA447 2 VS1 3 VS2 4 RF output Fig.1 Simplified outline. flange ground QUICK REFERENCE DATA RF performance at Tmb = 25 °C. fVVPGηZ; Z MODE OF OPERATION S1 S2LpSL(MHz) (V) (V) (W) (dB) (%) (Ω) CW 1805 to 1880 5 26 16 ≥24 ≥33 50 1996 Feb 05 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VS1 DC supply voltage 4.5 5.5 V VS2 DC supply voltage − 28 V PD input drive power − 120 mW PL load power Tmb = 25 °C − 20 W Tstg storage temperature −30 +100 °C Tmb operating mounting base −10 +90 °C temperatureCHARACTERISTICS
Tmb = 25 °C; VS1 = 5 V; VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency 1805 − 1880 MHz IS1 supply current − − 50 mA IS2 supply current PD < −60 dBm − 310 − mA PL load power 16 − − W GP power gain 24 − 28 dB ∆GP gain ripple peak to peak − − 1 dB η efficiency 33 − − % H2 second harmonic − − −35 dBc H3 third harmonic − − −45 dBc VSWRin input VSWR − − 1.6 : 1 isolation VS1 = 0 − − −40 dBm stability VSWR ≤ 2 : 1 through all phases; − − −60 dBc PL ≤ 16 W; VS2 = 25 to 27 V reverse intermodulation Pcarrier = 16 W; Preverse = −40 dBc; − − −53 dBc fi = fc ±200 kHz F noise figure 20 MHz offset from carrier − − −97 dBm/Hz ruggedness VSWR ≤ 5 : 1 through all phases no degradation 1996 Feb 05 3, MGD187 MGD186 30 60 30 handbook, halfpage handbook, halfpageG
G pp η PL (dB) (%) (W) 20 40 20 η 10 20 10000010 20 30 0 40 80 120 PL (W) PIN (mW) f = 1850 MHz; VS1 = 5 V; VS2 = 26 V; ZS =ZL = 50 W; Tmb = 25 °C. f = 1850 MHz; VS1 = 5 V; VS2 = 26 V; ZS =ZL = 50 W; Tmb = 25 °C. Fig.2 Power gain and efficiency as functions of Fig.3 Load power as a function of input load power; typical values. power; typical values. 1996 Feb 05 4, PACKAGE OUTLINE handbook, full pagewidth 9.5 9.0 0.1 3.15 3.25 B 48.4 48.2 0.2 B 40.74 40.54 0.2 30.1 B 29.9C
7.75 7.55 15.4 4.1 16.6 15.2 3.9 16.4 6.5 0.312346.1 0.2 0.56 0.46 0.25 M 4.0 3.8 17.78 12.7 MSA446 2.54 2.54 Dimensions in mm. Fig.4 SOT365. 1996 Feb 05 5 0.2 C,DEFINITIONS
Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Feb 05 6]15
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