Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY148A; BGY148B UHF amplifier modules Preliminary specification 1996 May 20 File under Discrete Semiconductors, SC09

DISCRETE SEMICONDUCTORS

DATA SHEET BGY148A; BGY148B UHF amplifier modules

Preliminary specification 1996 May 20 File under Discrete Semiconductors, SC09, FEATURES PINNING - SOT421A • Single6Vnominal supply voltage PIN DESCRIPTION • 3 W output power 1 RF input • Easy control of output power by DC voltage 2 VC • Silicon bipolar technology 3 VS • Standby current less than 100 µA. 4 RF output Flange ground

APPLICATIONS

• Portable communication equipment operating in the 400 to 440 MHz and 430 to 488 MHz frequency ranges handbook, halfpage respectively.

DESCRIPTION

The BGY148A and BGY148B are three-stage UHF amplifier modules in a SOT421A package. Each module consists of three NPN silicon planar transistor dies1234mounted together with matching and bias circuit Top view MSA483 components on a metallized ceramic substrate. The modules produce an output power of3Winto a load of Fig.1 Simplified outline. 50 Ω with an RF power of 10 mW. QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OFfVPGηZ; Z TYPESLpSLOPERATION (MHz) (V) (W) (dB) (%) (Ω) BGY148A CW 400 to 440 6 ≥3 ≥24.8 typ. 53 50 BGY148B CW 430 to 488 6 ≥3 ≥24.8 typ. 53 50 1996 May 20 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VS DC supply voltage − 8.5 V VC DC control voltage − 4 V PD input drive power − 20 mW PL load power − 3.5 W Tstg storage temperature −40 +100 °C Tmb operating mounting-base temperature −30 +100 °C

CHARACTERISTICS

ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; VC ≤ 3.5 V; Tmb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency range BGY148A 400 − 440 MHz BGY148B 430 − 488 MHz IQ total quiescent current VC = 0; PD = 0 − − 100 µA IC control current adjust VC for PL = 3 W − − 500 µA PL load power 3 − − W Gp power gain adjust VC for PL = 3 W 24.8 − − dB η efficiency adjust VC for PL = 3 W 46 53 − % H2 second harmonic adjust VC for PL = 3 W − − −38 dBc H3 third harmonic adjust VC for PL = 3 W − − −38 dBc VSWRin input VSWR adjust VC for PL = 3 W − − 3 : 1 control range VC = 0 to 3.5 V 10 − − dB stability PD = 5 to 20 mW; VS = 5 to 8.5 V; − − −60 dBc PL ≤ 3.5 W; VSWR ≤ 4 : 1 through all phases ruggedness VS = 8.5 V; adjust VC for PL = 3.5 W; no degradation VSWR ≤ 4 : 1 through all phases 1996 May 20 3, MGD553 MGD554 5 60 handbook, halfpage handbook, halfpage

PL

(W) 400 MHz η (%) 4 440 MHz 440 MHz 400 MHz000123401234VC (V) PL (W) ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C. Fig.2 Load power as a function of control voltage; Fig.3 Efficiency as a function of load power; BGY148A; typical values. BGY148A; typical values. MGD555 MGD556 5 60 handbook, halfpage handbook, halfpage

PL

(W) η (%) 0 0 380 400 420 440 460 380 400 420 440 460 f (MHz) f (MHz) ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; VC = 3.5 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C. Fig.4 Load power as a function of frequency; Fig.5 Efficiency as a function of frequency; BGY148A; typical values. BGY148A; typical values. 1996 May 20 4, MGD557 MGD558 4 3.0 −30 handbook, halfpage VC VSWRin H2, H(V) 3 (dBc) 3 2.5 −40 VSWRin H3 2 2.0 VC H2 −50 1 1.5 0 1.0 −60 380 400 420 440 460 380 400 420 440 460 f (MHz) f (MHz) ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; PL = 3 W; Tmb = 25 °C. Fig.6 Control voltage and input VSWR as functions Fig.7 Harmonics as a function of frequency; of frequency; BGY148A; typical values. BGY148A; typical values. MGD559 MGD560 5 60 handbook, halfpage handbook, halfpage PL 430 MHz (W) η (%) 4 430 MHz 488 MHz 488 MHz000123401234VC (V) PL (W) ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C. Fig.8 Load power as a function of control voltage; Fig.9 Efficiency as a function of load power; BGY148B; typical values. BGY148B; typical values. 1996 May 20 5, MGD561 MGD562 5 60 handbook, halfpage handbook, halfpage

PL

(W) η (%) 0 0 420 440 460 480 500 420 440 460 480 500 f (MHz) f (MHz) ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; VC = 3.5 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C. Fig.10 Load power as a function of frequency; Fig.11 Efficiency as a function of frequency; BGY148B; typical values. BGY148B; typical values. MGD563 MGD564 4 3.0 −30 handbook, halfpage VC VSWR Hin 2, H3 (V) (dBc) 3 2.5 −40 H2 2 VC 2.0 −50 H3 VSWRin 1 1.5 −60 0 1.0 −70 420 440 460 480 500 420 440 460 480 500 f (MHz) f (MHz) ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; PL = 3 W; Tmb = 25 °C. Fig.12 Control voltage and input VSWR as functions Fig.13 Harmonics as a function of frequency; of frequency; BGY148B; typical values. BGY148B; typical values. 1996 May 20 6,

SOLDERING

The indicated temperatures are those at the solder interfaces. MLB740 handbook, halfpage Advised solder types are types with a liquidus less than or equal to 210 °C. Tmb ( o C) Solder dots or solder prints must be large enough to wet the contact areas. 200 Footprints for soldering should cover the module contact area +0.1 mm on all sides. Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. 100 Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. The maximum temperature profile and soldering time is 0 100 200 300 t (s) 400 indicated as follows (see Fig.14): t = 350 s at 100 °C t = 300 s at 125 °C t = 200 s at 150 °C t = 100 s at 175 °C Fig.14 Maximum allowable temperature profile. t = 50 s at 200 °C t = 5 s at 250 °C (maximum temperature). Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) • Triclean B/S • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 1996 May 20 7, PACKAGE OUTLINE handbook, full pagewidth 22.4 22.0 0.25 22.1 0.05 21.7 3.0 2.6 0.15 8.2 13.4 7.8 13.0 0.7 0.3 3.4 3.012340.30 0.20 0.56 (4×) 0.46 0.25 M 2.4 2.0 5.08 7.62 5.08 (4×) MSA482 Dimensions in mm. Fig.15 SOT421A. 1996 May 20 8,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 20 9]

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