Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY135; BGY136 VHF power amplifier modules Product specification 1996 May 08 Supersedes data of June 1993 File under Discrete Semiconductors, SC09

DISCRETE SEMICONDUCTORS DATA SHEET BGY135; BGY136 VHF power amplifier modules Product specification 1996 May 08 Supersedes data of June 1993 File under Discrete Semiconductors, SC09 FEATURES PINNING - SOT132B • 12.5 V nominal supply voltage PIN DESCRIPTION • 18 W output power. 1 RF input 2 ground APPLICATIONS 3 VS1 • Mobile communication equipment operating directly 4 ground from 12 V vehicle electrical systems. 5 VS2 6 ground DESCRIPTION 7 RF output The BGY135 and BGY136 are two-stage broadband RF Flange ground amplifier modules in a SOT132B package. Each module consists of two NPN transistor...
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DISCRETE SEMICONDUCTORS

DATA SHEET BGY135; BGY136 VHF power amplifier modules

Product specification 1996 May 08 Supersedes data of June 1993 File under Discrete Semiconductors, SC09, FEATURES PINNING - SOT132B • 12.5 V nominal supply voltage PIN DESCRIPTION • 18 W output power. 1 RF input 2 ground APPLICATIONS 3 VS1 • Mobile communication equipment operating directly 4 ground from 12 V vehicle electrical systems. 5 VS2 6 ground DESCRIPTION 7 RF output The BGY135 and BGY136 are two-stage broadband RF Flange ground amplifier modules in a SOT132B package. Each module consists of two NPN transistor dies together with lumped-element matching components. handbook, halfpage1234567Top view MSB029 Fig.1 Simplified outline. QUICK REFERENCE DATA TYPE MODE OF f VS1; VS2 PD PL ZS; ZL NUMBER OPERATION (MHz) (V) (mW) (W) (Ω) BGY135 CW 132 to 156 12.5 150 ≥18 50 BGY136 CW 146 to 174

WARNING

Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO inserts are not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 1996 May 08 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VS1 DC supply voltage − 15.6 V VS2 DC supply voltage − 15.6 V Vi RF input voltage − 25 V Vo RF output voltage − 25 V PD input drive power − 300 mW PL load power − 25 W Tstg storage temperature −40 +100 °C Th heatsink operating temperature −20 +90 °C MRC267 handbook, 3h0alfpage

PL

(W) –50 0 50 100 Th (°C) VS1 = VS2 ≤ 12.5 V; VSWR = 1 : 1. Fig.2 Power derating curve. 1996 May 08 3,

CHARACTERISTICS

ZS = ZL = 50 Ω; PD = 150 mW; VS1 = VS2 = 12.5 V; Th = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency BGY135 132 − 156 MHz BGY136 146 − 174 MHz IQ2 leakage current VS1 = 0; PD = 0 − − 1 mA PL load power 18 − − W η efficiency adjust PD for PL = 18 W 38 45 − % H2 second harmonic adjust PD for PL = 18 W − − −25 dBc H3 third harmonic adjust PD for PL = 18 W − − −25 dBc VSWRin input VSWR adjust PD for PL = 18 W − 1.5 3 stability VS1 = VS2 = 10.8 to 15.6 V; − − −60 dBc PL = 2 to 20 W; VSWR = 3 : 1 ruggedness PD ≤ 300 mW; VS1 = VS2 = 15.6 V duration 5 s; no degradation PL < 25 W; VSWR = 50 : 1 MRC266 MRC261 35 30 handbooPk,L h alfpage handbook, halfpage (W) f = 146 MHz 30 PL (W) f = 161 MHz 25 132 MHz 144 MHz 20 174 MHz 156 MHz000100 200 300 0 100 200 300 PD (mW) PD (mW) VS1 = VS2 = 12.5 V. VS1 = VS2 = 12.5 V. Fig.3 Load power as a function of drive power; Fig.4 Load power as a function of drive power; BGY135; typical values. BGY136; typical values. 1996 May 08 4, MRC264 MRC259 60 60 handbook, halfpage handbook, halfpageηη(%) (%) 40 40 20 2000120 130 140 150 160 140 150 160 170 180 f (MHz) f (MHz) VS1 = VS2 = 12.5 V; PL = 18 W. VS1 = VS2 = 12.5 V; PL = 18 W. Fig.5 Efficiency as a function of frequency; Fig.6 Efficiency as a function of frequency; BGY135; typical values. BGY136; typical values. MRC274 MRC262 handbook, halfpage handbook, 3ha0lfpage VS = 12.5 VP PL L (W) (W) VS = 12.5 V10.8 V 20 20 10.8 V 10 1000120 130 140 150 160 140 150 160 170 180 f (MHz) f (MHz) PD = 150 mW. PD = 150 mW. Fig.7 Load power as a function of frequency; Fig.8 Load power as a function of frequency; BGY135; typical values. BGY136; typical values. 1996 May 08 5, MRC265 MRC260 –20 –20 handbook, halfpage handbook, halfpage H2, H3 H2, H3 (dBc) (dBc) –40 –40 H2 H2 –60 H3 –60 H3 –80 –80 120 130 140 150 160 140 150 160 170 180 f (MHz) f (MHz) VS1 = VS2 = 12.5 V; PL = 18 W. VS1 = VS2 = 12.5 V; PL = 18 W. Fig.9 Harmonics as a function of frequency; Fig.10 Harmonics as a function of frequency; BGY135; typical values. BGY136; typical values. MRC268 30 MRC263 handbook, halfpage 25handbook, halfpage

PL

P 146 MHzL 132 MHz (W) (W) 20 156 MHz 20 174 MHz00−25 0 50 100 –25 0 25 50 75 100 Tmb (°C) Tmb (°C) PD = 150 mW; VS1 = VS2 = 12.5 V. PD = 150 mW; VS1 = VS2 = 12.5 V. Fig.11 Load power as a function of mounting base Fig.12 Load power as a function of mounting base temperature; BGY135; typical values. temperature; BGY136; typical values. 1996 May 08 6, Test circuit information handbook, full pagewidth pin numbers1234567C1 C5 C2 C6 L1 L2 Z1 Z2 C3 C7 C4 C8 IS1 = IS2 = typ. 0.5 A typ. 2.5 A input VS1 VS2 output MRC273 Fig.13 Test circuit. handbook, full pagewidth MLB068 Dimensions in mm. Fig.14 Printed-circuit board layout. 1996 May 08 7, List of components (see Fig.13) COMPONENT DESCRIPTION VALUE CATALOGUE NO C1, C5 multilayer chip capacitor 1 nF 4822 590 06614 C2, C6 tantalum capacitor 6.8 µF, 35 V 2022 001 00067 C3, C7 multilayer chip capacitor 10 nF 2222 852 47103 C4, C8 multilayer chip capacitor 100 nF 2222 852 47104 L1, L2 1 turn 0.5 mm copper wire on ferrite coil 1 µH 3122 108 20153 Z1, Z2 stripline; note 1 50 Ω Note 1. The striplines are on a double copper-clad printed-circuit board, with epoxy dielectric (εr = 4.7), thickness 1⁄16 inch. 1996 May 08 8, PACKAGE OUTLINE 52.5 50.0 44.9 17.0 14.4 9.3 8.1 3.7 6.8 4.2 0.25 7.65 max123456719.7 3.3 61.0 A 8.5 17.0 3.5 0.5 0.2MA52.5 67.5 MBC876 Dimensions in mm. Fig.15 SOT132B. 1996 May 08 9,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 08 10]
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