Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY120A; BGY120B; BGY120D UHF amplifier modules Objective specification 1996 May 29 File under Discrete Semiconductors, SC09

DISCRETE SEMICONDUCTORS DATA SHEET BGY120A; BGY120B; BGY120D UHF amplifier modules Objective specification 1996 May 29 File under Discrete Semiconductors, SC09 FEATURES PINNING - SOT388A • Single 3.6 V nominal supply voltage PIN DESCRIPTION • 1.2 W output power 1 RF input • Easy control of output power by DC voltage 2 VC • Very high efficiency (typ. 55%) 3 VS • Silicon bipolar technology 4 RF output • Standby current less than 100 µA. Flange ground APPLICATIONS • Hand-held transmitting equipment operating in the 824 to 849 MHz, 872 to 905 MHz and 898 to 928 MHz frequency ranges. DESCRIPTION Th...
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DISCRETE SEMICONDUCTORS

DATA SHEET BGY120A; BGY120B; BGY120D UHF amplifier modules

Objective specification 1996 May 29 File under Discrete Semiconductors, SC09, FEATURES PINNING - SOT388A • Single 3.6 V nominal supply voltage PIN DESCRIPTION • 1.2 W output power 1 RF input • Easy control of output power by DC voltage 2 VC • Very high efficiency (typ. 55%) 3 VS • Silicon bipolar technology 4 RF output • Standby current less than 100 µA. Flange ground

APPLICATIONS

• Hand-held transmitting equipment operating in the 824 to 849 MHz, 872 to 905 MHz and 898 to 928 MHz frequency ranges.

DESCRIPTION

The BGY120A, BGY120B, and BGY120D are three-stage1234UHF amplifier modules in a SOT388A package. Top view MSA486 Each module consists of three NPN silicon planar transistor dies, mounted together with matching and bias components on a metallized ceramic substrate. The modules produce an output power of 1.2 W into a load Fig.1 Simplified outline. of 50 Ω with an RF drive power of 2 mW. QUICK REFERENCE DATA RF performance at Tmb = 25 °C. TYPE MODE OF f VS PL GP η ZS; ZL NUMBER OPERATION (MHz) (V) (W) (dB) (%) (Ω) BGY120A CW 824 to 849 3.6 1.2 ≥ 27.8 typ. 55 50 BGY120B CW 872 to 905 3.6 1.2 ≥ 27.8 typ. 55 50 BGY120D CW 898 to 928 3.6 1.2 ≥ 27.8 typ. 55 50 1996 May 29 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VS DC supply voltage − 5.5 V VC DC control voltage − 3.5 V PD input drive power − 5 mW PL load power − 1.6 W Tstg storage temperature −40 +100 °C Tmb operating mounting base temperature −30 +100 °C

CHARACTERISTICS

ZS = ZL = 50 Ω; PD = 2 mW; VS = 3.6 V; VC ≤ 3 V; Tmb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency BGY120A 824 − 849 MHz BGY120B 872 − 905 MHz BGY120D 898 − 928 MHz IQ total quiescent current VC = 0; PD < −60 dBm − − 100 µA IC control current adjust VC for PL = 1.2 W − − 500 µA PL load power 1.2 − − W Gp power gain adjust VC for PL = 1.2 W 27.8 − − dB η efficiency adjust VC for PL = 1.2 W 50 55 − % H2 second harmonic adjust VC for PL = 1.2 W − − −40 dBc H3 third harmonic adjust VC for PL = 1.2 W − − −40 dBc VSWRin input VSWR adjust VC for PL = 1.2 W − − 3 : 1 stability PD = 0 to +6 dBm; VS = 3 to 4.8 V; − − −60 dBc VC = 0 to 3 V; PL ≤ 1.2 W; VSWR ≤ 6 : 1 through all phases isolation VC = 0 − − −40 dBm Pn noise power adjust VC for PL = 1.2 W; − − −90 dBm bandwidth = 30 kHz; fn = fo + 45 MHz ruggedness VS = 4.8 V; no degradation adjust VC for PL = 1.4 W; VSWR ≤ 10 : 1 through all phases 1996 May 29 3,

SOLDERING

The indicated temperatures are those at the solder MLB740 interfaces. 300 handbook, halfpage Advised solder types are types with a liquidus less than or Tmb equal to 210 °C. ( o C) Solder dots or solder prints must be large enough to wet the contact areas. Footprints for soldering should cover the module contact area +0.1 mm on all sides. Soldering can be carried out using a conveyor oven, a hot 100 air oven, an infrared oven or a combination of these ovens. Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. 0 0 100 200 300 t (s) 400 The maximum temperature profile and soldering time is indicated as follows (see Fig.2): t = 350 s at 100 °C Fig.2 Maximum allowable temperature profile. t = 300 s at 125 °C t = 200 s at 150 °C t = 100 s at 175 °C t = 50 s at 200 °C t = 5 s at 250 °C (maximum temperature). Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) • Triclean B/S • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 1996 May 29 4, PACKAGE OUTLINE handbook, full pagewidth 17.3 16.9 0.2 17.1 max 16.7 2.2 1.8 0.15 7.7 7.3 12.2 11.8 0.7 0.3 3.45 3.0512340.30 0.20 0.56 (4×) 0.46 0.25 M 2.3 1.9 5.08 5.08 2.54 (4×) MSA485 Dimensions in mm. Fig.3 SOT388A. 1996 May 29 5,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 29 6]
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