Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY118A; BGY118B; BGY118D UHF amplifier modules Product specification 1996 May 21 Supersedes data of April 1994 File under Discrete Semiconductors, SC09

DISCRETE SEMICONDUCTORS

DATA SHEET BGY118A; BGY118B; BGY118D UHF amplifier modules

Product specification 1996 May 21 Supersedes data of April 1994 File under Discrete Semiconductors, SC09, FEATURES PINNING SOT321A • Single 4.8 V nominal supply voltage PIN DESCRIPTION • 1.2 W output power 1 RF input • Easy output power control by DC voltage 2 VC • Very high efficiency (typ. 55 %) 3 VS • Silicon bipolar technology 4 RF output • Standby current less than 100 µA. Flange ground

APPLICATIONS

• Hand-held transmitting equipment operating in the 824 to 849 MHz, 872 to 905 MHz and 898 to 928 MHz frequency ranges respectively.

DESCRIPTION

The BGY118A, BGY118B and BGY118D are three-stage1234UHF amplifier modules in a SOT321A package. Each module consists of three NPN silicon planar transistor Top view MSA487 chips mounted together with matching and bias circuit components on a metallized ceramic substrate. Fig.1 Simplified outline. QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OFfVPGηZ, Z TYPESLPSLOPERATION (MHz) (V) (W) (dB) (%) (Ω) BGY118A CW 824 to 849 4.8 1.2 ≥27.8 typ. 55 50 BGY118B CW 872 to 905 4.8 1.2 ≥27.8 typ. 55 50 BGY118D CW 898 to 928 4.8 1.2 ≥27.8 typ. 55 50 1996 May 21 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VS DC supply voltage − 7 V VC DC control voltage − 3.5 V PD input drive power − 5 mW PL load power − 1.6 W Tstg storage temperature −40 +100 ∞C Tmb operating mounting base temperature −30 +100 ∞C

CHARACTERISTICS

ZS = ZL = 50 W; PD = 2 mW; VS = 4.8 V; VC ≤ 3 V; Tmb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency BGY118A 824 − 849 MHz BGY118B 872 − 905 MHz BGY118D 898 − 928 MHz IQ total leakage current VC = 0; PD < −60 dBm − − 100 µA IC control current adjust VC for PL = 1.2 W − − 500 µA PL load power 1.2 − − W GP power gain adjust VC for PL = 1.2 W 27.8 - − dB η efficiency adjust VC for PL = 1.2 W 50 55 − % H2 second harmonic adjust VC for P = 1.2 W − − −40 dBc H3 third harmonic adjust VC for PL = 1.2 W − − −40 dBc VSWRin input VSWR adjust VC for PL = 1.2 W − − 3:1 stability PD = 0 to 6 dBm; VS = 4 to 6.5 V; − − −60 dBc VC = 0 to 3 V; PL ≤ 1.2 W; VSWR ≤ 6 : 1 through all phases isolation VC = 0 − − −40 dBm Pn noise power adjust VC for PL = 1.2 W; − − −90 dBm bandwidth = 30 kHz; note 1 ruggedness VS = 6.5 V; adjust VC for PL = 1.4 W; no degradation VSWR ≤ 10 : 1 through all phases Note 1. BGY118A, BGY118B: fn = fo + 45 MHz. BGY118D: fn = fo − 55 MHz. 1996 May 21 3, MLB604 MLB605 2 80 handbook, halfpage handbook, halfpage 824 MHz η (%) PL 60 (W) 849 MHz 824 MHz 849 MHz 1 40000123400.4 0.8 1.2 1.62VC(V) P L (W) ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C. Fig.2 Load power as a function of control Fig.3 Efficiency as a function of load power; voltage; BGY118A; typical values. BGY118A; typical values. MLB606 MLB60722handbook, halfpage handbook, halfpage VS = 4.8 V 824 MHz P PL L 849 MHz (W) (W) VS = 4V1100800 820 840 860 880 40 0 40 80 120o f (MHz) Tm b ( C) ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V; Tmb = 25 °C. Fig.4 Load power as a function of frequency; Fig.5 Load power as a function of mounting-base BGY118A; typical values. temperature; BGY118A; typical values. 1996 May 21 4, MLB608 MLB609 4 3.0 40 handbook, halfpage handbook, halfpage V PC L VSWR (dBm) 824 MHz (V) in 30 849 MHz 3 2.5 V 20C 2 2.0 VSWRin 10 1 1.5 0 1.0 −10 800 820 840 860 880 −30 −20 −10 0 10 f (MHz) PD (dBm) ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C. Fig.6 Control voltage and VSWR input as function Fig.7 Load power as a function of drive power; of frequency; BGY118A; typical values. BGY118A; typical values. MLB610 handbook, halfpageH2, H3 (dBc) H3 H2 800 820 840 860 880 f (MHz) ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C. Fig.8 Harmonics as a function of frequency; BGY118A; typical values. 1996 May 21 5, MLB611 MLB612 handbook, h2alfpage 80handbook, halfpage η 905 MHz (%) PL 60 (mW) 872 MHz 905 MHz 872 MHz 1 40000123400.4 0.8 1.2 1.62VC(V) P L (mW) ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C. Fig.9 Load power as a function of control Fig.10 Efficiency as a function of load power; voltage; BGY118B; typical values. BGY118B; typical values. MLB613 MLB61422handbook, halfpage handbook, halfpage 905 MHz PL PL 872 MHz (W) (W) 1100850 870 890 910 930 40 0 40 80 120 f (MHz) Tm b ( o C) ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V; Tmb = 25 °C. Fig.11 Load power as a function of frequency; Fig.12 Load power as a function of mounting-base BGY118B; typical values. temperature; BGY118B; typical values. 1996 May 21 6, MLB615 MLB616 4 3.0 40handbook, halfpage handbook, halfpage PL

VC

VSWR (dBm) (V) in 3 2.5 VC 905 MHz 2 2.0 VSWRin 872 MHz 1 1.5 0 1.0 −10 850 870 890 910 930 −30 −20 −10 0 10 f (MHz) PD (dBm) ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C. Fig.13 Control voltage and VSWR input as function Fig.14 Load power as a function of drive power; of frequency; BGY118B; typical values. BGY118B; typical values. MLB617 handbook, halfpageH2, H3 (dBc) H3 H2 850 870 890 910 930 f (MHz) ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C. Fig.15 Harmonics as a function of frequency; BGY118; typical values. 1996 May 21 7, MGD420 MGD421 handbook, halfpage 80handbook, halfpage η PL (%) (W) 898 MHz 898 MHz 928 MHz 928 MHz 1 40000123400.4 0.8 1.2 1.6 2 Vc (V) PL (W) Z = Z = 50 Ω; P = 2 mW; V 4.8 V; T = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.SLDSmb Fig.16 Load power as a function of control Fig.17 Efficiency as a function of load power; voltage; BGY118D; typical values. BGY118D; typical values. MGD422 MGD42322handbook, halfpage handbook, halfpage PL PL (W) (W) VS = 4.8 V 898 MHz 928 MHz14V100870 890 910 930 950 40 0 40 80 120 f (MHz) T omb ( C) ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C. Fig.18 Load power as a function of frequency; Fig.19 Load power as a function of mounting-base BGY118D; typical values. temperature; BGY118D; typical values. 1996 May 21 8, MGD417 MGD418 4 3.0 40 handbook, halfpage handbook, halfpagePL Vc VSWRin (dBm)(V) 3 2.5 898 MHz 928 MHz Vc 20 2 2.0

VSWR

1 1.5 0 1.0 −10 870 890 910 930 950 −30 −20 −10 0 10 f (MHz) PD (dBm) ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C. ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C. Fig.20 Control voltage and VSWR input as function Fig.21 Load power as a function of drive power; of frequency; BGY118D; typical values. BGY118D; typical values. MGD419 −20 handbook, halfpage H2, H3 (dBc) −30 −40 H2 H3 −50 −60 870 890 910 930 950 f (MHz) ZS = ZL = 50 Ω; PD = 2 mW; PL = 1.2 W; Tmb = 25 °C. Fig.22 Harmonics as a function of frequency; BGY118D; typical values. 1996 May 21 9, handbook, full pagewidth pin numbers1234L1 L2 Z1 C1 C4 Z2 C2 C6 C3 C5 RF input VC MSA914 VS RF output Fig.23 Test circuit. handbook, full pagewidth123450 Ω 50 Ω input outputVVMSA915C S Dimensions in mm. Fig.24 Printed-circuit board layout. 1996 May 21 10, List of components (See Fig.23) COMPONENT DESCRIPTION VALUE CATALOGUE NO. C1, C4 multilayer ceramic chip capacitor 100 nF 2222 852 47104 C2, C5 tantalum capacitor 2.2 µF; 35 V C3, C6 multilayer ceramic chip capacitor 33 pF 2222 851 13339 L1, L2 Ferroxcube coil 5 µH 3122 108 20153 Z1, Z2 stripline; note 1 50 Ω Note 1. The striplines are on a double copper-clad PCB with PTFE fibre-glass dielectric (er = 2.2); thickness 1/32 inch. 1996 May 21 11,

SOLDERING

The indicated temperatures are those at the solder interfaces. MLB740300 handbook, halfpage Advised solder types are types with a liquidus less than or

T

equal to 210 °C. mb ( o C) Solder dots or solder prints must be large enough to wet the contact areas. 200 Footprints for soldering should cover the module contact area +0.1 mm on all sides. Soldering can be carried out using a conveyor oven, a hot 100 air oven, an infrared oven or a combination of these ovens. Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. 0 0 100 200 300 t (s) 400 The maximum temperature profile and soldering time is indicated as follows (see Fig.25): t = 350 s at 100 °C Fig.25 Maximum allowable temperature profile. t = 300 s at 125 °C t = 200 s at 150 °C t = 100 s at 175 °C t = 50 s at 200 °C t = 5 s at 250 °C (maximum temperature). Cleaning The following fluids may be used for cleaning: • Alcohol • Bio-Act (Terpene Hydrocarbon) • Triclean B/S • Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product. 1996 May 21 12, PACKAGE OUTLINE handbook, full pagewidth 25.0 24.6 1.65 22.1 1.25 21.7 4.0 3.6 4.3 3.9 3.1 (4×) 2.9 5.1 13.4 4.9 13.0 2.4 1.2 MSA3522.21234min 0.55 (4×) 0.45 0.25 0.30 M 0.1 3.7 0.20 3.3 5.08 7.62 5.08 (4×) Dimensions in mm. Fig.26 SOT321A. 1996 May 21 13,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 21 14]

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