Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY885A 860 MHz, 18.5 dB push-pull amplifier Product specification 2001 Oct 22 Supersedes data of 1999 Mar 30

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D252 BGY885A 860 MHz, 18.5 dB push-pull amplifier Product specification 2001 Oct 22 Supersedes data of 1999 Mar 30 FEATURES PINNING - SOT115J • Excellent linearity PIN DESCRIPTION • Extremely low noise 1 input • Silicon nitride passivation 2, 3 common • Rugged construction 5 +VB • Gold metallization ensures excellent reliability. 7, 8 common 9 output DESCRIPTION Hybrid amplifier module for CATV systems operating over handbook, halfpage a frequency range of 40 to 860 MHz with a voltage supply2813579of 24 V (DC). Side view MSA319 Fig.1 Simplifi...
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DISCRETE SEMICONDUCTORS

DATA SHEET

book, halfpage M3D252

BGY885A

860 MHz, 18.5 dB push-pull amplifier Product specification 2001 Oct 22 Supersedes data of 1999 Mar 30, FEATURES PINNING - SOT115J • Excellent linearity PIN DESCRIPTION • Extremely low noise 1 input • Silicon nitride passivation 2, 3 common • Rugged construction 5 +VB • Gold metallization ensures excellent reliability. 7, 8 common 9 output

DESCRIPTION

Hybrid amplifier module for CATV systems operating over handbook, halfpage a frequency range of 40 to 860 MHz with a voltage supply2813579of 24 V (DC). Side view MSA319 Fig.1 Simplified outline. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Gp power gain f = 50 MHz 18 19 dB f = 860 MHz 18.5 − dB Itot total current consumption (DC) VB = 24 V − 240 mA LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER MIN. MAX. UNIT Vi RF input voltage − 65 dBmV Tstg storage temperature −40 +100 °C Tmb operating mounting base temperature −20 +100 °C 2001 Oct 22 2,

CHARACTERISTICS

Table 1 Bandwidth 40 to 860 MHz; VB = 24 V; Tmb = 30 °C; ZS = ZL = 75 Ω SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Gp power gain f = 50 MHz 18 18.5 19 dB f = 860 MHz 18.5 19.5 − dB SL slope cable equivalent f = 40 to 860 MHz 0 0.8 2 dB FL flatness of frequency response f = 40 to 860 MHz − ±0.2 ±0.3 dB S11 input return losses f = 40 to 80 MHz 20 31 − dB f = 80 to 160 MHz 18.5 30 − dB f = 160 to 320 MHz 17 27.5 − dB f = 320 to 640 MHz 15.5 25 − dB f = 640 to 860 MHz 14 20.5 − dB S22 output return losses f = 40 to 80 MHz 20 29 − dB f = 80 to 160 MHz 18.5 27.5 − dB f = 160 to 320 MHz 17 24 − dB f = 320 to 640 MHz 15.5 21 − dB f = 640 to 860 MHz 14 21 − dB S21 phase response f = 50 MHz −45 − +45 deg CTB composite triple beat 49 channels flat; Vo = 44 dBmV; − −65 −61 dB measured at 859.25 MHz Xmod cross modulation 49 channels flat; Vo = 44 dBmV; − −65 −61 dB measured at 55.25 MHz CSO composite second order 49 channels flat; Vo = 44 dBmV; − −67 −61 dB distortion measured at 860.5 MHz d2 second order distortion note 1 − −78 −70 dB Vo output voltage dim = −60 dB; note 2 58 60 − dBmV F noise figure f = 50 MHz − 4.5 5 dB f = 450 MHz − − 5.5 dB f = 550 MHz − − 5.5 dB f = 600 MHz − − 6 dB f = 650 MHz − − 6 dB f = 750 MHz − − 7 dB f = 860 MHz − 6 8 dB Itot total current consumption (DC) note 3 − 225 240 mA Notes 1. fp = 55.25 MHz; Vp = 44 dBmV; fq = 805.25 MHz; Vq = 44 dBmV; measured at fp + fq = 860.5 MHz. 2. Measured according to DIN45004B: fp = 851.25 MHz; Vp = Vo; fq = 858.25 MHz; Vq = Vo −6 dB; fr = 860.25 MHz; Vr = Vo −6 dB; measured at fp + fq − fr = 849.25 MHz. 3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V. 2001 Oct 22 3, Table 2 Bandwidth 40 to 750 MHz; VB = 24 V; Tmb = 30 °C; ZS = ZL = 75 Ω SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Gp power gain f = 50 MHz 18 18.5 19 dB f = 750 MHz 18.5 − − dB SL slope cable equivalent f = 40 to 750 MHz 0 − 1.5 dB FL flatness of frequency response f = 40 to 750 MHz − − ±0.3 dB S11 input return losses f = 40 to 80 MHz 20 31 − dB f = 80 to 160 MHz 18.5 30 − dB f = 160 to 320 MHz 17 27.5 − dB f = 320 to 640 MHz 15.5 25 − dB f = 640 to 750 MHz 14 20.5 − dB S22 output return losses f = 40 to 80 MHz 20 29 − dB f = 80 to 160 MHz 18.5 27.5 − dB f = 160 to 320 MHz 17 24 − dB f = 320 to 640 MHz 15.5 21 − dB f = 640 to 750 MHz 14 21 − dB S21 phase response f = 50 MHz −45 − +45 deg CTB composite triple beat 110 channels flat; Vo = 44 dBmV; − −55 −53 dB measured at 745.25 MHz Xmod cross modulation 110 channels flat; Vo = 44 dBmV; − −58 −57 dB measured at 55.25 MHz CSO composite second order 110 channels flat; Vo = 44 dBmV; − −65 −53 dB distortion measured at 746.5 MHz d2 second order distortion note 1 − − −65 dB Vo output voltage dim = −60 dB; note 2 59 − − dBmV F noise figure see Table 1 − − − dB Itot total current consumption (DC) note 3 − 225 240 mA Notes 1. fp = 55.25 MHz; Vp = 44 dBmV; fq = 691.25 MHz; Vq = 44 dBmV; measured at fp + fq = 746.5 MHz. 2. Measured according to DIN45004B: fp = 740.25 MHz; Vp = Vo; fq = 747.25 MHz; Vq = Vo −6 dB; fr = 749.25 MHz; Vr = Vo −6 dB; measured at fp + fq − fr = 738.25 MHz. 3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V. 2001 Oct 22 4, Table 3 Bandwidth 40 to 600 MHz; VB = 24 V; Tmb = 30 °C; ZS = ZL = 75 Ω SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Gp power gain f = 50 MHz 18 18.5 19 dB f = 600 MHz 18.5 − − dB SL slope cable equivalent f = 40 to 600 MHz 0 − 1.5 dB FL flatness of frequency response f = 40 to 600 MHz − − ±0.3 dB S11 input return losses f = 40 to 80 MHz 20 31 − dB f = 80 to 160 MHz 18.5 30 − dB f = 160 to 320 MHz 17 27.5 − dB f = 320 to 600 MHz 16 25 − dB S22 output return losses f = 40 to 80 MHz 20 29 − dB f = 80 to 160 MHz 18.5 27.5 − dB f = 160 to 320 MHz 17 24 − dB f = 320 to 600 MHz 16 21 − dB S21 phase response f = 50 MHz −45 − +45 deg CTB composite triple beat 85 channels flat; Vo = 44 dBmV; − −60 −57 dB measured at 595.25 MHz Xmod cross modulation 85 channels flat; Vo = 44 dBmV; − −60.5 −59 dB measured at 55.25 MHz CSO composite second order 85 channels flat; Vo = 44 dBmV; − −64.5 −58 dB distortion measured at 596.5 MHz d2 second order distortion note 1 − −79 −70 dB Vo output voltage dim = −60 dB; note 2 61 64.5 − dBmV F noise figure see Table 1 − − − dB Itot total current consumption (DC) note 3 − 225 240 mA Notes 1. fp = 55.25 MHz; Vp = 44 dBmV; fq = 541.25 MHz; Vq = 44 dBmV; measured at fp + fq = 596.5 MHz. 2. Measured according to DIN45004B: fp = 590.25 MHz; Vp = Vo; fq = 597.25 MHz; Vq = Vo −6 dB; fr = 599.25 MHz; Vr = Vo −6 dB; measured at fp + fq − fr = 588.25 MHz. 3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V. 2001 Oct 22 5, Table 4 Bandwidth 40 to 550 MHz; VB = 24 V; Tmb = 30 °C; ZS = ZL = 75 Ω SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Gp power gain f = 50 MHz 18 18.5 19 dB f = 550 MHz 18.5 − − dB SL slope cable equivalent f = 40 to 550 MHz 0 − 1.5 dB FL flatness of frequency response f = 40 to 550 MHz − − ±0.3 dB S11 input return losses f = 40 to 80 MHz 20 31 − dB f = 80 to 160 MHz 18.5 30 − dB f = 160 to 320 MHz 17 27.5 − dB f = 320 to 550 MHz 16 25 − dB S22 output return losses f = 40 to 80 MHz 20 29 − dB f = 80 to 160 MHz 18.5 27.5 − dB f = 160 to 320 MHz 17 24 − dB f = 320 to 550 MHz 16 21 − dB S21 phase response f = 50 MHz −45 − +45 deg CTB composite triple beat 77 channels flat; Vo = 44 dBmV; − −61 −60 dB measured at 547.25 MHz Xmod cross modulation 77 channels flat; Vo = 44 dBmV; − −61 −60 dB measured at 55.25 MHz CSO composite second order 77 channels flat; Vo = 44 dBmV; − −69 −60 dB distortion measured at 548.5 MHz d2 second order distortion note 1 − − −72 dB Vo output voltage dim = −60 dB; note 2 62 − − dBmV F noise figure see Table 1 − − − dB Itot total current consumption (DC) note 3 − 225 240 mA Notes 1. fp = 55.25 MHz; Vp = 44 dBmV; fq = 493.25 MHz; Vq = 44 dBmV; measured at fp + fq = 548.5 MHz. 2. Measured according to DIN45004B: fp = 540.25 MHz; Vp = Vo; fq = 547.25 MHz; Vq = Vo −6 dB; fr = 549.25 MHz; Vr = Vo −6 dB; measured at fp + fq − fr = 538.25 MHz. 3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V. 2001 Oct 22 6, Table 5 Bandwidth 40 to 450 MHz; VB = 24 V; Tmb = 30 °C; ZS = ZL = 75 Ω SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Gp power gain f = 50 MHz 18 18.5 19 dB f = 450 MHz 18.5 − − dB SL slope cable equivalent f = 40 to 450 MHz 0 − 1.5 dB FL flatness of frequency response f = 40 to 450 MHz − − ±0.3 dB S11 input return losses f = 40 to 80 MHz 20 31 − dB f = 80 to 160 MHz 18.5 30 − dB f = 160 to 320 MHz 17 27.5 − dB f = 320 to 450 MHz 16 25 − dB S22 output return losses f = 40 to 80 MHz 20 29 − dB f = 80 to 160 MHz 18.5 27.5 − dB f = 160 to 320 MHz 17 24 − dB f = 320 to 450 MHz 16 21 − dB S21 phase response f = 50 MHz −45 − +45 deg CTB composite triple beat 60 channels flat; Vo = 46 dBmV; − − −61 dB measured at 445.25 MHz Xmod cross modulation 60 channels flat; Vo = 46 dBmV; − − −60 dB measured at 55.25 MHz CSO composite second order 60 channels flat; Vo = 46 dBmV; − − −61 dB distortion measured at 446.5 MHz d2 second order distortion note 1 − − −75 dB Vo output voltage dim = −60 dB; note 2 64 − − dBmV F noise figure see Table 1 − − − dB Itot total current consumption (DC) note 3 − 225 240 mA Notes 1. fp = 55.25 MHz; Vp = 46 dBmV; fq = 391.25 MHz; Vq = 46 dBmV; measured at fp + fq = 446.5 MHz. 2. Measured according to DIN45004B: fp = 440.25 MHz; Vp = Vo; fq = 447.25 MHz; Vq = Vo −6 dB; fr = 449.25 MHz; Vr = Vo −6 dB; measured at fp + fq − fr = 438.25 MHz. 3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V. 2001 Oct 22 7, PACKAGE OUTLINE Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J

D

EZpA21235789

A

L F

S

cWebwMed1UQq22yMBBq1yMByMBpU1q0510 mm scale DIMENSIONS (mm are the original dimensions) A A2DdELQUZUNIT max. b c max. max. max. max. e e1 F min. p max. q q1 q2 S Umax. 2Wwymax. 4.15 mm 20.8 9.1 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 2.4 38.1 25.4 10.2 4.2 44.75 8 6-32 0.25 0.1 3.8 0.38 3.85 UNC OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC EIAJ PROJECTION SOT115J 99-02-06 2001 Oct 22 8, DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS(1) (2) DEFINITIONSSTATUS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form Life support applications These products are not specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or same type number and title. For detailed information see systems where malfunction of these products can the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products Limiting values definition Limiting values given are in for use in such applications do so at their own risk and accordance with the Absolute Maximum Rating System agree to fully indemnify Philips Semiconductors for any (IEC 60134). Stress above one or more of the limiting damages resulting from such application. values may cause permanent damage to the device. These are stress ratings only and operation of the device Right to make changes Philips Semiconductors at these or at any other conditions above those given in the reserves the right to make changes, without notice, in the Characteristics sections of the specification is not implied. products, including circuits, standard cells, and/or Exposure to limiting values for extended periods may software, described or contained herein in order to affect device reliability. improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for Application information Applications that are the use of any of these products, conveys no licence or title described herein for any of these products are for under any patent, copyright, or mask work right to these illustrative purposes only. Philips Semiconductors make products, and makes no representations or warranties that no representation or warranty that such applications will be these products are free from patent, copyright, or mask suitable for the specified use without further testing or work right infringement, unless otherwise specified. modification. 2001 Oct 22 9,

NOTES

2001 Oct 22 10,

NOTES

2001 Oct 22 11,

Philips Semiconductors – a worldwide company

Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: email is hidden. © Koninklijke Philips Electronics N.V. 2001 SCA73 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613518/05/pp12 Date of release: 2001 Oct 22 Document order number: 9397 750 08818]
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