Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY43 VHF power amplifier module Product specification 1996 Jun 06 Supersedes data of May 1991 File under Discrete Semiconductors, SC09

DISCRETE SEMICONDUCTORS DATA SHEET BGY43 VHF power amplifier module Product specification 1996 Jun 06 Supersedes data of May 1991 File under Discrete Semiconductors, SC09 FEATURES PINNING - SOT132B • Broadband VHF amplifier PIN DESCRIPTION • 13 W output power 1 RF input handbook, halfpage • Direct operation from 12 V vehicle 2 ground1234567electrical systems 3 VS1 4 ground APPLICATIONS 5 VS2 Top view MSB029 • Mobile communication equipment 6 ground operating in the 148 to 174 MHz 7 RF output frequency range. Fig.1 Simplified outline. Flange ground DESCRIPTION The BGY43 is a two-stage amplifier...
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DISCRETE SEMICONDUCTORS

DATA SHEET BGY43 VHF power amplifier module

Product specification 1996 Jun 06 Supersedes data of May 1991 File under Discrete Semiconductors, SC09, FEATURES PINNING - SOT132B • Broadband VHF amplifier PIN DESCRIPTION • 13 W output power 1 RF input handbook, halfpage • Direct operation from 12 V vehicle 2 ground1234567electrical systems 3 VS1 4 ground APPLICATIONS 5 VS2 Top view MSB029 • Mobile communication equipment 6 ground operating in the 148 to 174 MHz 7 RF output frequency range. Fig.1 Simplified outline. Flange ground

DESCRIPTION

The BGY43 is a two-stage amplifier module in a SOT132B package. The module consists of a two stage RF amplifier using NPN silicon planar transistor dies with lumped-element matching components, in a plastic stripline encapsulation. The negative supply is internally connected to the flange. QUICK REFERENCE DATA RF performance at Th = 25 °C. MODE OF f VS1; VS2 PD PL ZS, ZL OPERATION (MHz) (V) (mW) (W) (Ω) CW 148 to 174 12.5 ≤150; typ 80 >13 50

WARNING

Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 1996 Jun 06 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VS1 DC supply voltage − 16.5 V VS2 DC supply voltage − 16.5 V Vi RF input terminal voltage − ±25 V Vo RF output terminal voltage − ±25 V PD input drive power − 300 mW PL load power − 18 W Tstg storage temperature −40 +100 °C Th operating heatsink temperature − 90 °C MGE661 handbook, halfpage

PL

(W) −50 0 50 100 Th (°C) VSWR = 1. Fig.2 Power derating curve. 1996 Jun 06 3,

CHARACTERISTICS

ZS = ZL = 50 Ω; VS1 = VS2 = 12.5 V; f = 148 to 174 MHz; Th = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT IQ1 leakage current PD = 0 − 5 − mA IQ2 leakage current PD = 0 − 15 − mA PD input drive power PL = 13 W − 80 150 mW η efficiency PL = 13 W 40 48 − % H2 second harmonic −25 −34 − dBc H3 third harmonic −25 −34 − dBc VSWRin input VSWR with respect to 50 Ω − 1 : 1.5 − handbook, full pagewidth53+VS2 +VS1 R.F. output R.F. input264DRIVER P.A. MGE660 Fig.3 Circuit diagram. 1996 Jun 06 4, Stability APPLICATION INFORMATION The module is stable with a load VSWR up to 3:1 (all Power rating phases) when operated within the following conditions: V = V = 10 V to 16.5 V; P = 30 to 300 mW; In general, it is recommended that the output power fromS1 S2Df= 148 to 174 MHz; PL ≤ 18 W (matched). the module under nominal conditions should not exceed 16 W in order to provide an adequate safety margin under fault conditions. Ruggedness The module will withstand a load mismatch VSWR of 50:1 Output power control (all phases) for short period overload conditions, with drive power and DC supply voltages at maximum values, The module is not designed to be operated over a wide providing the combination does not result in the matched range of output power levels. The purpose of the output RF output power rating being exceeded. power control is to set the nominal output power level. The preferred method of output power control is by varying the drive power between 30 and 200 mW. The next option MOUNTING is by varying VS1 between 6 and 12.5 V. To ensure good thermal transfer the module should be mounted on a heatsink with a flat surface with heat-conducting compound applied between module and heatsink. If an isolation washer is used, heatsink compound should be applied to both sides of the washer. Burrs and thickening of the holes in the heatsink should be removed and 3 mm bolts tightened to a torque of 0.5 Nm. The leads of the devices may be soldered directly into a circuit using a soldering iron with a maximum temperature of 245 °C for not more than 10 seconds at a distance of at least 1 mm from the plastic. 1996 Jun 06 5, handbook, full pagewidth VS10VVS2 printed-wiring board (1.5 mm) and aluminium spacer (2.5 mm) 10 µF 10 µF 60 mm 100 nF input output 100 nF rivets holes for module mounting screws (tapped 3 mm) 90 mm heatsink (redpoint type 6M) MGE662

Fig.4 Test jig for VHF modules.

handbook, full pagewidth 100 nF 100 nF 10 µF 10 µF (25 V) (25 V) VS2 VS1 (power amplifier (driver stage supply) supply) MGE663

Fig.5 Recommended decoupling arrangement.

1996 Jun 06 6, PACKAGE OUTLINE 52.5 50.0 44.9 17.0 14.4 9.3 8.1 3.7 6.8 4.2 0.25 7.65 max123456719.7 3.3 61.0 A 8.5 17.0 3.5 0.5 0.2MA52.5 67.5 MBC876 Dimensions in mm. Fig.6 SOT132B. 1996 Jun 06 7,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Short-form specification The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 06 8]
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