Download: DISCRETE SEMICONDUCTORS DATA SHEET BGY32; BGY33; BGY35; BGY36 VHF power amplifier modules Product specification 1996 Jun 06 Supersedes data of May 1991

DISCRETE SEMICONDUCTORS DATA SHEET BGY32; BGY33; BGY35; BGY36 VHF power amplifier modules Product specification 1996 Jun 06 Supersedes data of May 1991 File under Discrete Semiconductors, SC09 BGY32; BGY33; VHF power amplifier modules BGY35; BGY36 FEATURESS PINNING - SOT132B • Broadband VHF amplifiers PIN DESCRIPTION • 18 W output power 1 RF input handbook, halfpage • Direct operation from 12 V vehicle 2 ground1234567electrical systems. 3 VS1 4 ground APPLICATIONS 5 VS2 Top view MSB029 • Mobile communication equipment. 6 ground 7 RF output Fig.1 Simplified outline. DESCRIPTION Flange ground Th...
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DISCRETE SEMICONDUCTORS

DATA SHEET BGY32; BGY33; BGY35; BGY36 VHF power amplifier modules

Product specification 1996 Jun 06 Supersedes data of May 1991 File under Discrete Semiconductors, SC09,

BGY32; BGY33; VHF power amplifier modules BGY35; BGY36

FEATURESS PINNING - SOT132B • Broadband VHF amplifiers PIN DESCRIPTION • 18 W output power 1 RF input handbook, halfpage • Direct operation from 12 V vehicle 2 ground1234567electrical systems. 3 VS1 4 ground APPLICATIONS 5 VS2 Top view MSB029 • Mobile communication equipment. 6 ground 7 RF output Fig.1 Simplified outline. DESCRIPTION Flange ground The BGY32, BGY33; BGY35 and BGY36 are two stage amplifier modules in a SOT132B package. Each module comprises two NPN silicon planar transistor dies together with lumped-element matching components. QUICK REFERENCE DATA RF performance at Th = 25 °C. MODE OF f VS1; VTYPE S2 PD PL ZS, ZL OPERATION (MHz) (V) (mW) (W) (Ω) BGY32 CW 68 to 88 12.5 100 >18; typ. 23 50 BGY33 CW 80 to 108 12.5 100 >18; typ. 22 50 BGY35 CW 132 to 156 12.5 150 >18; typ. 22 50 BGY36 CW 148 to 174 12.5 150 >18; typ. 21 50

WARNING

Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 1996 Jun 06 2, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VS1 DC supply voltage − 15 V VS2 DC supply voltage − 15 V Vi RF input terminal voltage − ±25 V Vo RF output terminal voltage − ±25 V PD input drive power BGY32; BGY33 − 200 mW BGY35; BGY36 − 300 mW PL load power − 30 W Tstg storage temperature −40 +100 °C Th operating heatsink temperature − 90 °C MGE659 handbook, halfpage

PL

(W) −50 0 50 100 Th (°C) VSWR = 1. Fig.2 Power derating curve. 1996 Jun 06 3,

CHARACTERISTICS

ZS = ZL = 50 Ω; VS1 = VS2 = 12.5 V; Th = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency BGY32 68 − 88 MHz BGY33 80 − 108 MHz BGY35 132 − 156 MHz BGY36 148 − 174 MHz IQ1 leakage current PD = 0 − 6 − mA IQ2 leakage current PD = 0 − 13 − mA PL load power BGY32 PD = 100 mW 18 23 − W BGY33 PD = 100 mW 18 22 − W BGY35 PD = 150 mW 18 22 − W BGY36 PD = 150 mW 18 21 − W η efficiency 40 50 − % H2 second harmonic − − −25 dBc H3 third harmonic − − −25 dBc VSWRin input VSWR with respect to 50 Ω − 1.5 − stability VS1 = 6 to 15 V; VS2 = 10 to 15 V; − − −60 dBc VS1 ≤ VS2; PD = 50 to 200 mW; VSWR ≤ 3 : 1 through all phases; 1996 Jun 06 4, handbook, full pagewidth53+VS2 +VS1 R.F. output R.F. input264MGE658 Fig.3 Circuit diagram. Ruggedness APPLICATION INFORMATION The module will withstand a load mismatch VSWR of 50:1 Supply (all phases) for short period overload conditions, with PD, VS1 and VS2 at maximum values providing the combination An electrolytic capacitor of 10 µF, 25 V, in parallel with a does not result in the matched RF output power rating polyester capacitor of 100 nF to earth, is recommended as being exceeded. a decoupling arrangement for each power supply pin. Power rating

MOUNTING

In general it is recommended that the output power from To ensure good thermal transfer the module should be the module under nominal conditions should not exceed mounted on a heatsink with a flat surface with 23 W in order to provide an adequate safety margin under heat-conducting compound applied between module and fault conditions. heatsink. If an isolation washer is used, heatsink compound should be applied to both sides of the washer. Output power control Burrs and thickening of the holes in the heatsink should be removed and 3 mm bolts tightened to a maximum torque The module is not designed to be operated over a large of 0.5 Nm. The leads of the devices may be soldered range of output power levels. The purpose of the output directly into a circuit using a soldering iron with a maximum power control is to set the nominal output power level. temperature of 245 °C for not more than 10 seconds at a The preferred method of output power control is by varying distance of at least 1 mm from the plastic. the drive power between 50 and 200 mW. The next option is by varying VS1 between 6 and 12.5 V. 1996 Jun 06 5, PACKAGE OUTLINE 52.5 50.0 44.9 17.0 14.4 9.3 8.1 3.7 6.8 4.2 0.25 7.65 max123456719.7 3.3 61.0 A 8.5 17.0 3.5 0.5 0.2MA52.5 67.5 MBC876 Dimensions in mm. Fig.4 SOT132B. 1996 Jun 06 6,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Short-form specification The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 06 7]
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