Download: DATA SHEET BY614 Miniature high-voltage soft-recovery rectifier

DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage M3D189

BY614 Miniature high-voltage

soft-recovery rectifier Product specification 1996 May 24 Supersedes data of April 1992 File under Discrete Semiconductors, SC01, FEATURES DESCRIPTION expansion of all used parts are matched. • Glass passivated Miniature glass package, using a high • High maximum operating temperature alloyed construction. The package is designed to be used temperature in an insulating medium such asThis package is hermetically sealed resin, oil or SF6 gas. • Low leakage current and fatigue free as coefficients of • Excellent stability • Soft-recovery switching characteristics handbook, halfpkage a • Very compact construction. MAM162 APPLICATIONS The cathode lead is marked with a black band. • Miniature high-voltage assemblies Fig.1 Simplified outline (SOD61H2) and symbol. such as voltage multipliers. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRSM non-repetitive peak reverse voltage − 2200 V VRRM repetitive peak reverse voltage − 2200 V VRW working reverse voltage − 2000 V VR continuous reverse voltage − 2000 V IF(AV) average forward current averaged over any 20 ms period; − 50 mA PCB mounting (see Fig.5); Tamb = 65 °C; see Fig.2; see also Fig.3 IFRM repetitive peak forward current − 500 mA IFSM non-repetitive peak forward current t ≤ 10 ms; half sinewave; − 1 A Tj = Tj max prior to surge; VR = VRWmax Tstg storage temperature −65 +150 °C Tj junction temperature −65 +150 °C 1996 May 24 2, ELECTRICAL CHARACTERISTICS Tj = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF forward voltage IF = 50 mA; Tj = Tj max; see Fig.4 − − 6 V IR reverse current VR = VRWmax; Tj = 120 °C − − 3 µA Qr recovery charge when switched from IF = 100 mA to − − 1 nC tf fall time when switched from IF = 100 mA to 100 − − ns trr reverse recovery time when switched from IF = 100 mA to − − 300 ns Cd diode capacitance VR = 0 V; f = 1 MHz − 2 − pF THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 100 K/W Rth j-a thermal resistance from junction to ambient note 1 155 K/W Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.5. For more information please refer to the “General Part of Handbook SC01”. 1996 May 24 3, GRAPHICAL DATA MBH389 MBH390 80 1000 handbook, halfpage handbook, halfpage IF(AV) (mA) a = 3 2.5 2 1.57 1.42

P

60 (mW) 40 50000040 80 120 160 0 50 I 100 T (°C) F(AV) (mA) amb Switched mode application. a = 1.57; δ = 0.5; VR = VRWmax; device mounted as shown in Fig.5. a = IF(RMS)/IF(AV); δ = 0.5; VR = VRWmax. Fig.2 Maximum permissible average forward Fig.3 Maximum steady state power dissipation current as a function of ambient temperature (forward plus leakage losses) as a function of (including losses due to reverse leakage). average forward current. MBH402 handboo2k,0 h0alfpage 50 handbook, halfpage

IF

(mA) 0 10 VF (V) 20 MGA200 Dotted line: Tj = 150 °C. Solid line: Tj = 25 °C. Dimensions in mm. Fig.4 Forward current as a function of maximum forward voltage. Fig.5 Device mounted on a printed-circuit board. 1996 May 24 4, handbIFook, halfpage dIF dt trr 10% t Qr 90% IR tf MGD569 Fig.6 Reverse recovery definitions. 1996 May 24 5, PACKAGE OUTLINEka0.65 handbook, full pagewidth max max 2.2 32.5 min 3 max 32.5 min MGD602max Dimensions in mm. Fig.7 SOD61H2.

DEFINITIONS

Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 24 6]

15