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GENERAL DESCRIPTION QUICK REFERENCE DATA Glass-passivated double diffused SYMBOL PARAMETER MAX. UNIT rectifier diode in a full pack plastic envelope, featuring fast forward VRRM Repetitive peak reverse voltage 1500 V recovery and low forward recovery VF Forward voltage 1.2 V voltage. The device is intended for IF(AV) Average forward current 10 A use in multi-sync monitor deflection IFSM Non-repetitive peak forward current 100 A circuits up to 82kHz. tfr Forward recovery time 250 ns Vfr Forward recovery voltage 14 V PINNING - SOD100 PIN CONFIGURATION SYMBOL PIN DESCRIPTION 1 cathode caseak2anod...
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GENERAL DESCRIPTION QUICK REFERENCE DATA

Glass-passivated double diffused SYMBOL PARAMETER MAX. UNIT rectifier diode in a full pack plastic envelope, featuring fast forward VRRM Repetitive peak reverse voltage 1500 V recovery and low forward recovery VF Forward voltage 1.2 V voltage. The device is intended for IF(AV) Average forward current 10 A use in multi-sync monitor deflection IFSM Non-repetitive peak forward current 100 A circuits up to 82kHz. tfr Forward recovery time 250 ns Vfr Forward recovery voltage 14 V

PINNING - SOD100 PIN CONFIGURATION SYMBOL

PIN DESCRIPTION 1 cathode caseak2anode case isolated12

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRSM Non repetitive peak reverse - 1500 V voltage VRRM Repetitive peak reverse voltage - 1500 V VRWM Crest working reverse voltage - 1300 V IF(AV) Average forward current sinusoidal; Ths ≤ 68 ˚C - 10 A IF(RMS) RMS forward current - 15.7 A IFRM Repetitive peak forward current sinusoidal; a = 1.57 - 100 A IFSM Non repetitive peak forward t = 10 ms - 100 A current t = 8.3 ms - 110 A sinusoidal; Tj = 150 ˚C prior to surge; with reapplied VRWM(max) I2t I2t for fusing t = 10 ms - 50 A2s Tstg Storage temperature -40 150 ˚C Tj Operating junction temperature - 150 ˚C

ISOLATION

Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Visol Repetitive peak voltage from R.H. ≤ 65% ; clean and dustfree - - 1500 V both terminals to external heatsink Cisol Capacitance from cathode to f = 1 MHz - 12 - pF external heatsink November 1994 1 Rev 1.000,

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Rth j-hs Thermal resistance junction to with heatsink compound - - 4.8 K/W heatsink without heatsink compound - - 5.9 K/W Rth j-a Thermal resistance junction to in free air - 55 - K/W ambient

STATIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF Forward voltage IF = 6.5 A - 0.95 1.3 V IF = 6.5 A; Tj = 125 ˚C - 0.85 1.2 V IR Reverse current VR = VRWMmax - - 0.25 mA VR = VRWMmax; Tj = 125 ˚C - - 1.0 mA

DYNAMIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Vfr Forward recovery voltage IF = 6.5 A; dIF/dt = 50 A/µs - 8 14 V tfr Forward recovery time IF = 6.5 A; dIF/dt = 50 A/µs; VF = 5 V - 170 250 ns IF = 6.5 A; dIF/dt = 50 A/µs; VF = 2 V - 350 - ns trr Reverse recovery time IF = 1 A; -dIF/dt = 50 A/µs; VR ≥ 30 V - 250 350 ns November 1994 2 Rev 1.000, dI PF / W BY459 Ths(max) / CI 20 54FFVo = 1.020 V dt Rs = 0.028 Ohms 1.57 1.9 15 2.2 78 trr 2.8 a = 4 time 10 102 Qs 25% 100% 5 126

I

R I rrm 0 1500246810 12 IF(AV) / A

Fig.1. Definition of trr, Qs and Irrm Fig.4. Maximum forward dissipation PF = f(IF(AV));

sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). I IFS(RMS) / A BY459 F 150

IFSM

timeVF

V

frVF01ms 10ms 0.1s 1s 10s time tp / s

Fig.2. Definition of Vfr Fig.5. Maximum non-repetitive rms forward current. IF = f(tp); sinusoidal current waveform; Tj = 150˚C prior

to surge with reapplied VRWM. PF / W BY459 Ths(max) / C 25 IF / A BY459 30 30 Vo = 1.0200 V Rs = 0.0280 Ohms D = 1.0 Tj = 150 C 20 Tj = 25 C54 0.5 0.2 78 0.1 typ max 10 102 tp 10 I tp D =

T

5 126Tt015000510 15 20 0 0.5 1 1.5 2 IF(AV) / A VF / V

Fig.3. Maximum forward dissipation PF = f(IF(AV)); Fig.6. Typical and maximum forward characteristic

square wave where IF(AV) =IF(RMS) x √D. IF = f(VF); parameter Tj

November 1994 3 Rev 1.000

, Vfr / V BY459 Zth j-hs / (K/W) 30 10 max 20 typ 1 10 0.1 PD tpt050 100 150 0.01 200 10us 100us 1ms 10ms 0.1s 1s 10s dIF/dt (A/us) tp / s Fig.7. Typical and maximum Vfr = f(dIF/dt); Tj = 25˚C Fig.9. Transient thermal impedance Zth = f(tp) trr / us BY459 2 IF = 10A5A1.52A1A0.5 1 10 100 -dIF/dt (A/us) Fig.8. Maximum reverse recovery time trr = f(dIF/dt); parameter Tj November 1994 4 Rev 1.000,

MECHANICAL DATA

Dimensions in mm 10.2 Net Mass: 2 g max 5.7 4.4 max 0.9 max 3.2 0.5 3.0 2.9 max 4.4 4.0 7.9 7.5 seating max plane 3.5 max not tinned 4.4 13.5 minka0.4 M 0.9 0.7 0.55 max 1.3 5.08 top view Fig.10. SOD100; The seating plane is electrically isolated from all terminals. Notes 1. Accessories supplied on request: refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". November 1994 5 Rev 1.000,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1995 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. November 1994 6 Rev 1.000]
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