Download: GENERAL DESCRIPTION QUICK REFERENCE DATA PINNING - TO220AC PIN CONFIGURATION SYMBOL

GENERAL DESCRIPTION QUICK REFERENCE DATA Glass-passivated double diffused SYMBOL PARAMETER MAX. UNIT rectifier diode in a plastic envelope, featuring fast forward recovery and VRRM Repetitive peak reverse voltage 1500 V low forward recovery voltage. The VF Forward voltage 1.2 V device is intended for use in IF(AV) Average forward current 10 A multi-sync monitor deflection circuits IFSM Non-repetitive peak forward current 100 A up to 82kHz. tfr Forward recovery time 250 ns Vfr Forward recovery voltage 14 V PINNING - TO220AC PIN CONFIGURATION SYMBOL PIN DESCRIPTION tab 1 cathode (k) ak2anode (a)...
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GENERAL DESCRIPTION QUICK REFERENCE DATA

Glass-passivated double diffused SYMBOL PARAMETER MAX. UNIT rectifier diode in a plastic envelope, featuring fast forward recovery and VRRM Repetitive peak reverse voltage 1500 V low forward recovery voltage. The VF Forward voltage 1.2 V device is intended for use in IF(AV) Average forward current 10 A multi-sync monitor deflection circuits IFSM Non-repetitive peak forward current 100 A up to 82kHz. tfr Forward recovery time 250 ns Vfr Forward recovery voltage 14 V

PINNING - TO220AC PIN CONFIGURATION SYMBOL

PIN DESCRIPTION tab 1 cathode (k) ak2anode (a) tab cathode (k) 1 2

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRSM Non repetitive peak reverse - 1500 V voltage VRRM Repetitive peak reverse voltage - 1500 V VRWM Crest working reverse voltage - 1300 V IF(AV) Average forward current 1 sinusoidal; a = 1.57; Tmb ≤ 125 ˚C - 10 A IF(RMS) RMS forward current - 15.7 A IFRM Repetitive peak forward current sinusoidal; a = 1.57 - 100 A IFSM Non repetitive peak forward t = 10 ms - 100 A current t = 8.3 ms - 110 A sinusoidal; Tj = 150 ˚C prior to surge; with reapplied VRWM(max) I2t I2t for fusing t = 10 ms - 50 A2s Tstg Storage temperature -40 150 ˚C Tj Operating junction temperature - 150 ˚C

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Rth j-mb Thermal resistance junction to - - 1.5 K/W mounting base Rth j-a Thermal resistance junction to in free air - 60 - K/W ambient 1 Neglecting switching and reverse current losses. October 1994 1 Rev 1.000,

STATIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF Forward voltage IF = 6.5 A - 0.95 1.3 V IF = 6.5 A; Tj = 125 ˚C - 0.85 1.2 V IR Reverse current VR = VRWMmax - - 0.25 mA VR = VRWMmax; Tj = 125 ˚C - - 1.0 mA

DYNAMIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Vfr Forward recovery voltage IF = 6.5 A; dIF/dt = 50 A/µs - 8 14 V tfr Forward recovery time IF = 6.5 A; dIF/dt = 50 A/µs; VF = 5 V - 170 250 ns IF = 6.5 A; dIF/dt = 50 A/µs; VF = 2 V - 350 - ns trr Reverse recovery time IF = 1 A; -dIF/dt = 50 A/µs; VR ≥ 30 V - 250 350 ns dI PF / W BY459 Tmb(max) / CI 25F 112.5F Vo = 1.0200 VRs = 0.0280 Ohms D = 1.0 dt 20 120 0.5 trr time 0.2 127.5 0.1 10 135 tp tp QsID= T 25% 100% 5 142.5ItRITrrm 0 1500510 15 20 IF(AV) / A Fig.1. Definition of trr, Qs and Irrm Fig.3. Maximum forward dissipation PF = f(IF(AV)); square wave where IF(AV) =IF(RMS) x √D. I PF / W BY459 Tmb(max) / C F 20 120 Vo = 1.020 V Rs = 0.028 Ohms 1.57 123 1.9 126 15 2.2 2.8 129 a = 4 132 time 10 135 V 138F V 144 fr

V

F 0 1500246810 12 time IF(AV) / A Fig.2. Definition of Vfr Fig.4. Maximum forward dissipation PF = f(IF(AV)); sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). October 1994 2 Rev 1.000, IFS(RMS) / A BY459 trr / us BY459 150 2 IF = 10A5A1.52A

IFSM

1 A 0.5001ms 10ms 0.1s 1s 10s 1 10 100 tp / s -dIF/dt (A/us) Fig.5. Maximum non-repetitive rms forward current. Fig.8. Maximum reverse recovery time trr = f(dIF/dt); IF = f(tp); sinusoidal current waveform; Tj = 150˚C prior parameter Tj to surge with reapplied VRWM. IF / A BY459 Zth j-mb / (K/W) 30 10 Tj = 150 C Tj = 25 C 20 1 typ max 10 0.1 PD tpt00.5 1 1.5 2 0.01 10us 100us 1ms 10ms 0.1s 1s 10s VF / V tp / s Fig.6. Typical and maximum forward characteristic Fig.9. Transient thermal impedance Zth = f(tp) IF = f(VF); parameter Tj Vfr / V BY459 max 20 typ 0 50 100 150 200 dIF/dt (A/us) Fig.7. Typical and maximum Vfr = f(dIF/dt); Tj = 25˚C October 1994 3 Rev 1.000, MECHANICAL DATA Dimensions in mm 4,5 Net Mass: 2 g max 10,3 1,3 3,7 2,8 5,9 min 15,8 3,0 max not tinned 3,0 13,5 min 1,3 max12(2x) 0,9 max (2x) 0,6 5,08 2,4 Fig.10. TO220AC; pin 1 connected to mounting base. Notes 1. Accessories supplied on request: refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8". October 1994 4 Rev 1.000,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1994 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. October 1994 5 Rev 1.000]
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