Download: DATA SHEET BZG04 series Transient voltage suppressor diodes

DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D168 BZG04 series Transient voltage suppressor diodes Preliminary specification 1996 Jun 10 Supersedes data of October 1991 File under Discrete Semiconductors, SC01 FEATURES DESCRIPTION The well-defined void-free case is of a transfer-moulded thermo-setting • Glass passivated DO-214AC surface mountable plastic. • High maximum operating package with glass passivated chip. temperature • Low leakage current • Excellent stability handbook, 4 columns cathode band • UL 94V-O classified plastickapackage • Transient suppressor stand-off voltage r...
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DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage M3D168

BZG04 series Transient voltage suppressor

diodes Preliminary specification 1996 Jun 10 Supersedes data of October 1991 File under Discrete Semiconductors, SC01, FEATURES DESCRIPTION The well-defined void-free case is of a transfer-moulded thermo-setting • Glass passivated DO-214AC surface mountable plastic. • High maximum operating package with glass passivated chip. temperature • Low leakage current • Excellent stability handbook, 4 columns cathode band • UL 94V-O classified plastickapackage • Transient suppressor stand-off voltage range: 8.2 to 220 V for 32 types • Shipped in 12 mm embossed tape. Top view Side view MSA473 Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT PRSM non-repetitive peak reverse power 10/1000 µs exponential pulse − 300 W dissipation (see Fig.5); Tj = 25 °C prior to surge; see also Fig.2 Tstg storage temperature −65 +175 °C Tj junction temperature −65 +175 °C 1996 Jun 10 2, ELECTRICAL CHARACTERISTICS Total series Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VF forward voltage IF = 0.5 A; see Fig.3 − 1.2 V Per type Tj = 25 °C unless otherwise specified. REVERSE TEST REVERSE CURRENT TEMPERATURE CLAMPING BREAKDOWN CURREN at STAND-OFF COEFFICIENT VOLTAGE TYPE VOLTAGE T VOLTAGE NUMBER V(BR)R (V) SZ (%/K) at Iat I test I

V

test (CL)R (V) at I (A) IR (µA) test RSM at VR (mA) note 1 (V) MIN. MIN. MAX. MAX. MAX. BZG04-8V2 9.4 0.05 0.09 50 14.8 20.3 20 8.2 BZG04-9V1 10.4 0.05 0.10 50 15.7 19.1 5 9.1 BZG04-10 11.4 0.05 0.10 50 17.0 17.7 5 10 BZG04-11 12.4 0.05 0.10 50 18.9 15.9 5 11 BZG04-12 13.8 0.05 0.10 50 20.9 14.4 5 12 BZG04-13 15.3 0.06 0.11 25 22.9 13.1 5 13 BZG04-15 16.8 0.06 0.11 25 25.6 11.7 5 15 BZG04-16 18.8 0.06 0.11 25 28.4 10.6 5 16 BZG04-18 20.8 0.06 0.11 25 31.0 9.7 5 18 BZG04-20 22.8 0.06 0.11 25 33.8 8.9 5 20 BZG04-22 25.1 0.06 0.11 25 38.1 7.9 5 22 BZG04-24 28 0.06 0.11 25 42.2 7.1 5 24 BZG04-27 31 0.06 0.11 25 46.2 6.5 5 27 BZG04-30 34 0.06 0.11 10 50.1 6.0 5 30 BZG04-33 37 0.06 0.11 10 54.1 5.5 5 33 BZG04-36 40 0.07 0.12 10 60.7 4.9 5 36 BZG04-39 44 0.07 0.12 10 65.5 4.6 5 39 BZG04-43 48 0.07 0.12 10 70.8 4.2 5 43 BZG04-47 52 0.07 0.12 10 78.6 3.8 5 47 BZG04-51 58 0.08 0.13 10 86.5 3.5 5 51 BZG04-56 64 0.08 0.13 10 94.4 3.2 5 56 BZG04-62 70 0.08 0.13 10 103.5 2.9 5 62 BZG04-68 77 0.08 0.13 10 114 2.6 5 68 BZG04-75 85 0.09 0.13 5 126 2.4 5 75 BZG04-82 94 0.09 0.13 5 139 2.2 5 82 BZG04-91 104 0.09 0.13 5 152 2.0 5 91 BZG04-100 114 0.09 0.13 5 167 1.8 5 100 1996 Jun 10 3, REVERSE TEST REVERSE CURRENT TEMPERATURE CLAMPING BREAKDOWN CURREN at STAND-OFF COEFFICIENT VOLTAGE TYPE VOLTAGE T VOLTAGE NUMBER V(BR)R (V) S (%/K) atIV(V) I (µA) atIZtest Itest test (CL)R at IRSM (A) R at VR (mA) note 1 (V) MIN. MIN. MAX. MAX. MAX. BZG04-110 124 0.09 0.13 5 185 1.6 5 110 BZG04-120 138 0.09 0.13 5 204 1.5 5 120 BZG04-130 153 0.09 0.13 5 224 1.3 5 130 BZG04-150 168 0.09 0.13 5 249 1.2 5 150 BZG04-160 188 0.09 0.13 5 276 1.1 5 160 BZG04-180 208 0.09 0.13 2 305 1.0 5 180 BZG04-200 228 0.09 0.13 2 336 0.9 5 200 BZG04-220 251 0.09 0.13 2 380 0.8 5 220 Note 1. Non-repetitive peak reverse current in accordance with “IEC 60-1, Section 8” (10/1000 µs pulse); see Fig.4. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point 25 K/W Rth j-a thermal resistance from junction to ambient note 1 100 K/W note 2 150 K/W Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5. For more information please refer to the ‘General Part of Handbook SC01’. 1996 Jun 10 4, GRAPHICAL DATA 4 MBH45210 MBH453 handbook, halfpage 3handbook, halfpage P IZSM F (W) (A) 103 2 102 1 10 0 10−2 10−1 1 tp (ms) 1001VF (V) Tj = 25 °C prior to surge. Tj = 25 °C. Fig.2 Maximum non-repetitive peak reverse power dissipation as a function of pulse Fig.3 Forward current as a function of forward duration (square pulse). voltage; typical values. handbIRooSkM, h alfpage (%) 50 handbook, full pagewidth 4.5 2.5 t t1 1.25 MSB213 t2 MGD521 In accordance with “IEC 60-1, Section 8”. t1 = 10 µs. t2 = 1000 µs. Dimensions in mm. Fig.4 Non-repetitive peak reverse current pulse definition. Fig.5 Printed-circuit board for surface mounting. 1996 Jun 10 5, PACKAGE OUTLINE 5.5 handbook, full pagewidth 5.1 4.5 4.3 2.3 2.0 0.05 0.23.3 2.7 MSA414 2.8 1.6 2.4 1.4 Dimensions in mm. The marking band indicates the cathode. Fig.6 DO-214AC; SOD106. 1996 Jun 10 6,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 10 7]
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