Download: DISCRETE SEMICONDUCTORS DATA SHEET BZG03 series Voltage regulator diodes Preliminary specification 1996 Jun 07 Supersedes data of October 1993 File under Discrete Semiconductors, SC01

DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D168 BZG03 series Voltage regulator diodes Preliminary specification 1996 Jun 07 Supersedes data of October 1993 File under Discrete Semiconductors, SC01 FEATURES DESCRIPTION The well-defined void-free case is of a transfer-moulded thermo-setting • Glass passivatedb DO-214AC surface mountable plastic. • High maximum operating package with glass passivated chip. temperature • Low leakage current cathode • Excellent stability handbook, 4 columns band • UL 94V-O classified plastickapackage • Zener working voltage range: 10 to 270 V for 35 ty...
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DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage M3D168

BZG03 series Voltage regulator diodes

Preliminary specification 1996 Jun 07 Supersedes data of October 1993 File under Discrete Semiconductors, SC01, FEATURES DESCRIPTION The well-defined void-free case is of a transfer-moulded thermo-setting • Glass passivatedb DO-214AC surface mountable plastic. • High maximum operating package with glass passivated chip. temperature • Low leakage current cathode • Excellent stability handbook, 4 columns band • UL 94V-O classified plastickapackage • Zener working voltage range: 10 to 270 V for 35 types • Supplied in 12 mm embossed tape. Top view Side view MSA473 Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Ptot total power dissipation Ttp = 100 °C; see Fig.2 − 3.00 W Ptot total power dissipation Tamb = 50 °C; see Fig.2; device − 1.25 W mounted on an Al2O3 PCB (see Fig.5) PZSM non-repetitive peak reverse power tp = 100 µs; square pulse; − 600 W dissipation Tj = 25 °C prior to surge; see Fig.3 Tstg storage temperature −65 +175 °C Tj junction temperature −65 +175 °C 1996 Jun 07 2, ELECTRICAL CHARACTERISTICS Total series Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT VF forward voltage IF = 0.5 A; see Fig.4 1.2 V Per type Tj = 25 °C unless otherwise specified. DIFFERENTIAL TEMPERATURE TEST REVERSE CURRENT TYPE WORKING VOLTAGE RESISTANCE COEFFICIENT CURRENT at REVERSE VOLTAGE No. SUFFIX VZ (V) at IZ rdif (Ω) at IZ SZ (%/K) at IZ IR (µA) (1) IZ (mA) VR (V) MIN. NOM. MAX. TYP. MAX. MIN. MAX. MAX. C10 9.4 10 10.6240.05 0.09 50 7 7.5 C11 10.4 11 11.6470.05 0.10 50 4 8.2 C12 11.4 12 12.7470.05 0.10 50 3 9.1 C13 12.4 13 14.1 5 10 0.05 0.10 50 2 10 C15 13.8 15 15.6 5 10 0.05 0.10 50 1 11 C16 15.3 16 17.1 6 15 0.06 0.11 25 1 12 C18 16.8 18 19.1 6 15 0.06 0.11 25 1 13 C20 18.8 20 21.2 6 15 0.06 0.11 25 1 15 C22 20.8 22 23.3 6 15 0.06 0.11 25 1 16 C24 22.8 24 25.6 7 15 0.06 0.11 25 1 18 C27 25.1 27 28.9 7 15 0.06 0.11 25 1 20 C30 28 30 32 8 15 0.06 0.11 25 1 22 C33 31 33 35 8 15 0.06 0.11 25 1 24 C36 34 36 38 21 40 0.06 0.11 10 1 27 C39 37 39 41 21 40 0.06 0.11 10 1 30 C43 40 43 46 24 45 0.07 0.12 10 1 33 C47 44 47 50 24 45 0.07 0.12 10 1 36 C51 48 51 54 25 60 0.07 0.12 10 1 39 C56 52 56 60 25 60 0.07 0.12 10 1 43 C62 58 62 66 25 80 0.08 0.13 10 1 47 C68 64 68 72 25 80 0.08 0.13 10 1 51 C75 70 75 79 30 100 0.08 0.13 10 1 56 C82 77 82 87 30 100 0.08 0.13 10 1 62 C91 85 91 96 60 200 0.09 0.135168 C100 94 100 106 60 200 0.09 0.135175 C110 104 110 116 80 250 0.09 0.135182 C120 114 120 127 80 250 0.09 0.135191 1996 Jun 07 3, DIFFERENTIAL TEMPERATURE TEST REVERSE CURRENT TYPE WORKING VOLTAGE RESISTANCE COEFFICIENT CURRENT at REVERSE VOLTAGE No. SUFFIX VZ (V) at IZ rdif (Ω) at IZ SZ (%/K) at IZ IR (µA) (1) IZ (mA) VR (V) MIN. NOM. MAX. TYP. MAX. MIN. MAX. MAX. C130 124 130 141 110 300 0.09 0.1351100 C150 138 150 156 130 300 0.09 0.1351110 C160 153 160 171 150 350 0.09 0.1351120 C180 168 180 191 180 400 0.09 0.1351130 C200 188 200 212 200 500 0.09 0.1351150 C220 208 220 233 350 750 0.09 0.1321160 C240 228 240 256 400 850 0.09 0.1321180 C270 251 270 289 450 1000 0.09 0.1321200 Note 1. To complete the type number the suffix is added to the basic type number, e.g. BZG03-C130. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point 25 K/W Rth j-a thermal resistance from junction to ambient note 1 100 K/W note 2 150 K/W Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5. For more information please refer to the ‘General Part of Handbook SC01’. 1996 Jun 07 4, GRAPHICAL DATA MBH451 MBH452 4 104 handbook, halfpage handbook, halfpage Ptot (W) PZSM (W) 0 10 0 100 T (°C) 200 10−2 10−1 1 tp (ms) 10 Solid line: tie-point temperature. Tj = 25 °C prior to surge. Dotted line: ambient temperature; device mounted on an Al2O3 PCB as shown in Fig.5. Fig.3 Maximum non-repetitive peak reverse Fig.2 Maximum total power dissipation as a power dissipation as a function of pulse function of temperature. duration (square pulse). MBH453 handbook, halfpage 50handbook, full pagewidth

IF

(A) 4.5 2.5 1.25 MSB21301VF (V) Tj = 25 °C. Dimensions in mm. Fig.4 Forward current as a function of forward voltage; typical values. Fig.5 Printed-circuit board for surface mounting. 1996 Jun 07 5, PACKAGE OUTLINE 5.5 handbook, full pagewidth 5.1 4.5 4.3 2.3 2.0 0.05 0.23.3 2.7 MSA414 2.8 1.6 2.4 1.4 Dimensions in mm. The marking band indicates the cathode. Fig.6 DO-214AC; SOD106. 1996 Jun 07 6,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 07 7]
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