Download: DISCRETE SEMICONDUCTORS DATA SHEET BYG50 series Controlled avalanche rectifiers Preliminary specification 1996 May 24 File under Discrete Semiconductors, SC01

DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D168 BYG50 series Controlled avalanche rectifiers Preliminary specification 1996 May 24 File under Discrete Semiconductors, SC01 FEATURES DESCRIPTION The well-defined void-free case is of a transfer-moulded thermo-setting • Glass passivated DO-214AC; SOD106 surface plastic. • High maximum operating mountable package with glass temperature passivated chip. • Low leakage current • Excellent stability • handbook, 4 columns cathode Guaranteed avalanche energy band absorption capabilityka• UL 94V-O classified plastic package • Shipped in 12 mm...
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DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage M3D168

BYG50 series Controlled avalanche rectifiers

Preliminary specification 1996 May 24 File under Discrete Semiconductors, SC01, FEATURES DESCRIPTION The well-defined void-free case is of a transfer-moulded thermo-setting • Glass passivated DO-214AC; SOD106 surface plastic. • High maximum operating mountable package with glass temperature passivated chip. • Low leakage current • Excellent stability • handbook, 4 columns cathode Guaranteed avalanche energy band absorption capabilityka• UL 94V-O classified plastic package • Shipped in 12 mm embossed tape. Top view Side view MSA474 Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRRM repetitive peak reverse voltage BYG50D − 200 V BYG50G − 400 V BYG50J − 600 V BYG50K − 800 V BYG50M − 1000 V VR continuous reverse voltage BYG50D − 200 V BYG50G − 400 V BYG50J − 600 V BYG50K − 800 V BYG50M − 1000 V IF(AV) average forward current averaged over any 20 ms − 2.1 A period; Ttp = 100 °C; see Fig.2 averaged over any 20 ms − 1.0 A period; Al2O3 PCB mounting (see Fig.7); Tamb = 60 °C; see Fig.3 averaged over any 20 ms − 0.7 A period; epoxy PCB mounting (see Fig.7); Tamb = 60 °C; see Fig.3 IFSM non-repetitive peak forward current t = 10 ms half sinewave; − 30 A Tj = Tj max prior to surge; VR = VRRMmax 1996 May 24 2, SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ERSM non-repetitive peak reverse avalanche L = 120 mH; Tj = Tj max prior to energy surge; inductive load switched off BYG50D to J − 10 mJ BYG50K and M − 7 mJ Tstg storage temperature −65 +175 °C Tj junction temperature see Fig.4 −65 +175 °C ELECTRICAL CHARACTERISTICS Tj = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF forward voltage IF = 1 A; Tj = Tj max; see Fig.5 − − 0.85 V IF = 1 A; see Fig.5 − − 1.00 V V(BR)R reverse avalanche IR = 0.1 mA breakdown voltage BYG50D 300 − − V BYG50G 500 − − V BYG50J 700 − − V BYG50K 900 − − V BYG50M 1100 − − V IR reverse current VR = VRRMmax; see Fig.6 − − 1 µA VR = VRRMmax; Tj = 165 °C; see Fig.6 − − 100 µA trr reverse recovery time when switched from IF = 0.5 A to − 2 − µs IR = 1 A; measured at IR = 0.25 A; see Fig.8 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point 25 K/W Rth j-a thermal resistance from junction to ambient note 1 100 K/W note 2 150 K/W Notes 1. Device mounted on Al2O3 printed-circuit board, 0.7 mm thick; thickness of copper ≥35 µm, see Fig.7. 2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.7. For more information please refer to the “General Part of Handbook SC01”. 1996 May 24 3, GRAPHICAL DATA MBH396 MBH397 4 2.0 handbook, halfpage handbook, halfpage

I

I F(AV) F(AV) (A) (A) 1.6 1.2 0.8 0.400040 80 120 160 200 0 40 80 120 160 200 Ttp (°C) Tamb (°C) VR = VRRMmax; δ = 0.5; a = 1.57. Device mounted as shown in Fig.7 VR = VRRMmax; δ = 0.5; a = 1.57. Solid line: Al2O3 PCB; dotted line: epoxy PCB. Fig.2 Maximum permissible average forward Fig.3 Maximum permissible average forward current as a function of tie-point temperature current as a function of ambient temperature (including losses due to reverse leakage). (including losses due to reverse leakage). MGD483 MBH398 200 10 handbook, halfpage handbook, halfpage T Ij F (°C) (A) 160 8 120 6 804DGJKM402000400 800 1200 0 0.4 0.8 1.2 1.6 2.0 VR (V) VF (V) Device mounted as shown in Fig.7. Solid line: Al2O3 PCB. Solid line: Tj = 25 °C. Dotted line: epoxy PCB. Dotted line: Tj = 175 °C. Fig.4 Maximum permissible junction temperature Fig.5 Forward current as a function of forward as a function of reverse voltage. voltage; maximum values. 1996 May 24 4, MGC739 handboo1k,0 halfpage I 50R handbook, full pagewidth (µA) 4.5 2.5 0 40 80 120 160 200 1.25 MSB213 T oj ( C) VR = VRMMmax. Dimensions in mm. Fig.6 Reverse current as a function of junction temperature; maximum values. Fig.7 Printed-circuit board for surface mounting. handbook, full pagewidth IDUT F (A) + 0.5 10 Ω 25Vtrr1Ω50Ω0t0.25 0.5

IR

(A) 1 MAM057 Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns. Source impedance: 50 Ω; tr ≤ 15 ns. Fig.8 Test circuit and reverse recovery time waveform and definition. 1996 May 24 5, PACKAGE OUTLINE 5.5 handbook, full pagewidth 5.1 4.5 4.3 2.3 2.0 0.05 0.23.3 2.7 MSA414 2.8 1.6 2.4 1.4 Dimensions in mm. Fig.9 SOD106.

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 May 24 6]
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