Download: DISCRETE SEMICONDUCTORS DATA SHEET BYD43 series Fast soft-recovery rectifiers Product specification 1996 Jun 05 Supersedes data of February 1995 File under Discrete Semiconductors, SC01

DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D119 BYD43 series Fast soft-recovery rectifiers Product specification 1996 Jun 05 Supersedes data of February 1995 File under Discrete Semiconductors, SC01 FEATURES DESCRIPTION and fatigue free as coefficients of expansion of all used parts are • Glass passivated Cavity free cylindrical glass package matched. • High maximum operating through Implotec (1) technology. temperature This package is hermetically sealed (1) Implotec is a trademark of Philips. • Low leakage current • Excellent stability • Available in ammo-pack. handbook, 4 colum...
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DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, halfpage M3D119

BYD43 series Fast soft-recovery rectifiers

Product specification 1996 Jun 05 Supersedes data of February 1995 File under Discrete Semiconductors, SC01, FEATURES DESCRIPTION and fatigue free as coefficients of expansion of all used parts are • Glass passivated Cavity free cylindrical glass package matched. • High maximum operating through Implotec (1) technology. temperature This package is hermetically sealed (1) Implotec is a trademark of Philips. • Low leakage current • Excellent stability • Available in ammo-pack. handbook, 4 columnskaMAM123 Fig.1 Simplified outline (SOD81) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRSM non-repetitive peak reverse voltage BYD43U − 1300 V BYD43V − 1500 V BYD43-16 − 1700 V BYD43-18 − 1900 V BYD43-20 − 2100 V VRRM repetitive peak reverse voltage BYD43U − 1200 V BYD43V − 1400 V BYD43-16 − 1600 V BYD43-18 − 1800 V BYD43-20 − 2000 V IF(AV) average forward current Ttp = 55 °C; lead length = 10 mm; BYD43U and V see Figs 2 and 3; − 1.20 A averaged over any 20 ms period; BYD43-16 to 20 − 0.68 A see also Figs 10 and 11 IF(AV) average forward current Tamb = 65 °C; PCB mounting (see BYD43U and V Fig.20); see Figs 4 and 5; − 0.65 A averaged over any 20 ms period; BYD43-16 to 20 − 0.30 A see also Figs 10 and 11 IFRM repetitive peak forward current Ttp = 55 °C; see Figs 6 and 7 BYD43U and V − 11 A BYD43-16 to 20 − 6 A IFRM repetitive peak forward current Tamb = 65 °C; see Figs 8 and 9 BYD43U and V − 6.0 A BYD43-16 to 20 − 3.2 A 1996 Jun 05 2, SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT IFSM non-repetitive peak forward current t = 10 ms half sinewave; Tj = Tj max BYD43U and V prior to surge; VR = VRRMmax − 6 A BYD43-16 to 20 − 6 A Tstg storage temperature −65 +175 °C Tj junction temperature see Figs 12 and 13 −65 +175 °C ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF forward voltage IF = 1 A; Tj = Tj max; BYD43U and V see Figs 14 and 15 − − 1.20 V BYD43-16 to 20 − − 2.05 V VF forward voltage IF = 1 A; BYD43U and V see Figs 14 and 15 − − 1.5 V BYD43-16 to 20 − − 2.4 V IR reverse current VR = VRRMmax; BYD43U and V see Figs 16 and 17 − − 1 µA BYD43-16 to 20 − − 5 µA IR reverse current VR = VRRMmax BYD43U and V Tj = 165 °C; see Fig 16 − − 100 µA BYD43-16 to 20 Tj = 125 °C; see Fig 17 − − 50 µA trr reverse recovery time when switched from BYD43U and V IF = 0.5 A to IR = 1 A; − − 250 ns measured at IR = 0.25 A;BYD43-16 to 20 − − 300 ns see Fig 22 Cd diode capacitance f = 1 MHz; VR = 0 V; BYD43U and V see Figs 18 and 19 − 20 − pF BYD43-16 to 20 − 15 − pF dI maximum slope of reverse recovery when switched from -R- dt current IF = 1 A to VR ≥ 30 V BYD43U and V and dIF/dt = −1 A/µs; − − 5 A/µs see Fig.21 BYD43-16 to 20 − − 5 A/µs THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 60 K/W Rth j-a thermal resistance from junction to ambient note 1 120 K/W Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.20. For more information please refer to the ‘General Part of Handbook SC01’. 1996 Jun 05 3, GRAPHICAL DATA MLC311 MLC315 1.6 0.8 handbook, halfpage handbook, halfpage I F(AV) I F(AV) (A) lead length 10 mm (A) lead length 10 mm 1.2 0.6 0.8 0.4 0.4 0.2000100 T ( o C) 200 0 100To200tp tp ( C) BYD43U and V BYD43-16 to 20 a = 1.42; VR = VRRMmax; δ = 0.5. a = 1.42; VR = VRRMmax; δ = 0.5. Switched mode application. Switched mode application. Fig.2 Maximum permissible average forward Fig.3 Maximum permissible average forward current as a function of tie-point temperature current as a function of tie-point temperature (including losses due to reverse leakage). (including losses due to reverse leakage). MLC312 MLC316 1.0 0.5 handbook, halfpage handbook, halfpage I F(AV) IF(AV) (A) (A) 0.8 0.4 0.6 0.3 0.4 0.2 0.2 0.1000100 o 200 0 100 o 200Tamb( C) Tamb( C) BYD43U and V BYD43-16 to 20 a = 1.42; VR = VRRMmax; δ = 0.5. a = 1.42; VR = VRRMmax; δ = 0.5. Device mounted as shown in Fig.20. Device mounted as shown in Fig.20. Switched mode application. Switched mode application. Fig.4 Maximum permissible average forward Fig.5 Maximum permissible average forward current as a function of ambient temperature current as a function of ambient temperature (including losses due to reverse leakage). (including losses due to reverse leakage). 1996 Jun 05 4, MLC320 handbook, full pagewidth I FRM (A) δ = 0.05 0.1 0.2 0.5 10 2 101110 102 103 4t p (ms) 10 BYD43U and V Ttp = 55 °C; Rth j-tp = 60 K/W. VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1 400 V.

Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.

MLC322 handbook, full pagewidth I FRM (A) δ = 0.05 0.1 0.2 0.5 10 2 101110 102 103tp(ms) 10 BYD43-16 to 20 Ttp = 55 °C; Rth j-tp = 60 K/W. VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 2000 V.

Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.

1996 Jun 05 5, MLC321 handbook, full pagewidth I FRM (A) δ = 0.05 0.1 0.2 0.5 10 2 101110 102 103 4t p (ms) 10 BYD43U and V Tamb = 65 °C; Rth j-a = 120 K/W. VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1400 V. Fig.8 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor. MLC323 handbook, full pagewidth I FRM (A) δ = 0.05 0.1 0.2 0.5 10 2 101110 102 103tp(ms) 10 BYD43-16 to 20 Tamb = 65 °C; Rth j-a = 120 K/W. VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 2000 V. Fig.9 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor. 1996 Jun 05 6, MLC310 MLC31433handbook, halfpage handbook, halfpagePP(W) (W) a = 3 2.5 2 1.57 a = 3 2.5 2 1.57221.42 1.42110001IF200.5 ( A V ) (A) I F ( A V ) (A) 1.0 BYD43U and V BYD43-16 to 20 a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5. a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5. Fig.10 Maximum steady state power dissipation Fig.11 Maximum steady state power dissipation (forward plus leakage current losses, (forward plus leakage current losses, excluding switching losses) as a function of excluding switching losses) as a function of average forward current. average forward current. MLC265 MLC318 200 200 handbook, halfpage handbook, halfpage Tj Tj ( o C) ( o C) 100 100 BYD43U BYD43V BYD43-16 18 200001000 2000 0 1000 2000 VR (V) VR (V) BYD43-16 to 20 BYD43U and V Dotted line = VRRM; δ = 0.1. VRRM; δ = 0.5. Solid line = VRRM; δ = 0.5. Fig.12 Maximum permissible junction temperature Fig.13 Maximum permissible junction temperature as a function of reverse voltage. as a function of reverse voltage. 1996 Jun 05 7, MLC309 MLC19263handbook, halfpage handbook, halfpageIFIF (A) (A) 422100012024V F (V) 3VF(V) BYD43U and V BYD43-16 to 20 Dotted line: Tj = 175 °C. Dotted line: Tj = 175 °C. Solid line: Tj = 25 °C. Solid line: Tj = 25 °C. Fig.14 Forward current as a function of forward Fig.15 Forward current as a function of forward voltage; maximum values. voltage; maximum values. MLC313 MLC31933handbook1, 0halfpage handbook1, 0halfpage IR IR (µA) (µA) 102 102 10 10110100 o 200 0 100 200Tj ( C) Tj ( o C) BYD43U and V BYD43-16 to 20 VR = VRRMmax. VR = VRRMmax. Fig.16 Reverse current as a function of junction Fig.17 Reverse current as a function of junction temperature; maximum values. temperature; maximum values. 1996 Jun 05 8, MLC305 MLC317 2 10 handbook1, 0halfpage handbook, halfpage Cd Cd (pF) (pF) 11110 102323V (V) 10 1 10 10 V (V) 10R R BYD43U and V BYD43-16 to 20 f = 1 MHz; Tj = 25 °C. f = 1 MHz; Tj = 25 °C. Fig.18 Diode capacitance as a function of reverse Fig.19 Diode capacitance as a function of reverse voltage; typical values. voltage; typical values. handbook, halfpage handboIoFk, halfpage dIF dt 50 trr 10% t dIR dt 2 100% IR MGC499 MGA200 Dimensions in mm. Fig.20 Device mounted on a printed-circuit board. Fig.21 Reverse recovery definitions. 1996 Jun 05 9, handbook, full pagewidth DUT IF (A) + 0.5 10 Ω 25Vtrr1Ω50Ω0t0.25 0.5

IR

(A) 1 MAM057 Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns. Source impedance: 50 Ω; tr ≤ 15 ns. Fig.22 Test circuit and reverse recovery time waveform and definition. 1996 Jun 05 10, PACKAGE OUTLINE 5 max handbook, full pagewidth 0.81 max 2.15 MBC051 max 28 min 3.8 max 28 min Dimensions in mm. The marking band indicates the cathode. Fig.23 SOD81.

DEFINITIONS

Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 05 11]
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