Download: Order this document SEMICONDUCTOR TECHNICAL DATA by MBRB2060CT/D D2PAK Surface Mount Power Package Motorola Preferred Device

Order this document SEMICONDUCTOR TECHNICAL DATA by MBRB2060CT/D D2PAK Surface Mount Power Package Motorola Preferred Device Employs the use of the Schottky Barrier principle with a platinum barrier metal. These state–of–the–art devices have the following features: • Package Designed for Power Surface Mount Applications SCHOTTKY BARRIER • Center–Tap Configuration RECTIFIER • Guardring for Stress Protection 20 AMPERES • Low Forward Voltage 60 VOLTS • 150°C Operating Junction Temperature • Epoxy Meets UL94, VO at 1/8″ • Guaranteed Reverse Avalanche • Short Heat Sink Tab Manufactured — Not Shea...
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Order this document SEMICONDUCTOR TECHNICAL DATA by MBRB2060CT/D D2PAK Surface Mount Power Package Motorola Preferred Device

Employs the use of the Schottky Barrier principle with a platinum barrier metal. These state–of–the–art devices have the following features: • Package Designed for Power Surface Mount Applications SCHOTTKY BARRIER • Center–Tap Configuration RECTIFIER • Guardring for Stress Protection 20 AMPERES • Low Forward Voltage 60 VOLTS • 150°C Operating Junction Temperature • Epoxy Meets UL94, VO at 1/8″ • Guaranteed Reverse Avalanche • Short Heat Sink Tab Manufactured — Not Sheared! • Similar in Size to Industry Standard TO–220 Package 4 Mechanical Characteristics 4 • Case: Epoxy, Molded33• Weight: 1.7 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are CASE 418B–02 Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped 50 units per plastic tube • Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a “T4” suffix to the part number • Marking: B2060T MAXIMUM RATINGS, PER LEG Rating Symbol Value Unit Peak Repetitive Reverse Voltage VRRM 60 Volts Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current IF(AV) 10 Amps (Rated VR) TC = 110°C Total Device 20 Peak Repetitive Forward Current IFRM 20 Amps (Rated VR, Square Wave, 20 kHz), TC = 100°C Non-repetitive Peak Surge Current IFSM 150 Amps (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) IRRM 0.5 Amp Storage Temperature Tstg –65 to +175 °C Operating Junction Temperature TJ –65 to +150 °C Voltage Rate of Change (Rated VR) dv/dt 10000 V/µs THERMAL CHARACTERISTICS, PER LEG Thermal Resistance — Junction to Case RθJC 2.0 °C/W — Junction to Ambient (1) RθJA 50 (1) See Chapter 7 for mounting conditions Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Designer’s and SWITCHMODE are trademarks of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev1RMeoctotriofilea,r InDce. 1v9ic96e Data 1,

ELECTRICAL CHARACTERISTICS, PER LEG

Rating Symbol Value Unit Maximum Instantaneous Forward Voltage (2) vF Volts (iF = 20 Amps, TJ = 125°C) 0.85 (iF = 20 Amps, TJ = 25°C) 0.95 Maximum Instantaneous Reverse Current (2) iR mA (Rated dc Voltage, TJ = 125°C) 150 (Rated dc Voltage, TJ = 25°C) 0.15 (2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%. TJ = 150°C 150°C 20 10 175°C TJ = 125°C 100°C TJ = 100°C51TJ = 25°C 0.1 0.5 0.01 TJ = 25°C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.91020 40 60 80 100 120 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage Per Diode Figure 2. Typical Reverse Current Per Diode

32 20 I /I = 5 RATED VOLTAGE PK AV18 28 TJ = 125°CAPPLIED 16 PI 24 I /I = 10 RθJC = 2°C/W 14 PK AV 20 12 IPK/IAV = 20 16 10 DC SQUARE 12 SQUARE 8 WAVE WAVE68DC420080 90 100 110 120 130 140 150 1600246810 12 14 16 18 20 TC, CASE TEMPERATURE (°C) AVERAGE CURRENT (AMPS)

Figure 3. Typical Current Derating, Case, Figure 4. Average Power Dissipation and Per Leg Average Current

2 Rectifier Device Data I F(AV), AVERAGE FORWARD CURRENT (AMPS) iF, INSTANTANEOUS FORWARD CURRENT (AMPS) AVERAGE POWER (WATTS) I R, REVERSE CURRENT (mA),

INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total between the board and the package. With the correct pad design. The footprint for the semiconductor packages must be geometry, the packages will self align when subjected to a the correct size to insure proper solder connection interface solder reflow process. 0.74 18.79 0.065 1.651 0.420 10.66 0.07 1.78 0.14 0.330 3.56 8.38 inches mm D2PAK POWER DISSIPATION The power dissipation of the D2PAK is a function of the drain The 50°C/W for the D2PAK package assumes the use of the pad size. This can vary from the minimum pad size for recommended footprint on a glass epoxy printed circuit board soldering to a pad size given for maximum power dissipation. to achieve a power dissipation of 2.5 watts. There are other Power dissipation for a surface mount device is determined by alternatives to achieving higher power dissipation from the TJ(max), the maximum rated junction temperature of the die, D2PAK package. One is to increase the area of the drain pad. RθJA, the thermal resistance from the device junction to By increasing the area of the drain pad, the power dissipation ambient; and the operating temperature, TA. Using the values can be increased. Although one can almost double the power provided on the data sheet for the D2PAK package, PD can be dissipation with this method, one will be giving up area on the calculated as follows: printed circuit board which can defeat the purpose of using T – T surface mount technology.J(max) A PD = Another alternative would be to use a ceramic substrate orRθJA an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core The values for the equation are found in the maximum board, the power dissipation can be doubled using the same ratings table on the data sheet. Substituting these values into footprint. the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 2.5 watts. P = 150°C – 25°CD = 2.5 watts 50°C/W Rectifier Device Data 3,

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated • When shifting from preheating to soldering, the maximum temperature of the device. When the entire device is heated temperature gradient shall be 5°C or less. to a high temperature, failure to complete soldering within a • After soldering has been completed, the device should be short time could result in device failure. Therefore, the allowed to cool naturally for at least three minutes. following items should always be observed in order to Gradual cooling should be used as the use of forced minimize the thermal stress to which the devices are cooling will increase the temperature gradient and result subjected. in latent failure due to mechanical stress. • Always preheat the device. • Mechanical stress or shock should not be applied during • The delta temperature between the preheat and soldering cooling. should be 100°C or less.* • When preheating and soldering, the temperature of the * Soldering a device without preheating can cause excessive leads and the case must not exceed the maximum thermal shock and stress which can result in damage to the temperature ratings as shown on the data sheet. When device. using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. * Due to shadowing and the inability to set the wave height to • The soldering temperature and time shall not exceed incorporate other surface mount components, the D2PAK is 260°C for more than 5 seconds. not recommended for wave soldering.

TYPICAL SOLDERING HEATING PROFILE

For any given circuit board, there will be a group of control the graph shows the actual temperature that might be settings that will give the desired heat pattern. The operator experienced on the surface of a test board at or near a central must set temperatures for several heating zones, and a figure solder joint. The two profiles are based on a high density and for belt speed. Taken together, these control settings make up a low density board. The Vitronics SMD310 convection/in- a heating “profile” for that particular circuit board. On frared reflow soldering system was used to generate this machines controlled by a computer, the computer remembers profile. The type of solder used was 62/36/2 Tin Lead Silver these profiles from one operating session to the next. Figure with a melting point between 177–189°C. When this type of 5 shows a typical heating profile for use when soldering the furnace is used for solder reflow work, the circuit boards and D2PAK to a printed circuit board. This profile will vary among solder joints tend to heat first. The components on the board soldering systems but it is a good starting point. Factors that are then heated by conduction. The circuit board, because it can affect the profile include the type of soldering system in has a large surface area, absorbs the thermal energy more use, density and types of components on the board, type of efficiently, then distributes this energy to the components. solder used, and the type of board or substrate material being Because of this effect, the main body of a component may be used. This profile shows temperature versus time. The line on up to 30 degrees cooler than the adjacent solder joints. STEP 1 STEP 2 STEP 3 STEP 4 STEP 5 STEP 6 STEP 7 PREHEAT VENT HEATING HEATING HEATING VENT COOLING ZONE 1 “SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7 “RAMP” “RAMP” “SOAK” “SPIKE” 205° TO 219°C PEAK AT 200°C 170°C SOLDER JOINT DESIRED CURVE FOR HIGH MASS ASSEMBLIES 160°C 150°C 150°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS 100°C 140°C (DEPENDING ON 100°C MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 5. Typical Solder Heating Profile for D2PAK 4 Rectifier Device Data,

PACKAGE DIMENSIONS C E V NOTES: B 1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982. 4 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX

A A 0.340 0.380 8.64 9.65 S B 0.380 0.405 9.65 10.29

123C0.160 0.190 4.06 4.83 D 0.020 0.035 0.51 0.89 E 0.045 0.055 1.14 1.40 –T– G 0.100 BSC 2.54 BSCK SEATING H 0.080 0.110 2.03 2.79 PLANE J 0.018 0.025 0.46 0.64

GJK0.090 0.110 2.29 2.79

S 0.575 0.625 14.60 15.88

H V 0.045 0.055 1.14 1.40 D 3 PL

0.13 (0.005) M T STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE

CASE 418B–02 4. CATHODE ISSUE B Rectifier Device Data 5

, Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: email is hidden – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 6 ◊ CODELINE TO BE PLACED HERE RectMifBieRr BD2e0v6ic0eC TD/Data]
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