Download: Order this document SEMICONDUCTOR TECHNICAL DATA by MR750/D

Order this document SEMICONDUCTOR TECHNICAL DATA by MR750/D • Current Capacity Comparable to Chassis Mounted Rectifiers • Very High Surge Capacity • Insulated Case Mechanical Characteristics: • Case: Epoxy, Molded MR754 and MR760 are Motorola Preferred Devices • Weight: 2.5 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Lead is HIGH CURRENT Readily Solderable LEAD MOUNTED • Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds SILICON RECTIFIERS • Polarity: Cathode Polarity Band 50–1000 VOLTS • Shipped 1000 units per plastic bag. Available ...
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Order this document SEMICONDUCTOR TECHNICAL DATA by MR750/D

• Current Capacity Comparable to Chassis Mounted Rectifiers • Very High Surge Capacity • Insulated Case Mechanical Characteristics: • Case: Epoxy, Molded MR754 and MR760 are Motorola Preferred Devices • Weight: 2.5 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Lead is HIGH CURRENT Readily Solderable LEAD MOUNTED • Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds SILICON RECTIFIERS • Polarity: Cathode Polarity Band 50–1000 VOLTS • Shipped 1000 units per plastic bag. Available Tape and Reeled, 800 units DIFFUSED JUNCTION per reel by adding a “RL’’ suffix to the part number • Marking: R750, R751, R752, R754, R758, R760 CASE 194–04 MAXIMUM RATINGS Characteristic Symbol MR750 MR751 MR752 MR754 MR756 MR758 MR760 Unit Peak Repetitive Reverse Voltage VRRM 50 100 200 400 600 800 1000 Volts Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Non–Repetitive Peak Reverse Voltage VRSM 60 120 240 480 720 960 1200 Volts (Halfwave, single phase, 60 Hz peak) RMS Reverse Voltage VR(RMS) 35 70 140 280 420 560 700 Volts Average Rectified Forward Current IO 22 (TL = 60°C, 1/8″ Lead Lengths) Amps (Single phase, resistive load, 60 Hz) 6.0 (TA = 60°C, P.C. Board mounting) See Figures 5 and 6 Non–Repetitive Peak Surge Current IFSM Amps (Surge applied at rated load conditions) 400 (for 1 cycle) Operating and Storage Junction TJ, Tstg °C 65 to +175 Temperature Range ELECTRICAL CHARACTERISTICS Characteristic and Conditions Symbol Max Unit Maximum Instantaneous Forward Voltage Drop vF 1.25 Volts (iF = 100 Amps, TJ = 25°C) Maximum Forward Voltage Drop VF 0.90 Volts (IF = 6.0 Amps, TA = 25°C, 3/8″ leads) Maximum Reverse Current TJ = 25°C IR 25 µA (Rated dc Voltage) TJ = 100°C 1.0 mA Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Preferred devices are Motorola recommended choices for future use and best overall value. Rev 2 Rectifier Device Data 1 Motorola, Inc. 1996, 700 600 VRRM MAY BE APPLIED BETWEEN 500 TJ = 25°C EACH CYCLE OF SURGE. THE TJ 400 NOTED IS TJ PRIOR TO SURGE 300 300

MAXIMUM

200 25°C TYPICAL 200 175°C 25°C 100 TJ = 175°C 50 80 30 60 1.0 2.0 5.0 10 20 50 100 NUMBER OF CYCLES AT 60 Hz

Figure 2. Maximum Surge Capability

7.0 5.0 +0.5 3.0 0 2.0 –0.5 TYPICAL RANGE 1.0 0.7 –1.0 0.5 –1.5 0.3 0.2 –2.0 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) iF, INSTANTANEOUS FORWARD CURRENT (AMP)

Figure 1. Forward Voltage Figure 3. Forward Voltage Temperature Coefficient

10LL1/2”3/8” 5.0 1/4” HEAT SINK 1/8” 3.0 2.0 Both leads to heat sink, with lengths as shown. Variations in RJL(t) below 2.0 seconds are independent of lead connections of 1/8 inch or greater, and vary only about ±20% from the values shown. Values 1.0 for times greater than 2.0 seconds may be obtained by drawing a curve, with the end point (at 70 seconds) taken from Figure 8, or calculated from the notes, using the given curves as a guide. Either 0.5 typical or maximum values may be used. For RJL(t) values at pulse widths less than 0.1 second, the above curve can be extrapolated 0.3 down to 10 µs at a continuing slope. 0.2 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 t, TIME (SECONDS)

Figure 4. Typical Transient Thermal Resistance

2 Rectifier Device Data RθJL(t) , JUNCTION–TO–LEAD TRANSIENT iF, INSTANTANEOUS FORWARD CURRENT (AMP) THERMAL RESISTANCE ( ° C/W) COEFFICIENT (mV/ ° C) IFSM, PEAK HALF WAVE CURRENT (AMP), 28 7.0 L = 1/8” RESISTIVE INDUCTIVE RθJA = 25°C/W 24 LOADS 6.0 SEE NOTE 1/4” RESISTIVE INDUCTIVE LOADS 20 BOTH LEADS TO HEAT 5.0 CAPACITANCE LOADS – 1 & 3 SINK WITH LENGTHS 16 3/8” AS SHOWN I(pk) = 5 I4.0 avgI(pk) = 10 Iavg I(pk) = 20 I12 3.0 avg5/8” RθJA = 40°C/W 8.0 2.0 f = 60 Hz SEE NOTE 4.0 1.0 6 (IPK/IAVE = 6.28) 00020 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 TL, LEAD TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)

Figure 5. Maximum Current Ratings Figure 6. Maximum Current Ratings NOTES

32 THERMAL CIRCUIT MODEL CAPACITANCE LOADS (For Heat Conduction Through The Leads) 28 I(pk) = 5 Iavg 6 RθS(A) RθL(A) RθJ(A) RθJ(K) RθL(K) RθS(K) 24 10 Iavg 1 & 3 TA(A) P TF A(K)20 20 Iavg TL(A) TC(A) TJ TC(K) TL(K) Use of the above model permits junction to lead thermal resistance for 8.0 RESISTIVE – INDUCTIVE LOADS any mounting configuration to be found. Lowest values occur when one side of the rectifier is brought as close as possible to the heat sink as 4.0 shown below. Terms in the model signify: TA = Ambient Temperature TC = Case Temperature 0 4.0 8.0 12 16 20 24 28 32 TL = Lead Temperature TJ = Junction Temperature RS = Thermal Resistance, Heat Sink to Ambient IF(AV), AVERAGE FORWARD CURRENT (AMPS) RL = Thermal Resistance, Lead to Heat Sink RJ = Thermal Resistance, Junction to CaseFigure 7. Power Dissipation PF = Power Dissipation (Subscripts A and K refer to anode and cathode sides, respectively.) Values for thermal resistance components are: RL = 40°C/W/in. Typically and 44°C/W/in Maximum. 40 RJ = 2°C/W typically and 4°C/W Maximum. Since RJ is so low, measurements of the case temperature, T , will beSINGLE LEAD TO HEAT SINK, C 35 approximately equal to junction temperature in practical lead mountedINSIGNIFICANT HEAT FLOW applications. When used as a 60 Hz rectifierm the slow thermal response 30 THROUGH OTHER LEAD holds TJ(PK) close to TJ(AVG). Therefore maximum lead temperature may be found from: TL = 175°–RθJL PF. PF may be found from Figure 7. 25 The recommended method of mounting to a P.C. board is shown on the sketch, where RθJA is approximately 25°C/W for a 1–1/2” x 1–1/2” copper 20 surface area. Values of 40°C/W are typical for mounting to terminal strips or PÉ.C. boÉards where available surface area is small.

ÉÉ

10 BOTH LEADS TO HEAT ÉÉ 5.0 SINK, EQUAL LENGTH ÉÉ 0 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0 ÉÉ L, LEAD LENGTH (INCHES) ÉÉ

Board Ground Plane Figure 8. Steady State Thermal Resistance ÉÉRecommended mounting for half wave circuit ÉÉ Rectifier Device Data 3

R θJL , THERMAL RESISTANCE, PF(AV), POWER DISSIPATION (WATTS) IF(AV), AVERAGE FORWARD CURRENT (AMPS) JUNCTION–TO–LEAD( ° C/W) IF(AV), AVERAGE FORWARD CURRENT (AMPS), 100 30 70 TJ = 25°C TJ = 25°C 50TJ= 175°C 7.0 IF = 5 A CURRENT INPUT WAVEFORM 5.03A1A30 3.0 IF 2.0 0 IR trr 20 1.0 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 REPETITION FREQUENCY (kHz) IR/IF, RATIO OF REVERSE TO FORWARD CURRENT Figure 9. Rectification Efficiency Figure 10. Reverse Recovery Time 1000 1.0 700fT= 25°C 500 0.7

J

TJ = 25°C 300 tfr fr 0.5 fr = 1.0 V 100 0.3 0.2 20 fr = 2.0 V 10 0.1 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 1.0 2.0 3.0 5.0 7.0 10 VR, REVERSE VOLTAGE (VOLTS) IF, FORWARD PULSE CURRENT (AMP) Figure 11. Junction Capacitance Figure 12. Forward Recovery Time For a square wave input of amplitude Vm, the efficiency RS factor becomes: RL VO V2m 2RL σ .(square) V2m 100% 50% (3)Figure 13. Single–Phase Half–Wave Rectifier Circuit RL The rectification efficiency factor σ shown in Figure 9 was (A full wave circuit has twice these efficiencies) calculated using the formula: As the frequency of the input signal is increased, the re- 2 (dc) verse recovery time of the diode (Figure 10) becomes signifi-V o (1) R cant, resulting in an increasing ac voltage component acrossPL2(dc) σ (dc) Vo2(rms) .100% .100% RL which is opposite in polarity to the forward current, there-P V o(rms) V2o(ac) V2o(dc) by reducing the value of the efficiency factor σ, as shown on RL Figure 9. For a sine wave input Vm sin (wt) to the diode, assumed It should be emphasized that Figure 9 shows waveform ef- lossless, the maximum theoretical efficiency factor becomes: ficiency only; it does not provide a measure of diode losses. Data was obtained by measuring the ac component ofV2oV m with a true rms ac voltmeter and the dc component with a dc RL . voltmeter. The data was used in Equation 1 to obtain pointsσ(sine) V2m 100% .100% 40.6% (2) π2 for Figure 9. 4RL 4 Rectifier Device Data C, CAPACITANCE (pF) RELATIVE EFFICIENCY (%) t fr , FORWARD RECOVERY TIME ( s) t rr, REVERSE RECOVERY TIME ( s),

PACKAGE DIMENSIONS A D

NOTES: 1 1. CATHODE SYMBOL ON PACKAGE. MILLIMETERS INCHES

K DIM MIN MAX MIN MAX

A 8.43 8.69 0.332 0.342 B 5.94 6.25 0.234 0.246 D 1.27 1.35 0.050 0.053 E 25.15 25.65 0.990 1.010

B

STYLE 1: PIN 1. CATHODE

K 2. ANODE CASE 194–04 ISSUE F Rectifier Device Data 5

, Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1, P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488 Customer Focus Center: 1–800–521–6274 Mfax: email is hidden – TOUCHTONE 1–602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, Motorola Fax Back System – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 – http://sps.motorola.com/mfax/ HOME PAGE: http://motorola.com/sps/ 6 ◊ CODELINE TO BE PLACED HERE Rectifier DevicMe RD7a5t0a/D]
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Features Package Applications Description Symbol
SEMICONDUCTORRHRU50120 April 1995 50A, 1200V Hyperfast Diode Features Package • Hyperfast with Soft Recovery .tRR Q t3 > 01 +V L1 t≤ A(MIN)1 R4 10 0 dIFtLIRR t LOOP F dt 2 tA tBRt21 DUT Q4 0.25 IRM t3 IRM C1R04VR Q3 -V2 R -V3 4 VRM FIGURE 1. tRR TEST CIRCUIT