Download: Order this document SEMICONDUCTOR TECHNICAL DATA by MBRS1100T3/D Surface Mount Power Package
Order this document SEMICONDUCTOR TECHNICAL DATA by MBRS1100T3/D Surface Mount Power Package Motorola Preferred Device Schottky Power Rectifiers employ the use of the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and SCHOTTKY BARRIER polarity protection diodes, in surface mount applications where compact size RECTIFIER and weight are critical to the system. These state-of-the-art...
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Order this document SEMICONDUCTOR TECHNICAL DATA by MBRS1100T3/D Surface Mount Power Package
Motorola Preferred Device Schottky Power Rectifiers employ the use of the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and SCHOTTKY BARRIER polarity protection diodes, in surface mount applications where compact size RECTIFIER and weight are critical to the system. These state-of-the-art devices have the 1.0 AMPERE following features: 100 VOLTS • Small Compact Surface Mountable Package with J-Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • High Blocking Voltage — 100 Volts • 150°C Operating Junction Temperature • Guardring for Stress Protection Mechanical Characteristics • Case: Epoxy, Molded • Weight: 95 mg (approximately) CASE 403A–03 • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped in 12 mm Tape and Reel, 2500 units per reel • Polarity: Notch in Plastic Body Indicates Cathode Lead • Marking: B110 MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage VRRM 100 Volts Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current TL = 120°C IF(AV) 1.0 Amps TL = 100°C 2.0 Nonrepetitive Peak Surge Current IFSM 50 Amps (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature TJ – 65 to +150 °C Voltage Rate of Change dv/dt 10 V/ns THERMAL CHARACTERISTICS Thermal Resistance — Junction to Lead (TL = 25°C) RθJL 22 °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (1) VF 0.75 Volts (iF = 1.0 A, TJ = 25°C) Maximum Instantaneous Reverse Current (1) iR mA (Rated dc Voltage, TJ = 25°C) 0.5 (Rated dc Voltage, TJ = 100°C) 5.0 (1) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%. Preferred devices are Motorola recommended choices for future use and best overall value. Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Rev2RMeoctotriofilea,r InDce. 1v9ic96e Data 1,TYPICAL ELECTRICAL CHARACTERISTICS
201K10 400 5 TJ = 150°C 100 TJ = 150°C 40 125°C 2 20 100°C 10 100°C 0.5 25°C 2 0.2 0.4 0.2 0.1 0.1 0.05 0.04 0.02 0.02 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 0 10 20 30 40 50 60 70 80 90 100 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current
3.2 4.0 RATED VR APPLIED 2.8 3.5 RθJL = 22°C/W TJ = 100°C TJ = 100°C 2.4 3.0DC
2.0 2.5SQUARE
1.6 SQUAREWAVE 2.0 WAVE 1.2 DC 1.5 0.8 1.0 0.4 0.50000.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 40 60 80 100 120 140 160 IF(AV), AVERAGE FORWARD CURRENT (AMPS) TL, LEAD TEMPERATURE (°C)Figure 3. Power Dissipation Figure 4. Current Derating, Lead
240 NOTE: TYPICAL CAPACITANCE 220 NOTE: AT0V= 270 pF 0.1 0.2 0.512510 20 50 100 VR, REVERSE VOLTAGE (VOLTS)Figure 5. Typical Capacitance
2 Rectifier Device Data PF ( A V ) , AVERAGE POWER DISSIPATION (WATTS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) C, CAPACITANCE (pF) I F ( A V ) , AVERAGE FORWARD CURRENT (AMPS) I R , REVERSE CURRENT (µA),INFORMATION FOR USING THE SMB SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total between the board and the package. With the correct pad design. The footprint for the semiconductor packages must be geometry, the packages will self align when subjected to a the correct size to insure proper solder connection interface solder reflow process. 0.089 2.261 0.108 2.743 0.085 inches 2.159 mm MOUNTING PRECAUTIONS The melting temperature of solder is higher than the rated • The soldering temperature and time shall not exceed temperature of the device. When the entire device is heated 260°C for more than 5 seconds. to a high temperature, failure to complete soldering within a • When shifting from preheating to soldering, the maximum short time could result in device failure. Therefore, the temperature gradient shall be 5°C or less. following items should always be observed in order to • After soldering has been completed, the device should be minimize the thermal stress to which the devices are allowed to cool naturally for at least three minutes. subjected. Gradual cooling should be used as the use of forced • Always preheat the device. cooling will increase the temperature gradient and result • The delta temperature between the preheat and soldering in latent failure due to mechanical stress. should be 100°C or less.* • Mechanical stress or shock should not be applied during • When preheating and soldering, the temperature of the cooling leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When * Soldering a device without preheating can cause excessive using infrared heating with the reflow soldering method, thermal shock and stress which can result in damage to the the difference shall be a maximum of 10°C. device. Rectifier Device Data 3,PACKAGE DIMENSIONS S A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.D B
INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.160 0.180 4.06 4.57 B 0.130 0.150 3.30 3.81 C 0.075 0.095 1.90 2.41 D 0.077 0.083 1.96 2.11 H 0.0020 0.0060 0.051 0.152 J 0.006 0.012 0.15 0.30C K 0.030 0.050 0.76 1.27
P 0.020 REF 0.51 REF S 0.205 0.220 5.21 5.59K P J H CASE 403A–03 ISSUE B
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1, P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488 Mfax: email is hidden – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET: http://motorola.com/sps 4 ◊ RectifierM DBeRvSic11e0 D0Ta3ta/D]15
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