Download: Order this document SEMICONDUCTOR TECHNICAL DATA by MURHB840CT/D D2PAK Power Surface Mount Package Motorola Preferred Device

Order this document SEMICONDUCTOR TECHNICAL DATA by MURHB840CT/D D2PAK Power Surface Mount Package Motorola Preferred Device Designed for use in switching power supplies, inverters and as free wheeling diodes, these state–of–the–art devices have the following features: • Package Designed for Power Surface Mount Applications • Ultrafast 28 Nanosecond Recovery Times ULTRAFAST RECTIFIER • 175°C Operating Junction Temperature 8.0 AMPERES • Epoxy Meets UL94, VO @ 1/8″ 400 VOLTS • High Temperature Glass Passivated Junction • High Voltage Capability • Low Leakage Specified @ 150°C Case Temperature ...
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Order this document SEMICONDUCTOR TECHNICAL DATA by MURHB840CT/D D2PAK Power Surface Mount Package Motorola Preferred Device

Designed for use in switching power supplies, inverters and as free wheeling diodes, these state–of–the–art devices have the following features: • Package Designed for Power Surface Mount Applications • Ultrafast 28 Nanosecond Recovery Times ULTRAFAST RECTIFIER • 175°C Operating Junction Temperature 8.0 AMPERES • Epoxy Meets UL94, VO @ 1/8″ 400 VOLTS • High Temperature Glass Passivated Junction • High Voltage Capability • Low Leakage Specified @ 150°C Case Temperature • Short Heat Sink Tab Manufactured — Not Sheared! 4 • Similar in Size to Industry Standard TO–220 Package Mechanical Characteristics 1 • Case: Epoxy, Molded 33 • Weight: 1.7 grams (approximately) CASE 418B–02 • Finish: All External Surfaces Corrosion Resistant and Terminal D2PAK Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped 50 units per plastic tube • Available in 24 mm Tape and Reel, 800 units per reel by adding a “T4” suffix to the part number • Marking: UH840 MAXIMUM RATINGS, PER LEG Rating Symbol Value Unit Peak Repetitive Reverse Voltage VRRM 400 Volts Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current (Rated VR), TC = 120°C IF(AV) 4.0 Amps Total Device 8.0 Peak Repetitive Forward Current IFM 8 Amps (Rated VR, Square Wave, 20 kHz), TC = 120°C Non–repetitive Peak Surge Current IFSM 100 Amps (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Controlled Avalanche Energy WAVAL 20 mJ Operating Junction Temperature and Storage Temperature TJ, Tstg –65 to +175 °C THERMAL CHARACTERISTICS, PER LEG Maximum Thermal Resistance — Junction to Case RθJC 3.0 °C/W — Junction to Ambient (1) RθJA 50 (1) See Chapter 7 for mounting conditions Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Designer’s and SWITCHMODE are trademarks of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev1RMeoctotriofilea,r InDce. 1v9ic96e Data 1,

ELECTRICAL CHARACTERISTICS, PER LEG

Characteristic Symbol Max Unit Maximum Instantaneous Forward Voltage (2) (iF = 4.0 Amps, TC = 150°C) vF 1.9 Volts (iF = 4.0 Amps, TC = 25°C) 2.2 Maximum Instantaneous Reverse Current (2) (Rated dc Voltage, TC = 150°C) iR 500 µA (Rated dc Voltage, TC = 25°C) 10 Maximum Reverse Recovery Time trr 28 ns (IF = 1.0 Amp, di/dt = 50 Amps/µs) (2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤2.0% 100 1000 50 500 TJ = 150°C 20 TJ = 150°C 10 50 100°C 5 100°C 20 25°C 102525°C120.5 1 0.5 0.2 0.2 0.1 0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0 50 100 150 200 250 300 350 400 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current, Per Leg

10 1000 RATED VR APPLIED 8 RθJC = 3°C/W

DC

4 SQUARE WAVE 1001110 120 130 140 150 160 170 180 0.01 0.1 1 10 100 TC, CASE TEMPERATURE (°C) VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Current Derating, Case Figure 4. Typical Capacitance, Per Leg

2 Rectifier Device Data I F, AVERAGE POWER DISSIPATION (WATTS) i F, INSTANTANEOUS FORWARD CURRENT (AMP) C, CAPACITANCE (pF) IR, REVERSE CURRENT ( µA), 18 TJ = 175°C 16 SQUARE WAVE

DC

12345678910 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 5. Forward Power Dissipation, Per Leg

INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total between the board and the package. With the correct pad design. The footprint for the semiconductor packages must be geometry, the packages will self align when subjected to a the correct size to insure proper solder connection interface solder reflow process. 0.74 18.79 0.065 1.651 0.420 10.66 0.07 1.78 0.14 0.330 3.56 8.38 inches mm D2PAK POWER DISSIPATION The power dissipation of the D2PAK is a function of the drain the equation for an ambient temperature TA of 25°C, one can pad size. This can vary from the minimum pad size for calculate the power dissipation of the device which in this case soldering to a pad size given for maximum power dissipation. is 3.0 watts. Power dissipation for a surface mount device is determined by 175°C – 25°C TJ(max), the maximum rated junction temperature of the die, PD = = 3.0 watts RθJA, the thermal resistance from the device junction to 50°C/W ambient; and the operating temperature, TA. Using the values The 50°C/W for the D2PAK package assumes the provided on the data sheet for the D2PAK package, PD can be recommended drain pad area of 158K mil2 on FR–4 glass calculated as follows: epoxy printed circuit board to achieve a power dissipation of TJ(max) – TA 3.0 watts using the footprint shown. Another alternative is to PD = R use a ceramic substrate or an aluminum core board such asθJA Thermal Clad. By using an aluminum core board material The values for the equation are found in the maximum such as Thermal Clad, the power dissipation can be doubled ratings table on the data sheet. Substituting these values into using the same footprint. Rectifier Device Data 3 PF(AV), AVERAGE POWER DISSIPATION (WATTS),

GENERAL SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated • When shifting from preheating to soldering, the maximum temperature of the device. When the entire device is heated temperature gradient shall be 5°C or less. to a high temperature, failure to complete soldering within a • After soldering has been completed, the device should be short time could result in device failure. Therefore, the allowed to cool naturally for at least three minutes. following items should always be observed in order to Gradual cooling should be used as the use of forced minimize the thermal stress to which the devices are cooling will increase the temperature gradient and result subjected. in latent failure due to mechanical stress. • Always preheat the device. • Mechanical stress or shock should not be applied during • The delta temperature between the preheat and soldering cooling should be 100°C or less.* • When preheating and soldering, the temperature of the * Soldering a device without preheating can cause excessive leads and the case must not exceed the maximum thermal shock and stress which can result in damage to the temperature ratings as shown on the data sheet. When device. using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. * Due to shadowing and the inability to set the wave height to • The soldering temperature and time shall not exceed incorporate other surface mount components, the D2PAK is 260°C for more than 5 seconds. not recommended for wave soldering.

RECOMMENDED PROFILE FOR REFLOW SOLDERING

For any given circuit board, there will be a group of control the graph shows the actual temperature that might be settings that will give the desired heat pattern. The operator experienced on the surface of a test board at or near a central must set temperatures for several heating zones, and a figure solder joint. The two profiles are based on a high density and for belt speed. Taken together, these control settings make up a low density board. The Vitronics SMD310 convection/in- a heating “profile” for that particular circuit board. On frared reflow soldering system was used to generate this machines controlled by a computer, the computer remembers profile. The type of solder used was 62/36/2 Tin Lead Silver these profiles from one operating session to the next. Figure with a melting point between 177–189°C. When this type of 6 shows a typical heating profile for use when soldering the furnace is used for solder reflow work, the circuit boards and D2PAK to a printed circuit board. This profile will vary among solder joints tend to heat first. The components on the board soldering systems but it is a good starting point. Factors that are then heated by conduction. The circuit board, because it can affect the profile include the type of soldering system in has a large surface area, absorbs the thermal energy more use, density and types of components on the board, type of efficiently, then distributes this energy to the components. solder used, and the type of board or substrate material being Because of this effect, the main body of a component may be used. This profile shows temperature versus time. The line on up to 30 degrees cooler than the adjacent solder joints. STEP 1 STEP 2 STEP 3 STEP 4 STEP 5 STEP 6 STEP 7 PREHEAT VENT HEATING HEATING HEATING VENT COOLING ZONE 1 “SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7 “RAMP” “RAMP” “SOAK” “SPIKE” 205° TO 219°C PEAK AT 200°C 170°C SOLDER JOINT DESIRED CURVE FOR HIGH MASS ASSEMBLIES 160°C 150°C 150°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS 100°C 140°C (DEPENDING ON 100°C MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 6. Typical Solder Heating Profile for D2PAK 4 Rectifier Device Data,

PACKAGE DIMENSIONS C E NOTES: V 1. DIMENSIONING AND TOLERANCING PER ANSI B Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.340 0.380 8.64 9.65

A B 0.380 0.405 9.65 10.29 S C 0.160 0.190 4.06 4.83

123D0.020 0.035 0.51 0.89 E 0.045 0.055 1.14 1.40 G 0.100 BSC 2.54 BSC –T– K H 0.080 0.110 2.03 2.79 SEATING J 0.018 0.025 0.46 0.64

PLANE GJK0.090 0.110 2.29 2.79S 0.575 0.625 14.60 15.88 H V 0.045 0.055 1.14 1.40 D 3 PL

0.13 (0.005) M T STYLE 3:PIN 1. ANODE 2. CATHODE 3. ANODE

CASE 418B–02 4. CATHODE ISSUE B Rectifier Device Data 5

, Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: email is hidden – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 6 ◊ CODELINE TO BE PLACED HERE RecMtifUieRr HDBe8v4ic0eC TD/Data]
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