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MOTOROLA SEMICONDUCTOR TECHNICAL DATA % $ # ADDITIONAL VOLTAGES AVAILABLE ! Motorola Preferred Device !"# # $ !""! ! !## SOT-23 DUAL ZENER OVERVOLTAGE This dual monolithic silicon zener diode is designed for applications requiring transient TRANSIENT SUPPRESSOR overvoltage protection capability. It is intended for use in voltage and ESD sensitive equip- 5.6 VOLTS ment such as computers, printers, business machines, communication systems, medical 24 WATTS PEAK POWER equipment and other applications. Its dual junction common anode design protects two separate lines using only one package. These...
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MOTOROLA SEMICONDUCTOR TECHNICAL DATA

% $ # ADDITIONAL VOLTAGES AVAILABLE ! Motorola Preferred Device !"# # $ !""! ! !## SOT-23 DUAL ZENER OVERVOLTAGE This dual monolithic silicon zener diode is designed for applications requiring transient TRANSIENT SUPPRESSOR overvoltage protection capability. It is intended for use in voltage and ESD sensitive equip- 5.6 VOLTS ment such as computers, printers, business machines, communication systems, medical 24 WATTS PEAK POWER equipment and other applications. Its dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features: 3 • SOT-23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration • 2Peak Power — 24 Watts @ 1.0 ms (Unidirectional), per Figure 5 Waveform • Maximum Clamping Voltage @ Peak Pulse Current CASE 318-07 • Low Leakage < 5.0 µA STYLE 12 • ESD Rating of Class N (exceeding 16 kV) per the Human Body Model LOW PROFILE SOT-23 Mechanical Characteristics: PLASTIC • Void Free, Transfer-Molded, Thermosetting Plastic Case • Corrosion Resistant Finish, Easily Solderable • Package Designed for Optimal Automated Board Assembly 1 • Small Package Size for High Density Applications 3 • Available in 8 mm Tape and Reel 2 Use the Device Number to Order the 7 inch/3,000 Unit Reel Replace “T1” with “T3” in the Device Number to Order the 13 inch/10,000 Unit Reel PIN 1. CATHODE 2. CATHODE WAFER FAB LOCATION: Phoenix, Arizona 3. ANODE ASSEMBLY/TEST LOCATION: Seremban, Malaysia THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Value Unit Peak Power Dissipation @ 1.0 ms (1) Ppk 24 Watts @ TA ≤ 25°C Total Power Dissipation on FR-5 Board (2) @ TA = 25°C °PD° °225 °mW° Derate above 25°C 1.8 mW/°C Thermal Resistance Junction to Ambient RθJA 556 °C/W Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C °PD° °300 °mW Derate above 25°C 2.4 mW/°C Thermal Resistance Junction to Ambient RθJA 417 °C/W Junction and Storage Temperature Range TJ °– 55 to +150° °C Tstg Lead Solder Temperature — Maximum TL 260 °C (10 Second Duration) (1) Non-repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 6. (2) FR-5 = 1.0 x 0.75 x 0.62 in. (3) Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina Thermal Clad is a trademark of the Bergquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. Motorola TVS/Zener Device Data 24 Watt Peak Power Data Sheet 5-55,

MMBZ5V6ALT1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to pins 1 and 3 or Pins 2 and 3) (VF = 0.9 V Max @ IF = 10 mA)

Max Reverse Max Reverse Breakdown Voltage Leakage Current Max Zener Impedance (6) Max Voltage @ Maximum Reverse IRSM(5) Temperature VZT(4) Surge (Clamping Coefficient of (V) @ I ZT IR @ VR ZZT @ I Current ZT ZZK @ IZK Voltage) VZ (mA) (uA) (V) (Ω) (mA) (Ω) (mA) IRSM(5) VRSM (mV/°C) Min Nom Max (A) (V) 5.32 5.6(7) 5.88 20 5.0 3.0 11 1600 0.25 3.0 8.0 1.26 (4) VZ measured at pulse test current IT at an ambient temperature of 25°C. (5) Surge current waveform per Figure 5 and derate per Figure 6. (6) ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current supplied. The specfied limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. (7) Other voltages may be available upon request. Please contact your Motorola representative.

TYPICAL CHARACTERISTICS

8 10000 VZ @ IT

BIDIRECTIONAL

6 1000

UNIDIRECTIONAL

4 100 – 50 0 50 100 150 – 50 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)

Figure 1. Typical Breakdown Voltage Figure 2. Typical Leakage Current

versus Temperature versus Temperature 300 300 260 250 ALUMINA SUBSTRATE UNIDIRECTIONAL 200 200 150 BIDIRECTIONAL 100 FR-5 BOARD 140 50 10000123025 50 75 100 125 150 175 BIAS (V) TA, AMBIENT TEMPERATURE (°C)

Figure 3. Typical Capacitance versus Bias Voltage Figure 4. Steady State Power Derating Curve

24 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-56 C, CAPACITANCE (pF) VZ , BREAKDOWN VOLTAGE (VOLTS) PD , POWER DISSIPATION (mW) IR, REVERSE LEAKAGE CURRENT (nA),

MMBZ5V6ALT1 TYPICAL CHARACTERISTICS

PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE 90 tr PEAK CURRENT DECAYS TO 50% OF I . 80 100 PEAK VALUE — I

RSM

RSM tr ≤ 10 µs 70

IRSM

HALF VALUE — 50 tP 200001234025 50 75 100 125 150 175 200 t, TIME (ms) TA, AMBIENT TEMPERATURE (°C)

Figure 5. Pulse Waveform Figure 6. Pulse Derating Curve

100 100 RECTANGULAR RECTANGULAR WAVEFORM, TA = 25°C WAVEFORM, TA = 25°C BIDIRECTIONAL BIDIRECTIONAL 10 10

UNIDIRECTIONAL UNIDIRECTIONAL

1.0 1.0 0.1 1.0 10 100 1000 0.1 1.0 10 100 1000 PW, PULSEWIDTH (ms) PW, PULSEWIDTH (ms)

Figure 7. Maximum Non-repetitive Surge Figure 8. Maximum Non-repetitive Surge Power, Ppk versus PW Power, Ppk(NOM) versus PW

Power is defined as VRSM x IZ(pk) where VRSM is Power is defined as VZ(NOM) x IZ(pk) where the clamping voltage at IZ(pk). VZ(NOM) is the nominal zener voltage measured at the low test current used for voltage classification.

Motorola TVS/Zener Device Data 24 Watt Peak Power Data Sheet

5-57 Ppk PEAK SURGE POWER (W) VALUE (%) Ppk(NOM), NNOMINAL PEAK POWER (W) PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25°C,

MMBZ5V6ALT1 TYPICAL COMMON ANODE APPLICATIONS

A dual junction common anode design in a SOT-23 pack- board space is at a premium. Two simplified examples of age protects two separate lines using only one package. This MMBZ5V6ALT1 TVS applications are illustrated below. adds flexibility and creativity to PCB design especially when Computer Interface Protection

A

KEYBOARD B TERMINAL FUNCTIONAL PRINTER I/O C DECODER ETC. D

GND

MMBZ5V6ALT1 Microprocessor Protection

VDD VGG

ADDRESS BUS RAM ROM DATA BUS

CPU

I/O MMBZ5V6ALT1

CLOCK

CONTROL BUS

GND

MMBZ5V6ALT1 24 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-58,

MMBZ5V6ALT1 INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total between the board and the package. With the correct pad design. The footprint for the semiconductor packages must be geometry, the packages will self align when subjected to a the correct size to insure proper solder connection interface solder reflow process. 0.037 0.037 0.95 0.95 0.079 2.0 0.035 0.9 0.031 inches 0.8 mm SOT-23 SOT-23 POWER DISSIPATION The power dissipation of the SOT-23 is a function of the SOLDERING PRECAUTIONS drain pad size. This can vary from the minimum pad size for The melting temperature of solder is higher than the rated soldering to a pad size given for maximum power dissipation. temperature of the device. When the entire device is heated Power dissipation for a surface mount device is determined by to a high temperature, failure to complete soldering within a TJ(max), the maximum rated junction temperature of the die, short time could result in device failure. Therefore, the RθJA, the thermal resistance from the device junction to following items should always be observed in order to ambient, and the operating temperature, TA. Using the values minimize the thermal stress to which the devices are provided on the data sheet for the SOT-23 package, PD can subjected. be calculated as follows: • Always preheat the device. TJ(max) – TA • The delta temperature between the preheat and soldering PD = RθJA should be 100°C or less.* • When preheating and soldering, the temperature of the The values for the equation are found in the maximum leads and the case must not exceed the maximum ratings table on the data sheet. Substituting these values into temperature ratings as shown on the data sheet. When the equation for an ambient temperature TA of 25°C, one can using infrared heating with the reflow soldering method, calculate the power dissipation of the device which in this case the difference shall be a maximum of 10°C. is 225 milliwatts. • The soldering temperature and time shall not exceed P = 150°C – 25°CD = 260°C for more than 10 seconds. 225 milliwatts 556°C/W • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. The 556°C/W for the SOT-23 package assumes the use of • After soldering has been completed, the device should be the recommended footprint on a glass epoxy printed circuit allowed to cool naturally for at least three minutes. board to achieve a power dissipation of 225 milliwatts. There Gradual cooling should be used as the use of forced are other alternatives to achieving higher power dissipation cooling will increase the temperature gradient and result from the SOT-23 package. Another alternative would be to use in latent failure due to mechanical stress. a ceramic substrate or an aluminum core board such as • Mechanical stress or shock should not be applied during Thermal Clad. Using a board material such as Thermal Clad, cooling. an aluminum core board, the power dissipation can be doubled using the same footprint. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. Motorola TVS/Zener Device Data 24 Watt Peak Power Data Sheet 5-59,

Transient Voltage Suppressors — Surface Mounted

24 Watt Peak Power NOTES: 1. DIMENSIONING AND TOLERANCING PER

A ANSI Y14.5M, 1982. L 2. CONTROLLING DIMENSION: INCH.3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

B S INCHES MILLIMETERS

1 2 DIM MIN MAX MIN MAX A 0.1102 0.1197 2.80 3.04 B 0.0472 0.0551 1.20 1.40 C 0.0350 0.0440 0.89 1.11

V D 0.0150 0.0200 0.37 0.50G G 0.0701 0.0807 1.78 2.04

H 0.0005 0.0040 0.013 0.100 J 0.0034 0.0070 0.085 0.177 K 0.0180 0.0236 0.45 0.60

C L 0.0350 0.0401 0.89 1.02

S 0.0830 0.0984 2.10 2.50 V 0.0177 0.0236 0.45 0.60

DHKJ

STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE

CASE 318-07 PLASTIC

(Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)

MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type No. Suffix MPQ (Units) Tape and Reel T1 3K Tape and Reel T3 10K

(Refer to Section 10 for more information on Packaging Specifications.) 24 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-60,

Order this document SEMICONDUCTOR TECHNICAL DATA by MMBZ15VDLT1/D

! " Motorola Preferred Devices ! ! SOT–23

Transient Voltage Suppressors COMMON CATHODEDUAL ZENER

for ESD Protection OVERVOLTAGE TRANSIENT SUPPRESSORS These dual monolithic silicon zener diodes are designed for applications 40 WATTS requiring transient overvoltage protection capability. They are intended for use PEAK POWER in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common cathode design protects two separate lines using only one package. These devices are ideal for situations where board space is 3 at a premium. Specification Features: 1 • SOT–23 Package Allows Either Two Separate Unidirectional 2 Configurations or a Single Bidirectional Configuration CASE 318–08 • Peak Power — 40 Watts @ 1.0 ms (Bidirectional), per Figure 5 Waveform TO–236AB • Maximum Clamping Voltage @ Peak Pulse Current LOW PROFILE SOT–23 • Low Leakage < 100 nA • ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Mechanical Characteristics: 3 • Void Free, Transfer–Molded, Thermosetting Plastic Case 2 • Corrosion Resistant Finish, Easily Solderable TERMINAL 1 – ANODE • Package Designed for Optimal Automated Board Assembly TERMINAL 2 – ANODE • Small Package Size for High Density Applications TERMINAL 3 – CATHODE • Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Value Unit Peak Power Dissipation @ 1.0 ms (1) Ppk 40 Watts @ TA ≤ 25°C Total Power Dissipation on FR–5 Board (2) @ TA = 25°C °PD° 225 °mW° Derate above 25°C 1.8 mW/°C Thermal Resistance Junction to Ambient RθJA 556 °C/W Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C °PD° 300 °mW Derate above 25°C 2.4 mW/°C Thermal Resistance Junction to Ambient RθJA 417 °C/W Junction and Storage Temperature Range TJ °– 55 to +150° °C Tstg Lead Solder Temperature — Maximum (10 Second Duration) TL 230 °C 1. Non–repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 6. 2. FR–5 = 1.0 x 0.75 x 0.62 in. 3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev1MMMotBorZol1a,5 InVcD. 1L9T961 MMBZ27VCLT1 MOTOROLA, ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3) (VF = 0.9 V Max @ IF = 10 mA) Breakdown Voltage Max Reverse Maximum Reverse Voltage Max Reverse Max Reverse Voltage @ I (5) Temperature VBR(4) Working Peak Leakage Current Surge Current

RSM

(V) @ IT (Clamping Voltage) Coefficient of VRWM IRWM IRSM(5) (mA) V V(V) IR (nA) (A) RSM BR Min Nom Max (V) (mV/°C) 14.3 15 15.8 1.0 12.8 100 1.9 21.2 12 (VF = 1.1 V Max @ IF = 200 mA) Breakdown Voltage Max Reverse Maximum Reverse Voltage Max Reverse Max Reverse VBR(4) Voltage @ I (5) Temperature Working Peak Leakage Current Surge Current RSM (V) @ IT (Clamping Voltage) Coefficient ofVRWM IRWM IRSM(5) (mA) V V(V) I (nA) (A) RSM BR Min Nom Max R (V) (mV/°C) 25.65 27 28.35 1.0 22 50 1.0 38 26 (4) VBR measured at pulse test current IT at an ambient temperature of 25°C. (5) Surge current waveform per Figure 5 and derate per Figure 6.

TYPICAL CHARACTERISTICS

MMBZ15VDLT1 MMBZ27VCLT1 17 29

BIDIRECTIONAL BIDIRECTIONAL

16 28 15 27 14 26

UNIDIRECTIONAL

13 25 – 40 + 25 + 85 + 125 – 55 + 25 + 85 + 125 TEMPERATURE (°C) TEMPERATURE (°C) Figure 1A. Typical Breakdown Voltage Figure 1B. Typical Breakdown Voltage versus Temperature versus Temperature MOTOROLA MMBZ15VDLT1 MMBZ27VCLT1 BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T) BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T),

MMBZ15VDLT1

10000 100 100 80

UNIDIRECTIONAL

10 60 1 40

BIDIRECTIONAL

0.1 20 0.01 0 – 40 + 25 + 85 + 125 1 12.8 TEMPERATURE (°C) BIAS (V)

Figure 2. Typical Leakage Current Figure 3. Typical Capacitance versus

versus Temperature Bias Voltage PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE 250 tr PEAK CURRENT DECAYS TO ALUMINA SUBSTRATE 100 PEAK VALUE — IRSM 50% OF IRSM. 200 tr ≤ 10 µs 150 IRSMHALF VALUE — 100 50 FR–5 BOARD 50 tP00025 50 75 100 125 150 17501234TEMPERATURE (°C) t, TIME (ms)

Figure 4. Steady State Power Derating Curve Figure 5. Pulse Waveform

0 25 50 75 100 125 150 175 200 TA, AMBIENT TEMPERATURE (°C)

Figure 6. Pulse Derating Curve MMBZ15VDLT1 MMBZ27VCLT1 MOTOROLA

PD , POWER DISSIPATION (mW) IR (nA) PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25°C VALUE (%) C, CAPACITANCE (pF),

INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total interface between the board and the package. With the design. The footprint for the semiconductor packages must correct pad geometry, the packages will self align when be the correct size to insure proper solder connection subjected to a solder reflow process. 0.037 0.037 0.95 0.95 0.079 2.0 0.035 0.9 0.031 inches 0.8 mm SOT–23 SOT–23 POWER DISSIPATION The power dissipation of the SOT–23 is a function of the SOLDERING PRECAUTIONS drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. The melting temperature of solder is higher than the rated Power dissipation for a surface mount device is determined temperature of the device. When the entire device is heated by TJ(max), the maximum rated junction temperature of the to a high temperature, failure to complete soldering within a die, RθJA, the thermal resistance from the device junction to short time could result in device failure. Therefore, the ambient, and the operating temperature, TA. Using the following items should always be observed in order to values provided on the data sheet for the SOT–23 package, minimize the thermal stress to which the devices are PD can be calculated as follows: subjected. • Always preheat the device. TJ(max) – TA P = • The delta temperature between the preheat and solderingD RθJA should be 100°C or less.* The values for the equation are found in the maximum • When preheating and soldering, the temperature of the ratings table on the data sheet. Substituting these values into leads and the case must not exceed the maximum the equation for an ambient temperature T of 25°C, one can temperature ratings as shown on the data sheet. WhenA calculate the power dissipation of the device which in this using infrared heating with the reflow soldering method, case is 225 milliwatts. the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed PD = 150°C – 25°C = 225 milliwatts 260°C for more than 10 seconds. 556°C/W • When shifting from preheating to soldering, the maximum The 556°C/W for the SOT–23 package assumes the use temperature gradient shall be 5°C or less. of the recommended footprint on a glass epoxy printed circuit • After soldering has been completed, the device should be board to achieve a power dissipation of 225 milliwatts. There allowed to cool naturally for at least three minutes. are other alternatives to achieving higher power dissipation Gradual cooling should be used as the use of forced from the SOT–23 package. Another alternative would be to cooling will increase the temperature gradient and result use a ceramic substrate or an aluminum core board such as in latent failure due to mechanical stress. Thermal Clad. Using a board material such as Thermal • Mechanical stress or shock should not be applied during Clad, an aluminum core board, the power dissipation can be cooling. doubled using the same footprint. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. MOTOROLA MMBZ15VDLT1 MMBZ27VCLT1,

OUTLINE DIMENSIONS

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.

A 3. MAXIUMUM LEAD THICKNESS INCLUDES L LEAD FINISH THICKNESS. MINIMUM LEADTHICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL. 3 INCHES MILLIMETERS

B S DIM MIN MAX MIN MAX

12A0.1102 0.1197 2.80 3.04 B 0.0472 0.0551 1.20 1.40 C 0.0350 0.0440 0.89 1.11

VGD0.0150 0.0200 0.37 0.50

G 0.0701 0.0807 1.78 2.04 H 0.0005 0.0040 0.013 0.100 J 0.0034 0.0070 0.085 0.177

C K 0.0140 0.0285 0.35 0.69

L 0.0350 0.0401 0.89 1.02

HJS0.0830 0.1039 2.10 2.64DKV0.0177 0.0236 0.45 0.60

STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE

CASE 318–08 ISSUE AE TO–236AB MMBZ15VDLT1 MMBZ27VCLT1 MOTOROLA

, Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA / EUROPE: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: email is hidden – TOUCHTONE (602) 244–6609 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MMBZ15VDLT1/D

MOTOROLA MMBZ1 5VDLT1 M MBZ27VCLT166

,

Transient Voltage Suppressors — Surface Mounted

40 Watt Peak Power NOTES: INCHES MILLIMETERS 1. DIMENSIONING AND TOLERANCING PER DIM MIN MAX MIN MAX ANSI Y14.5M, 1982. A 0.1102 0.1197 2.80 3.04 2. CONTROLLING DIMENSION: INCH. B 0.0472 0.0551 1.20 1.40 3. MAXIMUM LEAD THICKNESS INCLUDES C 0.0350 0.0440 0.89 1.11 LEAD FINISH THICKNESS. MINIMUM LEAD D 0.0150 0.0200 0.37 0.50 THICKNESS IS THE MINIMUM THICKNESS G 0.0701 0.0807 1.78 2.04 OF BASE MATERIAL. H 0.0005 0.0040 0.013 0.100 0.037 J 0.0034 0.0070 0.085 0.177 0.037 0.95 K 0.0180 0.0236 0.45 0.60 L 0.0350 0.0401 0.89 1.02 0.95 S 0.0830 0.0984 2.10 2.50

A V 0.0177 0.0236 0.45 0.60 L

STYLE 9: PIN 1. ANODE 0.079 2. ANODE 2.0 3 3. CATHODE

B S

1 2 0.035 0.9

V G 0.031 inches

0.8 mm

C SOT-23 Footprint DHKJ CASE 318-07 PLASTIC

(Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)

MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type No. Suffix MPQ (Units) Tape and Reel T1 3K Tape and Reel T3 10K

(Refer to Section 10 for more information on Packaging Specifications.)

Motorola TVS/Zener Device Data 24 Watt Peak Power Data Sheet

5-67,

MOTOROLA SEMICONDUCTOR TECHNICAL DATA GENERAL GENERAL DATA APPLICABLE TO ALL SERIES IN DATA THIS GROUP 600 WATT Zener Transient Voltage Suppressors PEAK POWER

The SMB series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low PLASTIC SURFACE MOUNT zener impedance and fast response time. The SMB series is supplied in Motorola’s ZENER OVERVOLTAGE exclusive, cost-effective, highly reliable Surmetic package and is ideally suited for use in TRANSIENT communication systems, numerical controls, process controls, medical equipment, SUPPRESSORS business machines, power supplies and many other industrial/consumer applications. 6.8–200 VOLTS Specification Features: 600 WATT PEAK POWER • Standard Zener Breakdown Voltage Range — 6.8 to 200 V • Stand-off Voltage Range — 5 to 170 V • Peak Power — 600 Watts @ 1 ms • Maximum Clamp Voltage @ Peak Pulse Current • Low Leakage < 5 µA Above 10 V • UL Recognition • Response Time Typically < 1 ns Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic CASE 403A FINISH: All external surfaces are corrosion resistant and leads are readily solderable PLASTIC POLARITY: Cathode indicated by molded polarity notch. When operated in zener mode, will be positive with respect to anode MOUNTING POSITION: Any LEADS: Modified L-Bend providing more contact area to bond pad MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation (1) PPK 600 Watts @ TL ≤ 25°C Forward Surge Current (2) IFSM 100 Amps @ TA = 25°C Thermal Resistance from Junction to Lead (typical) RJL 25 °C/W Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C NOTES: 1. Nonrepetitive current pulse per Figure 2 and derated above TA = 25°C per Figure 3. NOTES: 2. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. REV 1 600 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-68,

GENERAL DATA — 600 WATT PEAK POWER

PULSE WIDTH (t NONREPETITIVE P ) IS DEFINED t AS THAT POINT WHERE THE PEAKPULSE WAVEFORM r CURRENT DECAYS TO 50% SHOWN IN FIGURE 2 OF IRSM.100 10 PEAK VALUE – IRSM tr ≤ 10 µs HALF VALUE – IRSM 1 50 tP 0.1 0.1 µs 1 µs 10µµ0s 100s1ms 10 ms01234tP, PULSE WIDTH t, TIME (ms) Figure 1. Pulse Rating Figure 2. Pulse Waveform Curve 160 TYPICAL PROTECTION CIRCUIT

Z

120 in 80 Vin LOAD VL 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Figure 3. Pulse Derating Curve

APPLICATION NOTES

RESPONSE TIME the suppressor device as close as possible to the equipment In most applications, the transient suppressor device is or components to be protected will minimize this overshoot. placed in parallel with the equipment or component to be Some input impedance represented by Zin is essential to protected. In this situation, there is a time delay associated prevent overstress of the protection device. This impedance with the capacitance of the device and an overshoot condition should be as high as possible, without restricting the circuit associated with the inductance of the device and the operation. inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because DUTY CYCLE DERATING it only produces a time delay in the transition from the The data of Figure 1 applies for non-repetitive conditions operating voltage to the clamp voltage as shown in Figure 4. and at a lead temperature of 25°C. If the duty cycle increases, The inductive effects in the device are due to actual turn-on the peak power must be reduced as indicated by the curves of time (time required for the device to go from zero current to full Figure 6. Average power must be derated as the lead or current) and lead inductance. This inductive effect produces ambient temperature rises above 25°C. The average power an overshoot in the voltage across the equipment or derating curve normally given on data sheets may be component being protected as shown in Figure 5. Minimizing normalized and used for this purpose. this overshoot is very important in the application, since the At first glance the derating curves of Figure 6 appear to be in main purpose for adding a transient suppressor is to clamp error as the 10 ms pulse has a higher derating factor than the voltage spikes. The SMB series have a very good response 10 µs pulse. However, when the derating factor for a given time, typically < 1 ns and negligible inductance. However, pulse of Figure 6 is multiplied by the peak power value of external inductive effects could produce unacceptable over- Figure 1 for the same pulse, the results follow the expected shoot. Proper circuit layout, minimum lead lengths and placing trend. Motorola TVS/Zener Device Data 600 Watt Peak Power Data Sheet 5-69 PEAK PULSE DERATING IN % OF PP , PEAK POWER (kW) PEAK POWER OR CURRENT @ TA = 25°C VALUE (%),

GENERAL DATA — 600 WATT PEAK POWER

Vin (TRANSIENT) OVERSHOOT DUE TO V Vin (TRANSIENT) V INDUCTIVE EFFECTS

VL VL

Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECTttFigure 4. Figure 5. 0.7 0.5 0.3 0.2 PULSE WIDTH 10 ms 0.1 0.07 0.05 1 ms 0.03 0.02 100 µs 10 µs 0.01 0.1 0.2 0.512510 20 50 100 D, DUTY CYCLE (%) Figure 6. Typical Derating Factor for Duty Cycle

UL RECOGNITION

The entire series has Underwriters Laboratory Recognition Breakdown test, Endurance Conditioning, Temperature test, for the classification of protectors (QVGV2) under the UL Dielectric Voltage-Withstand test, Discharge test and several standard for safety 497B and File #116110. Many competitors more. only have one or two devices recognized or have recognition Whereas, some competitors have only passed a flammabil- in a non-protective category. Some competitors have no ity test for the package material, we have been recognized for recognition at all. With the UL497B recognition, our parts much more to be included in their Protector category. successfully passed several tests including Strike Voltage 600 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-70 DERATING FACTOR, 1SMB5.0AT3 through 1SMB170AT3

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted).

Breakdown Voltage* Peak Maximum Reverse Maximum Pulse CurrentV @ I Reverse Leakage Stand-Off Voltage BR T Clamping Voltage (See Figure 2) @ VR VR Volts VC @ Ipp Ipp IR Device Device Volts (1) Min mA Volts Amps µA Marking 1SMB5.0AT3 5.0 6.40 10 9.2 65.2 800 KE 1SMB6.0AT3 6.0 6.67 10 10.3 58.3 800 KG 1SMB6.5AT3 6.5 7.22 10 11.2 53.6 500 KK 1SMB7.0AT3 7.0 7.78 10 12.0 50.0 200 KM 1SMB7.5AT3 7.5 8.33 1.0 12.9 46.5 100 KP 1SMB8.0AT3 8.0 8.89 1.0 13.6 44.1 50 KR 1SMB8.5AT3 8.5 9.44 1.0 14.4 41.7 10 KT 1SMB9.0AT3 9.0 10.0 1.0 15.4 39.0 5.0 KV 1SMB10AT3 10 11.1 1.0 17.0 35.3 5.0 KX 1SMB11AT3 11 12.2 1.0 18.2 33.0 5.0 KZ 1SMB12AT3 12 13.3 1.0 19.9 30.2 5.0 LE 1SMB13AT3 13 14.4 1.0 21.5 27.9 5.0 LG 1SMB14AT3 14 15.6 1.0 23.2 25.8 5.0 LK 1SMB15AT3 15 16.7 1.0 24.4 24.0 5.0 LM 1SMB16AT3 16 17.8 1.0 26.0 23.1 5.0 LP 1SMB17AT3 17 18.9 1.0 27.6 21.7 5.0 LR 1SMB18AT3 18 20.0 1.0 29.2 20.5 5.0 LT 1SMB20AT3 20 22.2 1.0 32.4 18.5 5.0 LV 1SMB22AT3 22 24.4 1.0 35.5 16.9 5.0 LX 1SMB24AT3 24 26.7 1.0 38.9 15.4 5.0 LZ 1SMB26AT3 26 28.9 1.0 42.1 14.2 5.0 ME 1SMB28AT3 28 31.1 1.0 45.4 13.2 5.0 MG 1SMB30AT3 30 33.3 1.0 48.4 12.4 5.0 MK 1SMB33AT3 33 36.7 1.0 53.3 11.3 5.0 MM 1SMB36AT3 36 40.0 1.0 58.1 10.3 5.0 MP 1SMB40AT3 40 44.4 1.0 64.5 9.3 5.0 MR 1SMB43AT3 43 47.8 1.0 69.4 8.6 5.0 MT 1SMB45AT3 45 50.0 1.0 72.7 8.3 5.0 MV 1SMB48AT3 48 53.3 1.0 77.4 7.7 5.0 MX 1SMB51AT3 51 56.7 1.0 82.4 7.3 5.0 MZ 1SMB54AT3 54 60.0 1.0 87.1 6.9 5.0 NE 1SMB58AT3 58 64.4 1.0 93.6 6.4 5.0 NG 1SMB60AT3 60 66.7 1.0 96.8 6.2 5.0 NK 1SMB64AT3 64 71.1 1.0 103 5.8 5.0 NM 1SMB70AT3 70 77.8 1.0 113 5.3 5.0 NP 1SMB75AT3 75 83.3 1.0 121 4.9 5.0 NR 1SMB78AT3 78 86.7 1.0 126 4.7 5.0 NT 1SMB85AT3 85 94.4 1.0 137 4.4 5.0 NV 1SMB90AT3 90 100 1.0 146 4.1 5.0 NX 1SMB100AT3 100 111 1.0 162 3.7 5.0 NZ 1SMB110AT3 110 122 1.0 177 3.4 5.0 PE 1SMB120AT3 120 133 1.0 193 3.1 5.0 PG 1SMB130AT3 130 144 1.0 209 2.9 5.0 PK 1SMB150AT3 150 167 1.0 243 2.5 5.0 PM 1SMB160AT3 160 178 1.0 259 2.3 5.0 PP 1SMB170AT3 170 189 1.0 275 2.2 5.0 PR Note 1: A transient suppressor is normally selected according to the reverse ”Stand Off Voltage” (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 600 Watt at the beginning of this group. T3 suffix designates tape and reel of 2500 units. ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a subjected to the peak pusle current in a one millisecond non-conductive condition (See Note 1). time interval. The peak pulse voltages are the combina- V(BR)min This is the minimum breakdown voltage the device will tion of voltage rise due to both the series resistance and exhibit and is used to assure that conduction does not thermal rise. occur prior to this voltage level at 25°C. IPP Peak Pulse Current — See Figure 2 VC Maximum Clamping Voltage. The maximum peak volt- PP Peak Pulse Power age appearing across the transient suppressor when IR Reverse Leakage Devices listed in bold, italic are Motorola preferred devices.

Motorola TVS/Zener Device Data 600 Watt Peak Power Data Sheet

5-71,

P6SMB6.8AT3 through P6SMB200AT3 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted).

Breakdown Voltage* Peak Maximum Reverse Maximum Pulse CurrentVBR @ I Reverse Leakage Stand-Off Voltage T Clamping Voltage (See Figure 2) @ VR VR Volts VC @ Ipp Ipp IR Device Device Volts (1) Min mA Volts Amps µA Marking 1SMB10CAT3 10 11.1 1.0 17.0 35.3 5.0 KXC 1SMB11CAT3 11 12.2 1.0 18.2 33.0 5.0 KZC 1SMB12CAT3 12 13.3 1.0 19.9 30.2 5.0 LEC 1SMB13CAT3 13 14.4 1.0 21.5 27.9 5.0 LGC 1SMB14CAT3 14 15.6 1.0 23.2 25.8 5.0 LKC 1SMB15CAT3 15 16.7 1.0 24.4 24.0 5.0 LMC 1SMB16CAT3 16 17.8 1.0 26.0 23.1 5.0 LPC 1SMB17CAT3 17 18.9 1.0 27.6 21.7 5.0 LRC 1SMB18CAT3 18 20.0 1.0 29.2 20.5 5.0 LTC 1SMB20CAT3 20 22.2 1.0 32.4 18.5 5.0 LVC 1SMB22CAT3 22 24.4 1.0 35.5 16.9 5.0 LXC 1SMB24CAT3 24 26.7 1.0 38.9 15.4 5.0 LZC 1SMB26CAT3 26 28.9 1.0 42.1 14.2 5.0 MEC 1SMB28CAT3 28 31.1 1.0 45.4 13.2 5.0 MGC 1SMB30CAT3 30 33.3 1.0 48.4 12.4 5.0 MKC 1SMB33CAT3 33 36.7 1.0 53.3 11.3 5.0 MMC 1SMB36CAT3 36 40.0 1.0 58.1 10.3 5.0 MPC 1SMB40CAT3 40 44.4 1.0 64.5 9.3 5.0 MRC 1SMB43CAT3 43 47.8 1.0 69.4 8.6 5.0 MTC 1SMB45CAT3 45 50.0 1.0 72.7 8.3 5.0 MVC 1SMB48CAT3 48 53.3 1.0 77.4 7.7 5.0 MXC 1SMB51CAT3 51 56.7 1.0 82.4 7.3 5.0 MZC 1SMB54CAT3 54 60.0 1.0 87.1 6.9 5.0 NEC 1SMB58CAT3 58 64.4 1.0 93.6 6.4 5.0 NGC 1SMB60CAT3 60 66.7 1.0 96.8 6.2 5.0 NKC 1SMB64CAT3 64 71.1 1.0 103 5.8 5.0 NMC 1SMB70CAT3 70 77.8 1.0 113 5.3 5.0 NPC 1SMB75CAT3 75 83.3 1.0 121 4.9 5.0 NRC 1SMB78CAT3 78 86.7 1.0 126 4.7 5.0 NTC Note 1: A transient suppressor is normally selected according to the reverse ”Stand Off Voltage” (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 600 Watt at the beginning of this group. T3 suffix designates tape and reel of 2500 units. ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a subjected to the peak pusle current in a one millisecond non-conductive condition (See Note 1). time interval. The peak pulse voltages are the combina- V(BR)min This is the minimum breakdown voltage the device will tion of voltage rise due to both the series resistance and exhibit and is used to assure that conduction does not thermal rise. occur prior to this voltage level at 25°C. IPP Peak Pulse Current — See Figure 2 VC Maximum Clamping Voltage. The maximum peak volt- PP Peak Pulse Power age appearing across the transient suppressor when IR Reverse Leakage Devices listed in bold, italic are Motorola preferred devices. 600 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-72, 1SMB10CAT3 through 1SMB78CAT3

Bi–Directional

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VF = 3.5 V Max, IF** = 50 A for all types. Working Maximum Maximum Maximum Breakdown Voltage* Peak Reverse Reverse Reverse Voltage Maximum VBR @ I Reverse Leakage Surge @ I Temperature T RSM Volts Voltage @ VRWM Current (Clamping Voltage) Coefficient VRWM IR IRSM VRSM of VBR Device Device Min Nom Max mA Volts µA Amps Volts %/°C Marking P6SMB6.8AT3 6.45 6.8 7.14 10 5.8 1000 57 10.5 0.057 6V8A P6SMB7.5AT3 7.13 7.5 7.88 10 6.4 500 53 11.3 0.061 7V5A P6SMB8.2AT3 7.79 8.2 8.61 10 7.02 200 50 12.1 0.065 8V2A P6SMB9.1AT3 8.65 9.1 9.55 1 7.78 50 45 13.4 0.068 9V1A P6SMB10AT3 9.5 10 10.5 1 8.55 10 41 14.5 0.073 10A P6SMB11AT3 10.5 11 11.6 1 9.4 5 38 15.6 0.075 11A P6SMB12AT3 11.4 12 12.6 1 10.2 5 36 16.7 0.078 12A P6SMB13AT3 12.4 13 13.7 1 11.1 5 33 18.2 0.081 13A P6SMB15AT3 14.3 15 15.8 1 12.8 5 28 21.2 0.084 15A P6SMB16AT3 15.2 16 16.8 1 13.6 5 27 22.5 0.086 16A P6SMB18AT3 17.1 18 18.9 1 15.3 5 24 25.2 0.088 18A P6SMB20AT3 19 20 21 1 17.1 5 22 27.7 0.09 20A P6SMB22AT3 20.9 22 23.1 1 18.8 5 20 30.6 0.092 22A P6SMB24AT3 22.8 24 25.2 1 20.5 5 18 33.2 0.094 24A P6SMB27AT3 25.7 27 28.4 1 23.1 5 16 37.5 0.096 27A P6SMB30AT3 28.5 30 31.5 1 25.6 5 14.4 41.4 0.097 30A P6SMB33AT3 31.4 33 34.7 1 28.2 5 13.2 45.7 0.098 33A P6SMB36AT3 34.2 36 37.8 1 30.8 5 12 49.9 0.099 36A P6SMB39AT3 37.1 39 41 1 33.3 5 11.2 53.9 0.1 39A P6SMB43AT3 40.9 43 45.2 1 36.8 5 10.1 59.3 0.101 43A P6SMB47AT3 44.7 47 49.4 1 40.2 5 9.3 64.8 0.101 47A P6SMB51AT3 48.5 51 53.6 1 43.6 5 8.6 70.1 0.102 51A P6SMB56AT3 53.2 56 58.8 1 47.8 5 7.8 77 0.103 56A P6SMB62AT3 58.9 62 65.1 1 53 5 7.1 85 0.104 62A P6SMB68AT3 64.6 68 71.4 1 58.1 5 6.5 92 0.104 68A P6SMB75AT3 71.3 75 78.8 1 64.1 5 5.8 103 0.105 75A P6SMB82AT3 77.9 82 86.1 1 70.1 5 5.3 113 0.105 82A P6SMB91AT3 86.5 91 95.5 1 77.8 5 4.8 125 0.106 91A P6SMB100AT3 95 100 105 1 85.5 5 4.4 137 0.106 100A P6SMB110AT3 105 110 116 1 9454152 0.107 110A P6SMB120AT3 114 120 126 1 102 5 3.6 165 0.107 120A P6SMB130AT3 124 130 137 1 111 5 3.3 179 0.107 130A P6SMB150AT3 143 150 158 1 128 5 2.9 207 0.108 150A P6SMB160AT3 152 160 168 1 136 5 2.7 219 0.108 160A P6SMB170AT3 162 170 179 1 145 5 2.6 234 0.108 170A P6SMB180AT3 171 180 189 1 154 5 2.4 246 0.108 180A P6SMB200AT3 190 200 210 1 171 5 2.2 274 0.108 200A * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 600 Watt at the beginning of this group. T3 suffix designates tape and reel of 2500 units. Devices listed in bold, italic are Motorola preferred devices. Motorola TVS/Zener Device Data 600 Watt Peak Power Data Sheet 5-73,

P6SMB11CAT3 through P6SMB91CAT3 Bi–Directional ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VF = 3.5 V Max, IF** = 50 A for all types.

Maximum Breakdown Voltage* Working Maximum Maximum Reverse Voltage Peak Reverse Reverse @ IRSM Maximum VBR @ IT Reverse Leakage Surge (Clamping Temperature Volts Voltage @ VRWM Current Voltage) Coefficient VRWM IR IRSM VRSM of V Min Nom Max mA BR Device Device Volts µA Amps Volts %/°C Marking P6SMB11CAT3 10.5 11 11.6 1 9.4 5 38 15.6 0.075 11C P6SMB12CAT3 11.4 12 12.6 1 10.2 5 36 16.7 0.078 12C P6SMB13CAT3 12.4 13 13.7 1 11.1 5 33 18.2 0.081 13C P6SMB15CAT3 14.3 15 15.8 1 12.8 5 28 21.2 0.084 15C P6SMB16CAT3 15.2 16 16.8 1 13.6 5 27 22.5 0.086 16C P6SMB18CAT3 17.1 18 18.9 1 15.3 5 24 25.2 0.088 18C P6SMB20CAT3 19 20 21 1 17.1 5 22 27.7 0.09 20C P6SMB22CAT3 20.9 22 23.1 1 18.8 5 20 30.6 0.092 22C P6SMB24CAT3 22.8 24 25.2 1 20.5 5 18 33.2 0.094 24C P6SMB27CAT3 25.7 27 28.4 1 23.1 5 16 37.5 0.096 27C P6SMB30CAT3 28.5 30 31.5 1 25.6 5 14.4 41.4 0.097 30C P6SMB33CAT3 31.4 33 34.7 1 28.2 5 13.2 45.7 0.098 33C P6SMB36CAT3 34.2 36 37.8 1 30.8 5 12 49.9 0.099 36C P6SMB39CAT3 37.1 39 41 1 33.3 5 11.2 53.9 0.1 39C P6SMB43CAT3 40.9 43 45.2 1 36.8 5 10.1 59.3 0.101 43C P6SMB47CAT3 44.7 47 49.4 1 40.2 5 9.3 64.8 0.101 47C P6SMB51CAT3 48.5 51 53.6 1 43.6 5 8.6 70.1 0.102 51C P6SMB56CAT3 53.2 56 58.8 1 47.8 5 7.8 77 0.103 56C P6SMB62CAT3 58.9 62 65.1 1 53 5 7.1 85 0.104 62C P6SMB68CAT3 64.6 68 71.4 1 58.1 5 6.5 92 0.104 68C P6SMB75CAT3 71.3 75 78.8 1 64.1 5 5.8 103 0.105 75C P6SMB82CAT3 77.9 82 86.1 1 70.1 5 5.3 113 0.105 82C P6SMB91CAT3 86.5 91 95.5 1 77.8 5 4.8 125 0.106 91C * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 600 Watt at the beginning of this group. T3 suffix designates tape and reel of 2500 units. 600 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-74,

Transient Voltage Suppressors — Surface Mounted

600 Watt Peak Power 0.089 2.261

S

A 0.108 2.743DB0.085 inches 2.159 mm

SMB Footprint

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI C Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

H

KPJINCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.160 0.180 4.06 4.57 B 0.130 0.150 3.30 3.81 C 0.075 0.095 1.90 2.41 D 0.077 0.083 1.96 2.11 H 0.0020 0.0060 0.051 0.152 J 0.006 0.012 0.15 0.30 K 0.030 0.050 0.76 1.27 CASE 403A P 0.020 REF 0.51 REFS 0.205 0.220 5.21 5.59

PLASTIC

(Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)

MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS

Package Option Type No. Suffix MPQ (Units) Tape and Reel T3 (13 inch reel) 2.5K (Refer to Section 10 for more information on Packaging Specifications.) Devices listed in bold, italic are Motorola preferred devices.

Motorola TVS/Zener Device Data 600 Watt Peak Power Data Sheet

5-75,

MOTOROLA SEMICONDUCTOR TECHNICAL DATA GENERAL GENERAL DATA APPLICABLE TO ALL SERIES IN DATA THIS GROUP Zener Transient Voltage Suppressors 1500 WATTPEAK POWER

The SMC series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMC series is supplied in Motorola’s PLASTIC SURFACE MOUNT exclusive, cost-effective, highly reliable Surmetic package and is ideally suited for use in ZENER OVERVOLTAGE communication systems, numerical controls, process controls, medical equipment, TRANSIENT business machines, power supplies and many other industrial/consumer applications. SUPPRESSORS 6.8–91 VOLTS Specification Features: 1500 WATT PEAK POWER • Standard Zener Breakdown Voltage Range — 6.8 to 91 V • Stand-off Voltage Range — 5 to 78 V • Peak Power — 1500 Watts @ 1 ms • Maximum Clamp Voltage @ Peak Pulse Current • Low Leakage < 5 µA Above 10 V • UL Recognition • Maximum Temperature Coefficient Specified • Available in Tape and Reel • Response Time Typically < 1 ns Mechanical Characteristics: CASE 403

PLASTIC

CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable POLARITY: Cathode indicated by molded polarity notch. When operated in zener mode, will be positive with respect to anode MOUNTING POSITION: Any LEADS: Modified L-Bend providing more contact area to bond pads MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation (1) PPK 1500 Watts @ TL ≤ 25°C Forward Surge Current (2) IFSM 200 Amps @ TA = 25°C Thermal Resistance from Junction to Lead (typical) RJL 15 °C/W Operating and Storage Temperature Range TJ, Tstg – 65 to +150 °C NOTES: 1. Nonrepetitive current pulse per Figure 2 and derated above TA = 25°C per Figure 3. NOTES: 2. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. REV 1 1500 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-76,

GENERAL DATA — 1500 WATT PEAK POWER

NONREPETITIVE PULSE WIDTH (tP) IS DEFINED PULSE WAVEFORM t AS THAT POINT WHERE THE PEAKr SHOWN IN FIGURE 2 CURRENT DECAYS TO 50% OF IRSM. PEAK VALUE – IRSM tr ≤ 10 µs HALF VALUE – IRSM 50 2 tP 0.1 µs 1 µs 10 µs 100 µs 1 ms 10 ms001234tP, PULSE WIDTH t, TIME (ms) Figure 1. Pulse Rating Curve Figure 2. Pulse Waveform 140 TL = 25°C VZ (NOM) = 6.8 TO 13 V 500 tP = 10 µs 20 V 120 24 V 43 V 200 75 V 100 100 120 V 80 50 180 V 60 2001025 50 75 100 125 150 0.3 0.5 0.71235710 20 30 TA, AMBIENT TEMPERATURE (°C) ∆VZ, INSTANTANEOUS INCREASE IN VZ ABOVE VZ (NOM) (VOLTS) Figure 3. Pulse Derating Curve Figure 4. Dynamic Impedance

UL RECOGNITION

The entire series has Underwriters Laboratory Recognition Breakdown test, Endurance Conditioning, Temperature test, for the classification of protectors (QVGV2) under the UL Dielectric Voltage-Withstand test, Discharge test and several standard for safety 497B and File #116110. Many competitors more. only have one or two devices recognized or have recognition Whereas, some competitors have only passed a flammabil- in a non-protective category. Some competitors have no ity test for the package material, we have been recognized for recognition at all. With the UL497B recognition, our parts much more to be included in their Protector category. successfully passed several tests including Strike Voltage Motorola TVS/Zener Device Data 1500 Watt Peak Power Data Sheet 5-77 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25°C PP , PEAK POWER (kW) I Z , ZENER CURRENT (AMPS) VALUE (%),

GENERAL DATA — 1500 WATT PEAK POWER

APPLICATION NOTES RESPONSE TIME suppressor device as close as possible to the equipment or In most applications, the transient suppressor device is components to be protected will minimize this overshoot. placed in parallel with the equipment or component to be pro- Some input impedance represented by Zin is essential to tected. In this situation, there is a time delay associated with prevent overstress of the protection device. This impedance the capacitance of the device and an overshoot condition should be as high as possible, without restricting the circuit associated with the inductance of the device and the induc- operation. tance of the connection method. The capacitive effect is of mi- nor importance in the parallel protection scheme because it DUTY CYCLE DERATING only produces a time delay in the transition from the operating The data of Figure 1 applies for non-repetitive conditions voltage to the clamp voltage as shown in Figure 5. and at a lead temperature of 25°C. If the duty cycle increases, The inductive effects in the device are due to actual turn-on the peak power must be reduced as indicated by the curves of time (time required for the device to go from zero current to full Figure 7. Average power must be derated as the lead or ambi- current) and lead inductance. This inductive effect produces ent temperature rises above 25°C. The average power derat- an overshoot in the voltage across the equipment or compo- ing curve normally given on data sheets may be normalized nent being protected as shown in Figure 6. Minimizing this and used for this purpose. overshoot is very important in the application, since the main At first glance the derating curves of Figure 7 appear to be in purpose for adding a transient suppressor is to clamp voltage error as the 10 ms pulse has a higher derating factor than the spikes. The SMC series have a very good response time, typi- 10 µs pulse. However, when the derating factor for a given cally < 1 ns and negligible inductance. However, external pulse of Figure 7 is multiplied by the peak power value of Fig- inductive effects could produce unacceptable overshoot. ure 1 for the same pulse, the results follow the expected trend. Proper circuit layout, minimum lead lengths and placing the TYPICAL PROTECTION CIRCUIT Zin

LOAD

V Vin L Vin (TRANSIENT) Vin (TRANSIENT) V V OVERSHOOT DUE TO INDUCTIVE EFFECTS VL VL Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECTttFigure 5. Figure 6. 0.7 0.5 0.3 0.2 PULSE WIDTH 10 ms 0.1 0.07 0.05 1 ms 0.03 0.02 100 µs 10 µs 0.01 0.1 0.2 0.512510 20 50 100 D, DUTY CYCLE (%) Figure 7. Typical Derating Factor for Duty Cycle 1500 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-78 DERATING FACTOR, 1SMC5.0AT3 through 1SMC78AT3

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted).

Breakdown Voltage* Peak Maximum Reverse Maximum Pulse CurrentV @ I Reverse Leakage Stand-Off Voltage BR T Clamping Voltage (See Figure 2) @ VR VR Volts VC @ Ipp Ipp IR Device Device Volts (1) Min mA Volts Amps µA Marking 1SMC5.0AT3 5.0 6.40 10 9.2 163.0 1000 GDE 1SMC6.0AT3 6.0 6.67 10 10.3 145.6 1000 GDG 1SMC6.5AT3 6.5 7.22 10 11.2 133.9 500 GDK 1SMC7.0AT3 7.0 7.78 10 12.0 125.0 200 GDM 1SMC7.5AT3 7.5 8.33 1.0 12.9 116.3 100 GDP 1SMC8.0AT3 8.0 8.89 1.0 13.6 110.3 50 GDR 1SMC8.5AT3 8.5 9.44 1.0 14.4 104.2 20 GDT 1SMC9.0AT3 9.0 10.0 1.0 15.4 97.4 10 GDV 1SMC10AT3 10 11.1 1.0 17.0 88.2 5.0 GDX 1SMC11AT3 11 12.2 1.0 18.2 82.4 5.0 GDZ 1SMC12AT3 12 13.3 1.0 19.9 75.3 5.0 GEE 1SMC13AT3 13 14.4 1.0 21.5 69.7 5.0 GEG 1SMC14AT3 14 15.6 1.0 23.2 64.7 5.0 GEK 1SMC15AT3 15 16.7 1.0 24.4 61.5 5.0 GEM 1SMC16AT3 16 17.8 1.0 26.0 57.7 5.0 GEP 1SMC17AT3 17 18.9 1.0 27.6 53.3 5.0 GER 1SMC18AT3 18 20.0 1.0 29.2 51.4 5.0 GET 1SMC20AT3 20 22.2 1.0 32.4 46.3 5.0 GEV 1SMC22AT3 22 24.4 1.0 35.5 42.2 5.0 GEX 1SMC24AT3 24 26.7 1.0 38.9 38.6 5.0 GEZ 1SMC26AT3 26 28.9 1.0 42.1 35.6 5.0 GFE 1SMC28AT3 28 31.1 1.0 45.4 33.0 5.0 GFG 1SMC30AT3 30 33.3 1.0 48.4 31.0 5.0 GFK 1SMC33AT3 33 36.7 1.0 53.3 28.1 5.0 GFM 1SMC36AT3 36 40.0 1.0 58.1 25.8 5.0 GFP 1SMC40AT3 40 44.4 1.0 64.5 23.2 5.0 GFR 1SMC43AT3 43 47.8 1.0 69.4 21.6 5.0 GFT 1SMC45AT3 45 50.0 1.0 72.7 20.6 5.0 GFV 1SMC48AT3 48 53.3 1.0 77.4 19.4 5.0 GFX 1SMC51AT3 51 56.7 1.0 82.4 18.2 5.0 GFZ 1SMC54AT3 54 60.0 1.0 87.1 17.2 5.0 GGE 1SMC58AT3 58 64.4 1.0 93.6 16.0 5.0 GGG 1SMC60AT3 60 66.7 1.0 96.8 15.5 5.0 GGK 1SMC64AT3 64 71.1 1.0 103 14.6 5.0 GGM 1SMC70AT3 70 77.8 1.0 113 13.3 5.0 GGP 1SMC75AT3 75 83.3 1.0 121 12.4 5.0 GGR 1SMC78AT3 78 86.7 1.0 126 11.4 5.0 GGT Note 1: A transient suppressor is normally selected according to the reverse ”Stand Off Voltage” (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data — 1500 Watt at the beginning of this group. T3 suffix designates tape and reel of 2500 units. ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a subjected to the peak pusle current in a one millisecond non-conductive condition (See Note 1). time interval. The peak pulse series resistance and V(BR)min This is the minimum breakdown voltage the device will thermal rise. exhibit and is used to assure that conduction does not IPP Peak Pulse Current — See Figure 2 occur prior to this voltage level at 25°C. PP Peak Pulse Power VC Maximum Clamping Voltage. The maximum peak volt- IR Reverse Leakage age appearing across the transient suppressor when Devices listed in bold, italic are Motorola preferred devices.

Motorola TVS/Zener Device Data 1500 Watt Peak Power Data Sheet

5-79, 1SMC6.8AT3 through 1.5SMC91AT3

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VF = 3.5 V Max, IF** = 100 A for all types.

Working Maximum Maximum Maximum Breakdown Voltage* Peak Reverse Reverse Reverse Voltage Maximum V @ I Reverse Leakage Surge @ IRSM TemperatureBR T Volts Voltage @ VRWM Current (Clamping Voltage) Coefficient VRWM IR IRSM VRSM of VBR Device Device Min Nom Max mA Volts µA Amps Volts %/°C Marking 1.5SMC6.8AT3 6.45 6.8 7.14 10 5.8 1000 143 10.5 0.057 6V8A 1.5SMC7.5AT3 7.13 7.5 7.88 10 6.4 500 132 11.3 0.061 7V5A 1.5SMC8.2AT3 7.79 8.2 8.61 10 7.02 200 124 12.1 0.065 8V2A 1.5SMC9.1AT3 8.65 9.1 9.55 1 7.78 50 112 13.4 0.068 9V1A 1.5SMC10AT3 9.5 10 10.5 1 8.55 10 103 14.5 0.073 10A 1.5SMC11AT3 10.5 11 11.6 1 9.4 5 96 15.6 0.075 11A 1.5SMC12AT3 11.4 12 12.6 1 10.2 5 90 16.7 0.078 12A 1.5SMC13AT3 12.4 13 13.7 1 11.1 5 82 18.2 0.081 13A 1.5SMC15AT3 14.3 15 15.8 1 12.8 5 71 21.2 0.084 15A 1.5SMC16AT3 15.2 16 16.8 1 13.6 5 67 22.5 0.086 16A 1.5SMC18AT3 17.1 18 18.9 1 15.3 5 59.5 25.2 0.088 18A 1.5SMC20AT3 19 20 21 1 17.1 5 54 27.7 0.09 20A 1.5SMC22AT3 20.9 22 23.1 1 18.8 5 49 30.6 0.092 22A 1.5SMC24AT3 22.8 24 25.2 1 20.5 5 45 33.2 0.094 24A 1.5SMC27AT3 25.7 27 28.4 1 23.1 5 40 37.5 0.096 27A 1.5SMC30AT3 28.5 30 31.5 1 25.6 5 36 41.4 0.097 30A 1.5SMC33AT3 31.4 33 34.7 1 28.2 5 33 45.7 0.098 33A 1.5SMC36AT3 34.2 36 37.8 1 30.8 5 30 49.9 0.099 36A 1.5SMC39AT3 37.1 39 41 1 33.3 5 28 53.9 0.1 39A 1.5SMC43AT3 40.9 43 45.2 1 36.8 5 25.3 59.3 0.101 43A 1.5SMC47AT3 44.7 47 49.4 1 40.2 5 23.2 64.8 0.101 47A 1.5SMC51AT3 48.5 51 53.6 1 43.6 5 21.4 70.1 0.102 51A 1.5SMC56AT3 53.2 56 58.8 1 47.8 5 19.5 77 0.103 56A 1.5SMC62AT3 58.9 62 65.1 1 53 5 17.7 85 0.104 62A 1.5SMC68AT3 64.6 68 71.4 1 58.1 5 16.3 92 0.104 68A 1.5SMC75AT3 71.3 75 78.8 1 64.1 5 14.6 103 0.105 75A 1.5SMC82AT3 77.9 82 86.1 1 70.1 5 13.3 113 0.105 82A 1.5SMC91AT3 86.5 91 95.5 1 77.8 5 12 125 0.106 91A * * VBR measured at pulse test current IT at an ambient temperaure of 25°C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. Surge current waveform per Figure 2 and derate per Figure 3 of General Data — 1500 Watt at the beginning of this group. T3 suffix designates tape and reel of 2500 units. Devices listed in bold, italic are Motorola preferred devices. 1500 Watt Peak Power Data Sheet Motorola TVS/Zener Device Data 5-80, 1.5SMC6.8AT3 through 1.5SMC91AT3

Transient Voltage Suppressors — Surface Mounted

1500 Watt Peak Power 0.171 4.343

S A

0.150 3.810DBinches 0.110 2.794 mm

SMC Footprint

C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. J 2. CONTROLLING DIMENSION: INCH.KPH3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.260 0.280 6.60 7.11 B 0.220 0.240 5.59 6.10 C 0.075 0.095 1.90 2.41 D 0.115 0.121 2.92 3.07 H 0.0020 0.0060 0.051 0.152 J 0.006 0.012 0.15 0.30 K 0.030 0.050 0.76 1.27 CASE 403 P 0.020 REF 0.51 REFS 0.305 0.320 7.75 8.13 (SMC) (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)

MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS

Package Option Type No. Suffix MPQ (Units) Tape and Reel T3 (13 inch reel) 2.5K (Refer to Section 10 for more information on Packaging Specifications.) Devices listed in bold, italic are Motorola preferred devices.

Motorola TVS/Zener Device Data 1500 Watt Peak Power Data Sheet

5-81]
15

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