Download: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Designer’s Data Sheet

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Designer’s Data Sheet $! $# ! " "# % Three complete series of Zener Diodes are offered in the convenient, surface mount plastic SOD-123 package. These devices provide a convenient alternative to the leadless 34 package style. *Motorola Preferred Device Series • 500 mW Rating on FR-4 or FR-5 Board • Package Designed for Optimal Automated Board Assembly • Corrosion Resistant Finish, Easily Solderable PLASTIC SURFACE • ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model MOUNT • Small Package Size for High Density Applications ZENER DIODES • A...
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MOTOROLA SEMICONDUCTOR TECHNICAL DATA Designer’s Data Sheet

$! $# ! " "# % Three complete series of Zener Diodes are offered in the convenient, surface mount plastic SOD-123 package. These devices provide a convenient alternative to the leadless 34 package style. *Motorola Preferred Device Series • 500 mW Rating on FR-4 or FR-5 Board • Package Designed for Optimal Automated Board Assembly • Corrosion Resistant Finish, Easily Solderable PLASTIC SURFACE • ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model MOUNT • Small Package Size for High Density Applications ZENER DIODES • Available in 8 mm Tape and Reel 500 MILLIWATTS Add “T1” to the device number to order the 7 inch/3000 unit reel. 1.8–91 VOLTS Add “T3” to the device number to order the 13 inch/10,000 unit reel. • Wafer Fab Location: Phoenix, Arizona Assembly/Test Location: Seremban, Malaysia12MMSZ5221BT1 thru MMSZ5270BT1 1: CATHODE • General Purpose, Medium Current 2: ANODE • Wide Voltage Range — 2.4 to 91 Volts MMSZ4678T1 thru MMSZ4717T1 • Low Operating Currents, Low Leakage, Sharp Breakdown Characteristics • Wide Voltage Range — 1.8 to 43 Volts MMSZ2V4T1 thru MMSZ75T1 • Specified Similar to European BZV55C Series • Wide Voltage Range — 2.4 to 75 Volts CASE 425, STYLE 1

PLASTIC

DEVICE RATING (TA = 25°C unless otherwise noted) Rating Symbol Value Unit Power Dissipation on FR-4 or FR-5 Board [1] PD 500 mW Derate above TL = 75°C — 6.7 mW/°C Thermal Resistance Junction to Lead [2] RθJL 150 Thermal Resistance Junction to Ambient [2] R 340 °C/WθJA Junction Temperature Range TJ –55 to +150 °C Storage Temperature Range Tstg –55 to +150 °C Lead Solder Temperature – Maximum (10 sec. duration) — 260 °C [1] FR-4 or FR-5 = 3.5 x 1.5 inches, using the Motorola minimum recommended footprint as shown in Figure 11. [2] Thermal Resistance measurement obtained via Infrared Scan Method Designer’s Data for “Worst Case’’ Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case’’ design. Designer’s is a trademark of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. 7-11,

TYPICAL CHARACTERISTICS

8 100 7 TYPICAL T TYPICAL T VALUESC VALUESC6FOR MMSZ5221BT1 SERIES FOR MMSZ5221BT1 SERIES 4 VZ @ IZT VZ @ IZT –1 – 2 – 312345678910 11 12 10 100 VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V)

Figure 1. Temperature Coefficients Figure 2. Temperature Coefficients

(Temperature Range –55°C to +150°C) (Temperature Range –55°C to +150°C) 1.2 1000 1.0 RECTANGULAR WAVEFORM, TA = 25°C 0.8 PD versus TL 100 0.6 PD versus TA 0.4 10 0.201025 50 75 100 125 150 0.1 1 10 100 1000 T, TEMPERATURE (°C) PW, PULSE WIDTH (ms)

Figure 3. Steady State Power Derating Figure 4. Maximum Nonrepetitive Surge Power

1000 1000 TJ = 25°C 75 V (MMSZ5267BT1) IZ(AC) = 0.1 IZ(DC) 91 V (MMSZ5270BT1) IZ = 1 mA f = 1 kHz 100 100 5 mA 20 mA 10 10 150°C 75°C 25°C 0°C11110 100 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 VZ, NOMINAL ZENER VOLTAGE VF, FORWARD VOLTAGE (V)

Figure 5. Effect of Zener Voltage on Figure 6. Typical Forward Voltage Zener Impedance

7-12 ZZT, DYNAMIC IMPEDANCE (Ω) PD, POWER DISSIPATION (WATTS) θVZ, TEMPERATURE COEFFICIENT (mV/°C) IF, FORWARD CURRENT (mA) Ppk, PEAK SURGE POWER (WATTS) θVZ, TEMPERATURE COEFFICIENT (mV/°C),

TYPICAL CHARACTERISTICS

1000 1000 TA = 25°C0VBIAS 1001VBIAS BIAS AT +150°C0.1 50% OF VZ NOM 0.01 0.001 + 25°C 0.0001 – 55°C 1 0.00001 1 10 100 0 10 20 30 40 50 60 70 80 90 VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V)

Figure 7. Typical Capacitance Figure 8. Typical Leakage Current

100 100 TA = 25°C TA = 25°C 10 10110.1 0.1 0.01 0.010246810 12 10 30 50 70 90 VZ, ZENER VOLTAGE (V) VZ, ZENER VOLTAGE (V)

Figure 9. Zener Voltage versus Zener Current Figure 10. Zener Voltage versus Zener Current

(VZ Up to 12 V) (12 V to 91 V) 7-13IZ, ZENER CURRENT (mA) C, CAPACITANCE (pF) I R , LEAKAGE CURRENT (µA)I Z , ZENER CURRENT (mA),

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted [1]), (VF = 0.9 V Max. @ IF = 10 mA for all types)

Zener Voltage V @ I Max ReverseZ ZT Volts Test Max Zener Leakage [1] [2] Current Impedance [3] Current Test IZT IR @ VR Voltage ZZT ZZK VR Type @ IZ = IZT @ IZK = 0.25 mA Number Marking Nom Min Max mAΩΩµA Volts MMSZ5221BT1 C1 2.4 2.28 2.52 20 30 1200 100 1 MMSZ5222BT1 C2 2.5 2.38 2.63 20 30 1250 100 1 MMSZ5223BT1 C3 2.7 2.57 2.84 20 30 1300 75 1 MMSZ5224BT1 C4 2.8 2.66 2.94 20 30 1400 75 1 MMSZ5225BT1 C5 3.0 2.85 3.15 20 30 1600 50 1 MMSZ5226BT1 D1 3.3 3.14 3.47 20 28 1600 25 1 MMSZ5227BT1 D2 3.6 3.42 3.78 20 24 1700 15 1 MMSZ5228BT1 D3 3.9 3.71 4.10 20 23 1900 10 1 MMSZ5229BT1 D4 4.3 4.09 4.52 20 22 200051MMSZ5230BT1 D5 4.7 4.47 4.94 20 19 190052MMSZ5231BT1 E1 5.1 4.85 5.36 20 17 160052MMSZ5232BT1 E2 5.6 5.32 5.88 20 11 160053MMSZ5233BT1 E3 6.0 5.70 6.30 20 7 1600 5 3.5 MMSZ5234BT1 E4 6.2 5.89 6.51 20 7 100054MMSZ5235BT1 E5 6.8 6.46 7.14 20 5 75035MMSZ5236BT1 F1 7.5 7.13 7.88 20 6 50036MMSZ5237BT1 F2 8.2 7.79 8.61 20 8 500 3 6.5 MMSZ5238BT1 F3 8.7 8.27 9.14 20 8 600 3 6.5 MMSZ5239BT1 F4 9.1 8.65 9.56 20 10 60037MMSZ5240BT1 F5 10 9.50 10.50 20 17 60038MMSZ5241BT1 H1 11 10.45 11.55 20 22 600 2 8.4 MMSZ5242BT1 H2 12 11.40 12.60 20 30 600 1 9.1 MMSZ5243BT1 H3 13 12.35 13.65 9.5 13 600 0.5 9.9 MMSZ5244BT1 H4 14 13.30 14.70 9.0 15 600 0.1 10 MMSZ5245BT1 H5 15 14.25 15.75 8.5 16 600 0.1 11 MMSZ5246BT1 J1 16 15.20 16.80 7.8 17 600 0.1 12 MMSZ5247BT1 J2 17 16.15 17.85 7.4 19 600 0.1 13 MMSZ5248BT1 J3 18 17.10 18.90 7.0 21 600 0.1 14 MMSZ5249BT1 J4 19 18.05 19.95 6.6 23 600 0.1 14 MMSZ5250BT1 J5 20 19.00 21.00 6.2 25 600 0.1 15 MMSZ5251BT1 K1 22 20.90 23.10 5.6 29 600 0.1 17 MMSZ5252BT1 K2 24 22.80 25.20 5.2 33 600 0.1 18 MMSZ5253BT1 K3 25 23.75 26.25 5.0 35 600 0.1 19 MMSZ5254BT1 K4 27 25.65 28.35 4.6 41 600 0.1 21 MMSZ5255BT1 K5 28 26.60 29.40 4.5 44 600 0.1 21 [1] Nominal zener voltage is measured with the device junction in thermal equilibrium at TL = 30°C ± 1°C. [2] All part numbers shown indicate a VZ tolerance of ±5%. [3] ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC) = 0.1 IZ(DC), with the AC frequency = 1 kHz. 7-14,

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted [1]), (VF = 0.9 V Max. @ IF = 10 mA for all types)

Zener Voltage V Max ReverseZ @ IZT Volts Test Max Zener Leakage [1] [2] Current Impedance [3] Current Test IZT IR @ VR Voltage ZZT ZZK VR Type @ IZ = IZT @ IZK = 0.25 mA Number Marking Nom Min Max mAΩΩµA Volts MMSZ5256BT1 M1 30 28.50 31.50 4.2 49 600 0.1 23 MMSZ5257BT1 M2 33 31.35 34.65 3.8 58 700 0.1 25 MMSZ5258BT1 M3 36 34.20 37.80 3.4 70 700 0.1 27 MMSZ5259BT1 M4 39 37.05 40.95 3.2 80 800 0.1 30 MMSZ5260BT1 M5 43 40.85 45.15 3.0 93 900 0.1 33 MMSZ5261BT1 N1 47 44.65 49.35 2.7 105 1000 0.1 36 MMSZ5262BT1 N2 51 48.45 53.55 2.5 125 1100 0.1 39 MMSZ5263BT1 N3 56 53.20 58.80 2.2 150 1300 0.1 43 MMSZ5264BT1 N4 60 57.00 63.00 2.1 170 1400 0.1 46 MMSZ5265BT1 N5 62 58.90 65.10 2.0 185 1400 0.1 47 MMSZ5266BT1 P1 68 64.60 71.40 1.8 230 1600 0.1 52 MMSZ5267BT1 P2 75 71.25 78.75 1.7 270 1700 0.1 56 MMSZ5268BT1 P3 82 77.90 86.10 1.5 330 2000 0.1 62 MMSZ5269BT1 P4 87 82.65 91.35 1.4 370 2200 0.1 68 MMSZ5270BT1 P5 91 86.45 95.55 1.4 400 2300 0.1 69 [1] Nominal zener voltage is measured with the device junction in thermal equilibrium at TL = 30°C ± 1°C. [2] All part numbers shown indicate a VZ tolerance of ±5%. [3] ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC) = 0.1 IZ(DC), with the AC frequency = 1 kHz. 7-15, ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted [1], (VF = 0.9 V Max. @ IF = 10 mA for all types) Zener Voltage V @ I = 50 µA Max Reverse TestZ ZT Volts Leakage Voltage [1] [2] Current VR Type IR @ VR Number Marking Nom Min Max µA Volts MMSZ4678T1 CC 1.8 1.71 1.89 7.5 1 MMSZ4679T1 CD 2.0 1.90 2.1051MMSZ4680T1 CE 2.2 2.09 2.3141MMSZ4681T1 CF 2.4 2.28 2.5221MMSZ4682T1 CH 2.7 2.57 2.8411MMSZ4683T1 CJ 3.0 2.85 3.15 0.8 1 MMSZ4684T1 CK 3.3 3.14 3.47 7.5 1.5 MMSZ4685T1 CM 3.6 3.42 3.78 7.5 2 MMSZ4686T1 CN 3.9 3.71 4.1052MMSZ4687T1 CP 4.3 4.09 4.5242MMSZ4688T1 CT 4.7 4.47 4.94 10 3 MMSZ4689T1 CU 5.1 4.85 5.36 10 3 MMSZ4690T1 CV 5.6 5.32 5.88 10 4 MMSZ4691T1 CA 6.2 5.89 6.51 10 5 MMSZ4692T1 CX 6.8 6.46 7.14 10 5.1 MMSZ4693T1 CY 7.5 7.13 7.88 10 5.7 MMSZ4694T1 CZ 8.2 7.79 8.61 1 6.2 MMSZ4695T1 DC 8.7 8.27 9.14 1 6.6 MMSZ4696T1 DD 9.1 8.65 9.56 1 6.9 MMSZ4697T1 DE 10 9.50 10.50 1 7.6 MMSZ4698T1 DF 11 10.45 11.55 0.05 8.4 MMSZ4699T1 DH 12 11.40 12.60 0.05 9.1 MMSZ4700T1 DJ 13 12.35 13.65 0.05 9.8 MMSZ4701T1 DK 14 13.30 14.70 0.05 10.6 MMSZ4702T1 DM 15 14.25 15.75 0.05 11.4 MMSZ4703T1 DN 16 15.20 16.80 0.05 12.1 MMSZ4704T1 DP 17 16.15 17.85 0.05 12.9 MMSZ4705T1 DT 18 17.10 18.90 0.05 13.6 MMSZ4706T1 DU 19 18.05 19.95 0.05 14.4 MMSZ4707T1 DV 20 19.00 21.00 0.01 15.2 MMSZ4708T1 DA 22 20.90 23.10 0.01 16.7 MMSZ4709T1 DZ 24 22.80 25.20 0.01 18.2 MMSZ4710T1 DY 25 23.75 26.25 0.01 19.00 MMSZ4711T1 EA 27 25.65 28.35 0.01 20.4 MMSZ4712T1 EC 28 26.60 29.40 0.01 21.2 MMSZ4713T1 ED 30 28.50 31.50 0.01 22.8 MMSZ4714T1 EE 33 31.35 34.65 0.01 25.0 MMSZ4715T1 EF 36 34.20 37.80 0.01 27.3 MMSZ4716T1 EH 39 37.05 40.95 0.01 29.6 MMSZ4717T1 EJ 43 40.85 45.15 0.01 32.6 [1] Nominal zener voltage is measured with the device junction in thermal equilibrium at TL = 30°C ± 1°C. [2] All part numbers shown indicate a VZ tolerance of ± 5% 7-16,

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted), (VF = 0.9 V Max. @ IF = 10 mA for all types)

Zener Voltage Max Zener Voltage V (Volts) Max Zener Reverse V (Volts) Max ZenerZ1 Z2 @ I = 5 mA Impedance Leakage @ I = 1 mA ImpedanceZT1 ZT2 [1][2] ZZT1 Current [1] ZZT2 @ IZT1 = 5 mA @ IZT1 = 1 mA Type [3] IR @ VR [3] Number Marking Nom Min Max Ω µA Volts Min Max Ω MMSZ2V4T1 T1 2.4 2.28 2.52 100 50 1 1.7 2.1 600 MMSZ2V7T1 T2 2.7 2.57 2.84 100 20 1 1.9 2.4 600 MMSZ3V0T1 T3 3.0 2.85 3.15 95 10 1 2.1 2.7 600 MMSZ3V3T1 T4 3.3 3.14 3.47 95512.3 2.9 600 MMSZ3V6T1 T5 3.6 3.42 3.78 90512.7 3.3 600 MMSZ3V9T1 U1 3.9 3.71 4.10 90312.9 3.5 600 MMSZ4V3T1 U2 4.3 4.09 4.52 90313.3 4.0 600 MMSZ4V7T1 U3 4.7 4.47 4.94 80323.7 4.7 500 MMSZ5V1T1 U4 5.1 4.85 5.36 60224.2 5.3 480 MMSZ5V6T1 U5 5.6 5.32 5.88 40124.8 6.0 400 MMSZ6V2T1 V1 6.2 5.89 6.51 10345.6 6.6 150 MMSZ6V8T1 V2 6.8 6.46 7.14 15246.3 7.2 80 MMSZ7V5T1 V3 7.5 7.13 7.88 15156.9 7.9 80 MMSZ8V2T1 V4 8.2 7.79 8.61 15 0.7 5 7.6 8.7 80 MMSZ9V1T1 V5 9.1 8.65 9.56 15 0.5 6 8.4 9.6 100 MMSZ10T1 A1 10 9.50 10.50 20 0.2 7 9.3 10.6 150 MMSZ11T1 A2 11 10.45 11.55 20 0.1 8 10.2 11.6 150 MMSZ12T1 A3 12 11.40 12.60 25 0.1 8 11.2 12.7 150 MMSZ13T1 A4 13 12.35 13.65 30 0.1 8 12.3 14.0 170 MMSZ15T1 A5 15 14.25 15.75 30 0.05 10.5 13.7 15.5 200 MMSZ16T1 X1 16 15.20 16.80 40 0.05 11.2 15.2 17.0 200 MMSZ18T1 X2 18 17.10 18.90 45 0.05 12.6 16.7 19.0 225 MMSZ20T1 X3 20 19.00 21.00 55 0.05 14 18.7 21.1 225 MMSZ22T1 X4 22 20.80 23.10 55 0.05 15.4 20.7 23.2 250 MMSZ24T1 X5 24 22.80 25.20 70 0.05 16.8 22.7 25.5 250 Zener Voltage Zener Voltage Max VZ2 (Volts) Max Zener V (Volts) Max Zener ImpedanceZ1 Reverse @ IZT2 = 0.1 @ I Impedance ZZT1 = 2 mA Leakage mA ZT2 [1][2] ZZT1 Current [1] @ IZT1 = 0.5 @ IZT1 = 2 mA mA Type [3] IR @ VR [3][4] Number Marking Nom Min Max Ω µA Volts Min Max Ω MMSZ27T1 Y1 27 25.65 28.35 80 0.05 18.9 25 28.9 300 MMSZ30T1 Y2 30 28.50 31.50 80 0.05 21 27.8 32 300 MMSZ33T1 Y3 33 31.35 34.65 80 0.05 23.1 30.8 35 325 MMSZ36T1 Y4 36 34.20 37.80 90 0.05 25.2 33.8 38 350 MMSZ39T1 Y5 39 37.05 40.95 130 0.05 27.3 36.7 41 350 MMSZ43T1 Z1 43 40.85 45.15 150 0.05 30.1 39.7 46 375 MMSZ47T1 Z2 47 44.65 49.35 170 0.05 32.9 43.7 50 375 MMSZ51T1 Z3 51 48.45 53.55 180 0.05 35.7 47.6 54 400 MMSZ56T1 Z4 56 53.20 58.80 200 0.05 39.2 51.5 60 425 MMSZ62T1 Z5 62 58.90 65.10 215 0.05 43.4 57.4 66 450 MMSZ68T1 Z6 68 64.60 71.40 240 0.05 47.6 63.4 72 475 MMSZ75T1 Z7 75 71.25 78.75 255 0.05 52.5 69.4 79 500 [1] Zener voltage is measured with the zener current applied for PW = 1.0 ms. [2] All part numbers shown indicate a VZ tolerance of ±5%. [3] ZZT1 and ZZT2 are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC) = 0.1 IZ(DC), [3] with the AC frequency = 1 kHz. [4] The zener impedance, ZZT2, for the 27 through 75 volt types is tested at 0.5 mA rather than the test current of 0.1 mA used for VZ2. 7-17, INFORMATION FOR USING THE SOD-123 SURFACE MOUNT PACKAGE

ÉÉÉÉ

MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNT APPLICATIONS ÉÉ0.91ÉÉ 0.036 Surface mount board layout is a critical portion of the total ÉÉÉÉ design. The footprint for the semiconductor packages must be

ÉÉÉÉ

the correct size to ensure proper solder connection interface 1.22

ÉÉÉÉ

between the board and the package. 0.048 The minimum recommended footprint for the SOD-123 is ÉÉÉÉ shown at the right. 2.36

ÉÉÉÉ

The SOD-123 package can be used on existing surface 0.093 mount boards which have been designed for the leadless 34 4.19 mm package style. The footprint compatibility makes conversion 0.165 inches from leadless 34 to SOD-123 straightforward. Figure 11. Minimum Recommended Footprint SOD-123 POWER DISSIPATION The power dissipation of the SOD-123 is a function of the ratings table on the data sheet. Substituting these values into pad size. This can vary from the minimum pad size for the equation for an ambient temperature TA of 25°C, one can soldering to a pad size given for maximum power dissipation. calculate the power dissipation of the device which in this case Power dissipation for a surface mount device is determined by is 0.37 watts. TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to P = 150°C – 25°CD = 0.37 watts ambient; and the operating temperature, TA. Using the values 340°C/W provided on the data sheet for the SOD-123 package, PD can be calculated as follows: The 340°C/W for the SOD-123 package assumes using recommended footprint shown on FR-4 glass epoxy printed circuit board. Another alternative is to use a ceramic substrate TJ(max) – TA PD = or an aluminum core board such as Thermal Clad. By usingRθJA an aluminum core board material such as Thermal Clad, the The values for the equation are found in the maximum power dissipation can be doubled using the same footprint. GENERAL SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated • The soldering temperature and time shall not exceed temperature of the device. When the entire device is heated 260°C for more than 10 seconds. to a high temperature, failure to complete soldering within a • When shifting from preheating to soldering, the maximum short time could result in device failure. Therefore, the temperature gradient shall be 5°C or less. following items should always be observed in order to • After soldering has been completed, the device should be minimize the thermal stress to which the devices are allowed to cool naturally for at least three minutes. subjected. Gradual cooling should be used as the use of forced • Always preheat the device. cooling will increase the temperature gradient and result • The delta temperature between the preheat and soldering in latent failure due to mechanical stress. should be 100°C or less.* • Mechanical stress or shock should not be applied during • When preheating and soldering, the temperature of the cooling leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When * Soldering a device without preheating can cause excessive using infrared heating with the reflow soldering method, thermal shock and stress which can result in damage to the the difference shall be a maximum of 10°C. device. 7-18,

Zener Voltage Regulator Diodes — Surface Mounted

500 mW SOD-123 ÉÉÉ ÉÉÉÉ 0.91

A ÉÉÉ ÉÉ0.036ÉÉ C

ÂÂÂ ÉÉÉ ÉÉÉÉ

H

ÂÂÂ ÉÉÉ ÉÉÉÉ 1.22 0.048 ÂÂÂ ÉÉÉ ÉÉÉÉ ÂÂÂ ÉÉÉ ÉÉÉÉ 2.36

K B 0.093

4.19 mm 0.165 inches2ESOD-123 Footprint

D J

MILLIMETERS INCHES DIM MIN MAX MIN MAX NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI A 1.40 1.80 0.055 0.071 Y14.5M, 1982. B 2.55 2.85 0.100 0.112 2. CONTROLLING DIMENSION: INCH. C 0.95 1.35 0.037 0.053 3. 425-01 THRU -03 OBSOLETE, NEW STANDARD D 0.50 0.70 0.020 0.028 425-04. E 0.25 — 0.010 — H 0.00 0.10 0.000 0.004 J — 0.15 — 0.006 K 3.55 3.85 0.140 0.152

CASE 425

STYLE 1:

PLASTIC PIN 1. CATHODE

2. ANODE (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)

MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Type No. Suffix MPQ (Units) Tape and Reel T1(1) 3K Tape and Reel T3(2) 10K

NOTE: 1. The numbers on the suffixes indicate the following: NOTE: 1. 1. 7″ Reel. Cathode lead toward sprocket hole. NOTE: 1. 2. 13″ Reel. Cathode lead toward sprocket hole. (Refer to Section 10 for more information on Packaging Specifications.) Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Literature Distribution Centers: USA: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. EUROPE: Motorola Ltd.; European Literature Centre; 88 Tanners Drive, Blakelands, Milton Keynes, MK14 5BP, England. JAPAN: Nippon Motorola Ltd.; 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong.

Motorola TVS/Zener Device Data◊ 500 mW Leadless (SOD-123) Data Sheet

7-19]
15

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Electrical Characteristics TC = 25°C unless otherwise noted
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Typical Characteristics
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