Download: Order this document SEMICONDUCTOR TECHNICAL DATA by MMQA/D Transient Voltage Suppressor for ESD Protection SC-59 QUADTRANSIENT VOLTAGE

Order this document SEMICONDUCTOR TECHNICAL DATA by MMQA/D Motorola Preferred Devices Transient Voltage Suppressor for ESD Protection SC-59 QUADTRANSIENT VOLTAGE This quad monolithic silicon voltage suppressor is designed for applications SUPPRESSOR 24 WATTS PEAK POWER requiring transient overvoltage protection capability. It is intended for use in 5.6 – 33 VOLTS voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applica- tions. Its quad junction common anode design protects four separate lines using only one ...
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Order this document SEMICONDUCTOR TECHNICAL DATA by MMQA/D

Motorola Preferred Devices

Transient Voltage Suppressor

for ESD Protection SC-59 QUADTRANSIENT VOLTAGE This quad monolithic silicon voltage suppressor is designed for applications SUPPRESSOR 24 WATTS PEAK POWER requiring transient overvoltage protection capability. It is intended for use in 5.6 – 33 VOLTS voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applica- tions. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board 6 space is at a premium. 5 4 Specification Features: 1 2 • SC-59 Package Allows Four Separate Unidirectional Configurations • Peak Power — Min. 24 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform CASE 318F-01 STYLE 1 • Peak Power — Min. 150 W @ 20 s (Unidirectional), per Figure 6 Waveform SC-59 PLASTIC • Maximum Clamping Voltage @ Peak Pulse Current • Low Leakage < 2.0 µA • ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Mechanical Characteristics: 1 6 • Void Free, Transfer-Molded, Thermosetting Plastic Case25• Corrosion Resistant Finish, Easily Solderable • Package Designed for Optimal Automated Board Assembly34• Small Package Size for High Density Applications • Available in 8 mm Tape and Reel PIN 1. CATHODE Use the Device Number to order the 7 inch/3,000 unit reel. Replace 2. ANODE with “T3” in the Device Number to order the 13 inch/10,000 unit reel. 3. CATHODE 4. CATHODE 5. ANODE 6. CATHODE THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Value Unit Peak Power Dissipation @ 1.0 ms (1) @ TA ≤ 25°C Ppk 24 Watts Peak Power Dissipation @ 20 s (2) @ TA ≤ 25°C Ppk 150 Watts Total Power Dissipation on FR-5 Board (3) @ TA = 25°C °PD° °225 °mW° 1.8 mW/°C Thermal Resistance from Junction to Ambient RθJA 556 °C/W Total Power Dissipation on Alumina Substrate (4) @ TA = 25°C °PD° °300 °mW Derate above 25°C 2.4 mW/°C Thermal Resistance from Junction to Ambient RθJA 417 °C/W Junction and Storage Temperature Range TJ, Tstg °– 55 to +150° °C Lead Solder Temperature — Maximum (10 Second Duration) TL 260 °C 1. Non-repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 4. 2. Non-repetitive current pulse per Figure 6 and derate above TA = 25°C per Figure 4. 3. FR-5 = 1.0 x 0.75 x 0.62 in. 4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina Preferred devices are Motorola recommended choices for future use and best overall value. Thermal Clad is a trademark of the Bergquist Company MMoMtorQolaA, ISnce. r1i9e9s6 MOTOROLA,

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA)

Max Reverse Max Reverse Breakdown Voltage MaximumLeakage Current Max Zener Max Reverse Voltage @ Temperature Impedance (7) Surge IRSM(6) VZT (5) Coefficient ofIVCurrent (Clamping(V) @ I VZTRRVoltage) Z Z @ IIVDevice Min Nom Max (mA) (nA) (V) ZT ZT RSM(4) RSM(Ω) (mA) (A) (V) (mV/°C) MMQA5V6T1,T3 5.32 5.6 5.88 1.0 2000 3.0 400 3.0 8.0 1.26 MMQA6V2T1,T3 5.89 6.2 6.51 1.0 700 4.0 300 2.66 9.0 10.6 MMQA6V8T1,T3 6.46 6.8 7.14 1.0 500 4.3 300 2.45 9.8 10.9 MMQA12VT1,T3 11.4 12 12.6 1.0 75 9.1 80 1.39 17.3 14 MMQA13VT1,T3 12.4 13 13.7 1.0 75 9.8 80 1.29 18.6 15 MMQA15VT1,T3 14.3 15 15.8 1.0 75 11 80 1.1 21.7 16 MMQA18VT1,T3 17.1 18 18.9 1.0 75 14 80 0.923 26 19 MMQA20VT1,T3 19 20 21 1.0 75 15 80 0.84 28.6 20.1 MMQA21VT1,T3 20 21 22.1 1.0 75 16 80 0.792 30.3 21 MMQA22VT1,T3 20.9 22 23.1 1.0 75 17 80 0.758 31.7 22 MMQA24VT1,T3 22.8 24 25.2 1.0 75 18 100 0.694 34.6 25 MMQA27VT1,T3 25.7 27 28.4 1.0 75 21 125 0.615 39 28 MMQA30VT1,T3 28.5 30 31.5 1.0 75 23 150 0.554 43.3 32 MMQA33VT1,T3 31.4 33 34.7 1.0 75 25 200 0.504 48.6 37 (5) VZ measured at pulse test current IT at an ambient temperature of 25°C. (6) Surge current waveform per Figure 5 and derate per Figure 4. (7) ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. NOTE: SPECS LISTED ABOVE ARE PRELIMINARY

TYPICAL CHARACTERISTICS

300 10,000 250 BIASED AT0VBIASED AT1V1,000 200 BIASED AT 50% OF VZ NOM +150°C 150 100 +25°C 10 –40°C005.6 6.8 12 20 27 33 5.6 6.8 20 27 33 VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V)

Figure 1. Typical Capacitance Figure 2. Typical Leakage Current MOTOROLA MMQA Series

C, CAPACITANCE (pF) IR , LEAKAGE (nA),

TYPICAL CHARACTERISTICS

300 100 250 80 ALUMINA SUBSTRATE 200 70 150 50 FR-5 BOARD 30 50 2000025 50 75 100 125 150 175 0 25 50 75 100 125 150 175 200 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)

Figure 3. Steady State Power Derating Curve Figure 4. Pulse Derating Curve

PULSE WIDTH (tP) IS DEFINED tr PEAK VALUE IRSM @ 8 s AS THAT POINT WHERE THE 90 tr PEAK CURRENT DECAYS TO 50% 80 PULSE WIDTH (tP) IS DEFINED 100 PEAK VALUE — IRSM OF IRSM. AS THAT POINT WHERE THE tr ≤ 10 µs 70 PEAK CURRENT DECAY = 8sIHALF VALUE IRSM RSM /2 @ 20 s HALF VALUE — 50 tP tP 200001234020 40 60 80 t, TIME (ms) t, TIME (s)

Figure 5. 10 × 1000 s Pulse Waveform Figure 6. 8 × 20 s Pulse Waveform

100 200 RECTANGULAR 180 WAVEFORM, TA = 25°C 160 8 × 20 WAVEFORM AS PER FIGURE 6 10 100 UNIDIRECTIONAL 80 60 10 × 100 WAVEFORM AS PER FIGURE 5 1.0 0 0.1 1.0 10 100 1000 5.6 6.8 12 20 27 33 PW, PULSE WIDTH (ms) NOMINAL VZ

Figure 7. Maximum Non–Repetitive Surge Figure 8. Typical Maximum Non–Repetitive Power, Ppk versus PW Surge Power, Ppk versus VBR Power is defined as VRSM x IZ(pk) where VRSM

is the clamping voltage at IZ(pk).

MMQA Series MOTOROLA

Ppk PEAK SURGE POWER (W) VALUE (%) PD , POWER DISSIPATION (mW) PEAK PULSE DERATING IN % OF PEAK POWER PPK , PEAK SURGE POWER (W) % OF PEAK PULSE CURRENT OR CURRENT @ TA = 25°C,

TYPICAL COMMON ANODE APPLICATIONS

A quad junction common anode design in a SC-59 pack- when board space is at a premium. A simplified example of age protects four separate lines using only one package. MMQA Series Device applications is illustrated below. This adds flexibility and creativity to PCB design especially Computer Interface Protection

A

KEYBOARD B TERMINAL I/O C

FUNCTIONAL

PRINTER DECODER ETC. D

GND

MMQA SERIES DEVICE Microprocessor Protection

VDD VGG

ADDRESS BUS RAM ROM DATA BUS

CPU

I/O

CLOCK

CONTROL BUS

GND

MMQA SERIES DEVICE MOTOROLA MMQA Series,

INFORMATION FOR USING THE SC-59 6 LEAD SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total face between the board and the package. With the correct design. The footprint for the semiconductor packages must pad geometry, the packages will self-align when subjected to be the correct size to ensure proper solder connection inter- a solder reflow process. 0.094 2.4 0.037 0.95 0.074 1.9 0.037 0.95 0.028 0.7 0.039 inches 1.0 mm SC-59 6 LEAD SC-59 6 LEAD POWER DISSIPATION The power dissipation of the SC-59 6 Lead is a function of calculate the power dissipation of the device which in this the pad size. This can vary from the minimum pad size for case is 225 milliwatts. soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined P = 150°C – 25°CD = 225 milliwatts by TJ(max), the maximum rated junction temperature of the 556°C/W die, RθJA, the thermal resistance from the device junction to The 556°C/W for the SC-59 6 Lead package assumes the ambient, and the operating temperature, TA. Using the use of the recommended footprint on a glass epoxy printed values provided on the data sheet for the SC-59 6 Lead circuit board to achieve a power dissipation of 225 milliwatts. package, PD can be calculated as follows: There are other alternatives to achieving higher power TJ(max) – TA dissipation from the SC-59 6 Lead package. Another alterna- PD = RθJA tive would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material The values for the equation are found in the maximum such as Thermal Clad, an aluminum core board, the power ratings table on the data sheet. Substituting these values into dissipation can be doubled using the same footprint. the equation for an ambient temperature TA of 25°C, one can SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed SC-59, SC-59 6 Lead, SC-70/SOT-323, SOD-123, SOT-23, circuit board, solder paste must be applied to the pads. SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC Solder stencils are used to screen the optimum amount. diode packages, the stencil opening should be the same as These stencils are typically 0.008 inches thick and may be the pad size or a 1:1 registration. made of brass or stainless steel. For packages such as the SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated • When preheating and soldering, the temperature of the temperature of the device. When the entire device is heated leads and the case must not exceed the maximum to a high temperature, failure to complete soldering within a temperature ratings as shown on the data sheet. When short time could result in device failure. Therefore, the using infrared heating with the reflow soldering method, following items should always be observed in order to mini- the difference should be a maximum of 10°C. mize the thermal stress to which the devices are subjected. • Always preheat the device. * Soldering a device without preheating can cause excessive • The delta temperature between the preheat and thermal shock and stress which can result in damage to the soldering should be 100°C or less.* device. MMQA Series MOTOROLA, • The soldering temperature and time should not exceed Gradual cooling should be used since the use of forced 260°C for more than 10 seconds. cooling will increase the temperature gradient and will • When shifting from preheating to soldering, the result in latent failure due to mechanical stress. maximum temperature gradient should be 5°C or less. • Mechanical stress or shock should not be applied during • After soldering has been completed, the device should cooling. be allowed to cool naturally for at least three minutes.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control actual temperature that might be experienced on the surface settings that will give the desired heat pattern. The operator of a test board at or near a central solder joint. The two must set temperatures for several heating zones and a figure profiles are based on a high density and a low density board. for belt speed. Taken together, these control settings make The Vitronics SMD310 convection/infrared reflow soldering up a heating “profile” for that particular circuit board. On system was used to generate this profile. The type of solder machines controlled by a computer, the computer remem- used was 62/36/2 Tin Lead Silver with a melting point bers these profiles from one operating session to the next. between 177–189°C. When this type of furnace is used for Figure 9 shows a typical heating profile for use when solder reflow work, the circuit boards and solder joints tend to soldering a surface mount device to a printed circuit board. heat first. The components on the board are then heated by This profile will vary among soldering systems, but it is a conduction. The circuit board, because it has a large surface good starting point. Factors that can affect the profile include area, absorbs the thermal energy more efficiently, then the type of soldering system in use, density and types of distributes this energy to the components. Because of this components on the board, type of solder used, and the type effect, the main body of a component may be up to 30 of board or substrate material being used. This profile shows degrees cooler than the adjacent solder joints. temperature versus time. The line on the graph shows the STEP 1 STEP 2 STEP 3 STEP 4 STEP 5 STEP 6 STEP 7 PREHEAT VENT HEATING HEATING HEATING VENT COOLING ZONE 1 “SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7 “RAMP” “RAMP” “SOAK” “SPIKE” 205° TO 219°C PEAK AT 200°C DESIRED CURVE FOR HIGH 170°C SOLDER JOINT MASS ASSEMBLIES 160°C 150°C 150°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS 100°C 140°C (DEPENDING ON MASS OF ASSEMBLY) 100°C DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 9. Typical Solder Heating Profile MOTOROLA MMQA Series,

OUTLINE DIMENSIONS A NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

L Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS654

B IS THE MINIMUM THICKNESS OF BASES MATERIAL.

123INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.1063 0.1220 2.70 3.10

D B 0.0512 0.0669 1.30 1.70 G C 0.0394 0.0511 1.00 1.30D 0.0138 0.0196 0.35 0.50

G 0.0335 0.0413 0.85 1.05 H 0.0005 0.0040 0.013 0.100

M J 0.0040 0.0102 0.10 0.26 J K 0.0079 0.0236 0.20 0.60

0.05 (0.002) C L 0.0493 0.0649 1.25 1.65M010 0 10

K S 0.0985 0.1181 2.50 3.00H

STYLE 1: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE

CASE 318F-01 5. ANODE

6. CATHODE

ISSUE A SC-59 6 LEAD MMQA Series MOTOROLA

, Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P.O. Box 5405; Denver, Colorado 80217. 1–800–441–2447 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 MFAX: email is hidden – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MMQA/D

MOTOROLA ◊ MMQA Series

]
15

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DISCRETE SEMICONDUCTORS DATA SHEET Line-ups RF Power Transistors for UHF 1996 Feb 12 File under Discrete Semiconductors, SC08b INTRODUCTION In this section, we present information on recommended circuit line-ups in the main RF power application areas. A comprehensive range of output power levels is
Typical Characteristics
KSP94 High Voltage Transistor • High Collector-Emitter Voltage: VCEO= -400V • Low Collector-Emitter Saturation Voltage • Complement to KSP44 1 TO-92 1. Emitter 2. Base 3. Collector PNP Epitaxial Silicon Transistor Absolute Maximum Ratings Ta=25°C unless otherwise noted Symbol Parameter Value Units V
DISCRETE SEMICONDUCTORS DATA SHEET J308; J309; J310 N-channel silicon field-effect transistors Product specification 1996 Jul 30 Supersedes data of April 1995
DISCRETE SEMICONDUCTORS DATA SHEET J308; J309; J310 N-channel silicon field-effect transistors Product specification 1996 Jul 30 Supersedes data of April 1995 File under Discrete Semiconductors, SC07 FEATURES PINNING - TO-92 • Low noise PIN SYMBOL DESCRIPTION • Interchangeability of drain and source