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Order this document SEMICONDUCTOR TECHNICAL DATA by 1PMT5913BT3/D %#"& %% $% &# "&!% "! !# "$ "'# % This complete new line of zener/tvs diodes offers a 2.5 watt series in a micro PLASTIC SURFACE MOUNT miniature, space saving surface mount package. The Powermite zener/tvs ZENER DIODES diodes are designed for use as a tvs or a regulation device in automotive and 2.5 WATTS telecommunication applications where efficiency, low leakage, size/height and 3.3–91 VOLTS profile are important. Features: • Voltage Range – 3.3 to 91 V • ESD Rating of Class 3 (> 16 kV) per Human Body Model 1 • Low Profile – ...
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Order this document SEMICONDUCTOR TECHNICAL DATA by 1PMT5913BT3/D

%#"& %% $% &# "&!% "! !# "$ "'# % This complete new line of zener/tvs diodes offers a 2.5 watt series in a micro PLASTIC SURFACE MOUNT miniature, space saving surface mount package. The Powermite zener/tvs ZENER DIODES diodes are designed for use as a tvs or a regulation device in automotive and 2.5 WATTS telecommunication applications where efficiency, low leakage, size/height and 3.3–91 VOLTS profile are important. Features: • Voltage Range – 3.3 to 91 V • ESD Rating of Class 3 (> 16 kV) per Human Body Model 1 • Low Profile – maximum height of 1.1mm • Integral Heat Sink/Locking Tabs 2 • Full metallic bottom eliminates flux entrapment CASE 457–01 • Small Footprint – Footprint area of 8.45mm2 PLASTIC • Supplied in 12mm tape and reel – 12,000 units per reel • Powermite is JEDEC Registered as DO–216AA121: CATHODE 2: ANODE MAXIMUM RATINGS Rating Symbol Value Unit DC Power Dissipation @ TL = 75°C, Measured at Zero Lead Length °PD° 2.5 °Watts° Derate above 75°C 40 mW/°C DC Power Dissipation @ TA = 25°C(1) °PD° 380 °mW Derate above 25°C 2.8 mW/°C Thermal Resistance from Junction to Lead RθJL 26 °C/W Thermal Resistance from Junction to Ambient RθJA 324 °C/W Operating and Storage Junction Temperature Range TJ, Tstg – 65 to +150 °C Typical Ppk Dissipation @ TL < 25°C, (PW–10/1000 µs per Figure 8)(2) Ppk 200 Watts Typical Ppk Dissipation @ TL < 25°C, (PW–8/20 µs per Figure 9)(2) Ppk 1000 Watts (1)FR4 Board, within 1” to device, using Motorola minimum recommended footprint, as shown in case 403A outline dimensions spec. (2)Non–repetitive current pulse. This document contains preview information only and is subject to change without notice. Powermite is a registered trademark of Microsemi Corporation. Thermal Clad is a trademark of the Bergquist Company. 1 MPoMtoTro5la9, 1In3cB. 1T9936 through 1PMT5948BT3 MOTOROLA, ELECTRICAL CHARACTERISTICS (VF = 1.5 Volts Max @ IF = 200 mAdc for all types.) Nominal Max Reverse Maximum DC Zener Voltage Test Max Zener Impedance (Note 2) Leakage Current Zener VZ @ IZT Current Current Volts IZT ZZT @ IZT ZZK @ IZK IR @ VR IZM Device Device* (Note 1) mA Ohms Ohms mA µA Volts mAdc Marking 1PMT5913BT3 3.3 113.6 10 500 1 100 1 454 913B 1PMT5914BT3 3.6 104.2 9 500 1 75 1 416 914B 1PMT5915BT3 3.9 96.1 7.5 500 1 25 1 384 915B 1PMT5916BT3 4.3 87.2 6 500151348 916B 1PMT5917BT3 4.7 79.8 5 500151.5 319 917B 1PMT5918BT3 5.1 73.5 4 350152294 918B 1PMT5919BT3 5.6 66.9 2 250153267 919B 1PMT5920BT3 6.2 60.5 2 200154241 920B 1PMT5921BT3 6.8 55.1 2.5 200155.2 220 921B 1PMT5922BT3 7.5 50 3 400 0.5 5 6.8 200 922B 1PMT5923BT3 8.2 45.7 3.5 400 0.5 5 6.5 182 923B 1PMT5924BT3 9.1 41.2 4 500 0.557164 924B 1PMT5925BT3 10 37.5 4.5 500 0.2558150 925B 1PMT5926BT3 11 34.1 5.5 550 0.25 1 8.4 136 926B 1PMT5927BT3 12 31.2 6.5 550 0.25 1 9.1 125 927B 1PMT5928BT3 13 28.8 7 550 0.25 1 9.9 115 928B 1PMT5929BT3 15 25 9 600 0.25 1 11.4 100 929B 1PMT5930BT3 16 23.4 10 600 0.25 1 12.2 93 930B 1PMT5931BT3 18 20.8 12 650 0.25 1 13.7 83 931B 1PMT5932BT3 20 18.7 14 650 0.25 1 15.2 75 932B 1PMT5933BT3 22 17 17.5 650 0.25 1 16.7 68 933B 1PMT5934BT3 24 15.6 19 700 0.25 1 18.2 62 934B 1PMT5935BT3 27 13.9 23 700 0.25 1 20.6 55 935B 1PMT5936BT3 30 12.5 26 750 0.25 1 22.8 50 936B 1PMT5937BT3 33 11.4 33 800 0.25 1 25.1 45 937B 1PMT5938BT3 36 10.4 38 850 0.25 1 27.4 41 938B 1PMT5939BT3 39 9.6 45 900 0.25 1 29.7 38 939B 1PMT5940BT3 43 8.7 53 950 0.25 1 32.7 34 940B 1PMT5941BT3 47 8 67 1000 0.25 1 35.8 31 941B 1PMT5942BT3 51 7.3 70 1100 0.25 1 38.8 29 942B 1PMT5943BT3 56 6.7 86 1300 0.25 1 42.6 26 943B 1PMT5944BT3 62 6 100 1500 0.25 1 47.1 24 944B 1PMT5945BT3 68 5.5 120 1700 0.25 1 51.7 22 945B 1PMT5946BT3 75 5 140 2000 0.25 1 56 20 946B 1PMT5947BT3 82 4.6 160 2500 0.25 1 62.2 18 947B 1PMT5948BT3 91 4.1 200 3000 0.25 1 69.2 16 948B * TOLERANCE AND VOLTAGE DESIGNATION Tolerance designation — The type numbers listed indicate a tolerance of ±5%. Devices listed in bold, italic are Motorola preferred devices. MOTOROLA 1PMT5913BT3 through 1PMT5948BT3,

TYPICAL CHARACTERISTICS

6 1000

RECTANGULAR NONREPETITIVE

5 WAVEFORM

TL

3 100

TA

0 10 0 25 50 75 100 125 150 0.1 1 10 100 T, TEMPERATURE (°C) PW, PULSE WIDTH (ms)

Figure 1. Steady State Power Derating Figure 2. Maximum Surge Power

10 120 NONREPETITIVE = 10 µs TA = 25°C EXPONENTIAL 100 PW (ID) IS DEFINED AS THE PULSE WAVEFORM POINT WHERE THE PEAK CURRENTPEAK VALUE T = 25°C DECAYS TO 50% OF IJ pp.80 Ippm 1 60 HALF VALUE – Ipp/2 10/1000 µs WAVEFORM AS DEFINED BY R.E.A. td 0.1 0 0.001 0.01 0.1 1 10012345Tp, PULSE WIDTH (ms) t, TIME (ms)

Figure 3. Maximum Surge Power Figure 4. Pulse Waveform 10/1000

10 200 8 VZ @ IZT VZ @ IZT 4 50 –2 –4 10246810 12 10 20 30 50 70 100 200 VZ, ZENER VOLTAGE (VOLTS) VZ, ZENER VOLTAGE (VOLTS)

Figure 5. Zener Voltage – To 12 Volts Figure 6. Zener Voltage – 14 To 200 Volts

NOTE 1. ZENER VOLTAGE (VZ) MEASUREMENT Nominal zener voltage is measured with the device junction in thermal equilibrium with ambient temperature at 25°C 1PMT5913BT3 through 1PMT5948BT3 MOTOROLA θVZ , TEMPERATURE COEFFICIENT (mV/ ° C) PP K , PEAK POWER (kW) P D , MAXIMUM POWER DISSIPATION (WATTS) θVZ , TEMPERATURE COEFFICIENT (mV/ ° C) Ippm, PEAK PULSE CURRENT (%) PP K , PEAK SURGE POWER (WATTS), 100 100 50 50 30 30 20 20 10 10553322110.5 0.5 0.3 0.3 0.2 0.2 0.1 0.1012345678910 0 10 20 30 40 50 60 70 80 90 100 VZ, ZENER VOLTAGE (VOLTS) VZ, ZENER VOLTAGE (VOLTS)

Figure 7. VZ = 3.3 thru 10 Volts Figure 8. VZ = 12 thru 82 Volts

200 1k IZ(dc) = 1mA 500 TJ = 25°C 100 iZ(rms) = 0.1 IZ(dc) 70 200 VZ =150V 50 100 91V 30 50 20 62V 10mA 10 10 5 22V 3 20mA iZ(rms) = 0.1 I Z(dc) 12V 6.8V215710 20 30 50 70 100 0.512510 20 50 100 200 500 VZ, ZENER VOLTAGE (VOLTS) IZ, ZENER TEST CURRENT (mA)

Figure 9. Effect of Zener Voltage Figure 10. Effect of Zener Current

NOTE 2. ZENER IMPEDANCE (ZZ) DERIVATION ZZT and ZZK are measured by dividing the ac voltage drop across the device by the ac current applied. The specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz.

MOTOROLA 1PMT5913BT3 through 1PMT5948BT3

Z Z , DYNAMIC IMPEDANCE (OHMS) I Z , ZENER CURRENT (mA) Z Z , DYNAMIC IMPEDANCE (OHMS) I Z , ZENER CURRENT (mA),

INFORMATION FOR USING THE POWERMITE SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total interface between the board and the package. With the design. The footprint for the semiconductor packages must correct pad geometry, the packages will self align when be the correct size to insure proper solder connection subjected to a solder reflow process. 0.025 0.105 0.635 2.67 0.030 0.762 0.100 0.050 2.54 1.27 inches mm

POWERMITE

POWERMITE POWER DISSIPATION The power dissipation of the Powermite is a function of the SOLDERING PRECAUTIONS drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. The melting temperature of solder is higher than the rated Power dissipation for a surface mount device is determined temperature of the device. When the entire device is heated by TJ(max), the maximum rated junction temperature of the to a high temperature, failure to complete soldering within a die, RθJA, the thermal resistance from the device junction to short time could result in device failure. Therefore, the ambient, and the operating temperature, T . Using the following items should always be observed in order toA values provided on the data sheet for the Powermite minimize the thermal stress to which the devices are package, PD can be calculated as follows: subjected. • Always preheat the device. TJ(max) – TA P = • The delta temperature between the preheat and solderingD RθJA should be 100°C or less.* The values for the equation are found in the maximum • When preheating and soldering, the temperature of the ratings table on the data sheet. Substituting these values into leads and the case must not exceed the maximum the equation for an ambient temperature TA of 25°C, one can temperature ratings as shown on the data sheet. When calculate the power dissipation of the device which in this using infrared heating with the reflow soldering method, case is 386 milliwatts. the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed P = 150°C – 25°C = 386 milliwatts 260°C for more than 10 seconds.D 324°C/W • When shifting from preheating to soldering, the maximum The 324°C/W for the Powermite package assumes the use temperature gradient shall be 5°C or less. of the recommended footprint on a glass epoxy printed circuit • After soldering has been completed, the device should be board to achieve a power dissipation of 386 milliwatts. There allowed to cool naturally for at least three minutes. are other alternatives to achieving higher power dissipation Gradual cooling should be used as the use of forced from the Powermite package. Another alternative would be cooling will increase the temperature gradient and result to use a ceramic substrate or an aluminum core board such in latent failure due to mechanical stress. as Thermal Clad. Using a board material such as Thermal • Mechanical stress or shock should not be applied during Clad, an aluminum core board, the power dissipation can be cooling. doubled using the same footprint. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. 1PMT5913BT3 through 1PMT5948BT3 MOTOROLA,

OUTLINE DIMENSIONS

NOTES: –A– C F 1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.

J 0.08 (0.003) MTBSCS2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,

S PROTRUSIONS OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE. MILLIMETERS INCHES TERM. 1 CATHODE DIM MIN MAX MIN MAX –B– A 1.75 2.15 0.069 0.081

K B 1.75 2.15 0.069 0.086

C 0.85 1.15 0.033 0.045 TERM. 2 ANODE D 0.40 0.65 0.016 0.026 F 0.70 1.00 0.028 0.039 H –0.05 +0.10 –0.002 +0.004

R J 0.10 0.25 0.004 0.010 L K 3.60 4.15 0.142 0.163L 0.50 0.80 0.020 0.031

R 1.20 1.50 0.047 0.059

J S 0.50 REF 0.020 H D

–T– 0.08 (0.003) MTBSCS

CASE 457–01 ISSUE O

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: email is hidden – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ 1PMT5913BT3/DMOTOROLA 1PMT5913BT3 through 1PMT5948BT3]
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