Download: DISCRETE SEMICONDUCTORS DATA SHEET OM2070B Wideband amplifier module Product specification 1995 Nov 29 Supersedes data of October 1991 File under Discrete Semiconductors, SC16

DISCRETE SEMICONDUCTORS DATA SHEET OM2070B Wideband amplifier module Product specification 1995 Nov 29 Supersedes data of October 1991 File under Discrete Semiconductors, SC16 DESCRIPTION A three-stage wideband amplifier in hybrid integrated circuit form on a thin-film substrate. The device is intended for use in mast-head booster amplifiers, as an amplifier in MATV and CATV systems and as a general purpose amplifier for VHF and UHF applications. PINNING PIN DESCRIPTION pin 1 identification 1 input − handbook, halfpage2 common ( ) 3 common (−) 4 common (−) 5 common (−) 1 6 supply (+) 7 common ...
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DISCRETE SEMICONDUCTORS

DATA SHEET OM2070B Wideband amplifier module

Product specification 1995 Nov 29 Supersedes data of October 1991 File under Discrete Semiconductors, SC16,

DESCRIPTION

A three-stage wideband amplifier in hybrid integrated circuit form on a thin-film substrate. The device is intended for use in mast-head booster amplifiers, as an amplifier in MATV and CATV systems and as a general purpose amplifier for VHF and UHF applications.

PINNING

PIN DESCRIPTION pin 1 identification 1 input − handbook, halfpage2 common ( ) 3 common (−) 4 common (−) 5 common (−) 1 6 supply (+) 7 common (−) 987654321MLA418 8 common (−) Fig.1 Simplified outline. 9 output/supply (+) QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency range 40 − 860 MHz ZS, ZL source and load impedance − 75 − Ω GT transducer gain = S 221 − 30 − dB ∆GT flatness of frequency response − 1 − dB Vo(rms) output voltage (RMS value) dim = −60 dB; 3rd order intermodulation (3-tone) VHF − 113 − dBµV UHF − 112 − dBµV F noise figure − 4.8 − dB VB DC supply voltage 10.8 12 13.2 V Tamb ambient operating temperature −20 − +70 °C 1995 Nov 29 2,

CIRCUIT DIAGRAM AND PRINTED-CIRCUIT BOARD

C1 C3 C6 handbook, full pagewidth R3 R8 R13 R1 R6 R11 TR1 C2 TR2 C4 TR3 R2 R4 R5 R7 R9 R10 R12 R14 2,3,4,5 7,8 C5 MGA201

Fig.2 Circuit diagram.

handbook, full pagewidth19(9x) TOP VIEW

L

75 Ω 75 Ω track trackCCMGA202 BOTTOM VIEW L > 5 µH; e.g. catalogue No. 3122 108 20150, or 27 turns enamelled 0.3 mm copper wire wound on a ferrite core with a diameter of 1.6 mm. C > 220 pF ceramic capacitor.

Fig.3 Printed-circuit board holes and tracks.

1995 Nov 29 3, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VB DC supply voltage − 15 V PIM peak incident powers on pins 1 and 8 − 100 mW Tamb ambient operating temperature −20 +70 °C Tstg storage temperature −40 +125 °C

CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Measuring conditions Tamb ambient operating temperature − 25 − °C VB DC supply voltage − 12 − V ZS source impedance − 75 − Ω ZL load impedance − 75 − Ω Z0 characteristic impedance of − 75 − Ω HF connections f frequency range 40 − 860 MHz Performance IB supply current − 100 − mA GT transducer gain = S 221 28 30 33 dB ∆GT flatness of frequency response − 1 − dB VSWRin individual maximum VSWR input; note 1 − 2.7 − VSWRout individual maximum VSWR output; note 1 − 1.9 − S 212 back attenuation f = 100 MHz − 45 − dB f = 860 MHz − 35 − dB Vo(rms) output voltage (RMS value) dim = −60 dB; 3rd order intermodulation (3-tone) VHF 111 113 − dBµV UHF 110 112 − dBµV F noise figure − 4.8 − dB Operating conditions Tamb ambient operating temperature −20 − +70 °C VB DC supply voltage 10.8 12 13.2Vffrequency range 40 − 860 MHz ZS source impedance − 75 − Ω ZL load impedance − 75 − Ω Note 1. Highest value (for sample) occurring in the frequency range. 1995 Nov 29 4, MCD445 MCD444 32 32 handbook, halfpage handbook, halfpage S21 2

S

(dB) 21 (dB) (1) 30 30 (2) (3) 28 28 0 500 1000 0 500 1000 f (MHz) f (MHz) (1) Maximum gain. Gain over entire frequency range. (2) Average gain. Z0 = 75 Ω. (3) Minimum gain. Fig.4 Transducer gain as a function of frequency. Fig.5 Power gain. 1995 Nov 29 5, MOUNTING Dip or wave soldering The module should preferably be mounted on a The maximum permissible temperature for the solder is double-sided printed-circuit board, see Fig.3. 260 °C. It must not be in contact with the joint for more than Input and output should be connected to 75 Ω tracks. 5 s. The connection to the common pins should be as close to The total contact time of successive solder waves must not the seating plane as possible. exceed 5 s. The device may be mounted against the printed-circuit SOLDERING board, but the temperature of the device must not exceed Hand soldering 125 °C. The maximum contact time for a soldering iron If the printed-circuit board has been pre-heated, forced temperature of 260 °C up to the seating plane is 5 s. cooling may be necessary immediately after soldering to keep the temperature below the allowable limit. PACKAGE OUTLINE pin 1 identification handbook, full pagewidth 27 max 5 max 21 max 4.59876543213.0 0.5 0.25 2.54 MLA417 3 max (9x) Dimensions in mm. Fig.6 Resin coated encapsulation. 1995 Nov 29 6 seating plane,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1995 Nov 29 7]
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