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PACKAGE STRUCTURE The following diagrams show the structure of typical IC packages. STRUCTURE OF METAL SEALED DIP CHIP LID (Au or Ni PLATING) AI WIRE SEALING MATERIAL (Au/Sn or Pb/Sn) CERAMIC BODY LEAD (Pb/Sn or Au PLATING) SOFT SOLDER (Pb/Sn) STRUCTURE OF PLASTIC MOLDED DIP SILVER SPOT PLATING EPOXY RESIN SOFT SOLDER (Pb/Sn) LEAD (Pb/Sn PLATING) Au WIRE STRUCTURE OF PLASTIC MOLDED SOP SOFT SOLDER OR ADHESIVE EPOXY RESIN (Pb/Sn) SILVER SPOT PLATING LEAD Au WIRE (Pb/Sn PLATING) STRUCTURE OF PLASTIC MOLDED QFP CHIP SILVER SPOT PLATING LEAD Au WIRE (Pb/Sn PLATING) SOFT SOLDER OR ADHESIVE (Pb/Sn...
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PACKAGE STRUCTURE The following diagrams show the structure of typical IC packages.
STRUCTURE OF METAL SEALED DIP
CHIP LID (Au or Ni PLATING) AI WIRE SEALING MATERIAL (Au/Sn or Pb/Sn) CERAMIC BODYLEAD
(Pb/Sn or Au PLATING) SOFT SOLDER (Pb/Sn)STRUCTURE OF PLASTIC MOLDED DIP
SILVER SPOT PLATING EPOXY RESIN SOFT SOLDER (Pb/Sn)LEAD
(Pb/Sn PLATING) Au WIRESTRUCTURE OF PLASTIC MOLDED SOP
SOFT SOLDER OR ADHESIVE EPOXY RESIN (Pb/Sn) SILVER SPOTPLATING LEAD
Au WIRE (Pb/Sn PLATING), STRUCTURE OF PLASTIC MOLDED QFP CHIP SILVER SPOTPLATING LEAD
Au WIRE (Pb/Sn PLATING) SOFT SOLDER OR ADHESIVE (Pb/Sn) STRUCTURE OF PLASTIC MOLDED QFJ EPOXY RESIN Au WIRE SILVER SPOT SOFT SOLDER LEAD PLATING (Pb/Sn) (Pb/Sn PLATING),STRUCTURE OF QTP CHIP
HEAT SPREADER LEAD(Pb/Sn PLATING)TAPE
(Polyimide) TEST PADSTRUCTURE OF HQFP
EPOXY RESIN HEAT SPREADER SILVER SPOT PLATING Au WIRE SOFT SOLDER OR ADHESIVE (Pb/Sn) LEAD,STRUCTURE OF TSOP (LOC)
Au WIRE INNER LEAD SILVER SPOTPLATING
OUTER LEAD DIE PAD (Pb/Sn PLATING) CHIP Au WIRE INNER LEAD DIE PAD ADHESIVE, STRUCTURE OF BGA (OVERMOLD TYPE)CHIP
Au WIRE SUBSTRATE SOLDER BALL STRUCTURE OF BGA (CAVITY DOWN TYPE)LID
SOLDER BALLSUBSTRATE
WIRE SEALING RESIN,STRUCTURE OF BGA (M Flip–Chip BGA type) Under Development
Solder Ball Organic substrate Epoxy resinLSI ChipInner Bump on Electrode PadSTRUCTURE OF FBGA
Au wire Chip Epoxy resin Single layer substrate Solder ball Dielectric adhesive layer,STRUCTURE OF M-CSP(Mold Chip Scale Package)
Solder Ball Single layer substrate Inner BumpEpoxy resin on Electrode Pad LSI ChipSTRUCTURE OF HSSOP Epoxy Resin
Au Wire Inner Lead Chip Outer Lead(Cu Alloy) Die Pad Chip Epoxy Resin Die Pad]15
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