Download: MITSUBISHI INTEGRATED CIRCUIT PACKAGES
IC PACKAGE CLASSIFICATION The following pages classify Mitsubishi Packages by the sealing method and the mounting method. The conventions shown here are used throughout this DATA BOOK, so we suggest you take the time to review them. PLASTIC PACKAGES [Mounting Method] [ No. of ] [Type] [Outline]pinout side SIP (Single Inline Package) Single side HSIP (SIP with Heatsink) ZIP Through-hole (Zig-zag Inline Package) DIP (Dual Inline Package) SDIP (Shrink Dual Inline Package) SOP (Small Outline Package) SSOP (Shrink Small Dual sides Outline Package) TSOP (Thin Small Outline Package) SOJ Surface mou...
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IC PACKAGE CLASSIFICATION The following pages classify Mitsubishi Packages by the sealing method and the mounting method. The conventions shown here are used throughout this DATA BOOK, so we suggest you take the time to review them., PLASTIC PACKAGES [Mounting Method] [ No. of ] [Type] [Outline]pinout side
SIP
(Single Inline Package) Single side HSIP (SIP with Heatsink)ZIP
Through-hole (Zig-zag Inline Package)DIP
(Dual Inline Package)SDIP
(Shrink Dual Inline Package)SOP
(Small Outline Package)SSOP
(Shrink Small Dual sides Outline Package)TSOP
(Thin Small Outline Package)SOJ
Surface mount (Small Outline J-leaded package)QFP
(Quad Flat Package)LQFP
(Low profile Quadruple sides Quad Flat Package)TQFP
(Thin Quad Flat Package)QFJ
(Quad Flat J-leaded package), BGA PACKAGE [Mounting Method] [ No. of [Type] [Outline]pinout side ] Surface mount Bottom BGA(Ball Grid Array) BGA(Cavity Down Type) FBGA(Fine pitch BGA) M-CSP(Mold- TCP PACKAGE Chip Scale Package)QTP
Surface mount Quadruple sides (Quad Tape carrier Package), METAL-SEALED PACKAGES [Mounting Method] [ No. of ] [Type] [Outline]pinout sides DIP TYPE PIGGY BACK Through-hole Bottom PGA (Pin Grid Array) QFP TYPEQFN
Surface mount Quadruple sides (Quad Flat Non-leaded package) PIGGY BACKMODULES
Plug-in]15
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