Download: INTEGRATED CIRCUITS DATA SHEET TDA6800 TDA6800T Video modulator circuit Product specification March 1986 File under Integrated Circuits, IC02

INTEGRATED CIRCUITS DATA SHEET TDA6800 TDA6800T Video modulator circuit Product specification March 1986 File under Integrated Circuits, IC02 GENERAL DESCRIPTION The TDA6800 is a modulator circuit for modulation of video signals on a VHF/UHF carrier. The circuit requiresa5Vpower supply and few external components for the negative modulation mode. For positive modulation an external clamp circuit is required. This circuit can be used as a general purpose modulator without additional external components. Features • Balanced modulator • Symmetrical oscillator • Video clamp circuit for negative mo...
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INTEGRATED CIRCUITS

DATA SHEET TDA6800 TDA6800T Video modulator circuit

Product specification March 1986 File under Integrated Circuits, IC02, GENERAL DESCRIPTION The TDA6800 is a modulator circuit for modulation of video signals on a VHF/UHF carrier. The circuit requiresa5Vpower supply and few external components for the negative modulation mode. For positive modulation an external clamp circuit is required. This circuit can be used as a general purpose modulator without additional external components. Features • Balanced modulator • Symmetrical oscillator • Video clamp circuit for negative modulation • Frequency range 50 to 800 MHz QUICK REFERENCE DATA MIN. TYP. MAX. Supply voltage range V5−4 4,5 − 5,5 V Supply current consumption I5 − 9 − mA Video input voltage V8(p−p) − 1 − V Input impedance R8 30 − − kΩ Output voltage (50 MHz) V6-7 − 13 − mV Output voltage (600 MHz) V6-7 − 10 − mV Differential gain ∆G − − 10 % Differential phase ∆φ − − 10 deg. Intermodulation distortion dint − −80 − dB PACKAGE OUTLINE TDA6800 : 8-lead dual in-line; plastic (SOT97A); SOT 97-1; 1996 november 29. TDA6800T: 8-lead mini-pack; plastic (SO8; SOT96A); SOT 96-1; 1996 november 29. March 1986 2,

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage V5−4 max. 7 V Input voltage V8−4 max. 4 V Output voltage V6, 7−4 max. 9 V Storage temperature Tstg max. 125 °C Junction temperature Tj max. 125 °C Operating ambient temperature range Tamb −25 to + 85 °C THERMAL RESISTANCE From junction to ambient in free air TDA6800T Rth j−a 260 K/W TDA6800 Rth j−a 120 K/W Fig.1 Block diagram TDA6800 and TDA6800T. March 1986 3,

CHARACTERISTICS

VP = 5 V; Tamb = 25 °C; measured in Fig.1; unless otherwise specified PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage range V5-4 4,5 − 5,5 V Supply current consumption I5 − 9 13 mA Video input voltage V8(p-p) − 1 − V Input impedance R8 30 − − kΩ Voltage (d.c.) at video input (clamp voltage) V8 − 1,4 − V Voltage (d.c.) at sound input V1 − 2,5 − V Output voltage f = 50 MHz; RL = 75 Ω V6-7 − 13 − mV Output voltage f = 600 MHz; RL = 75 Ω V6-7 − 10 − mV Differential gain ∆G − − 10 % Differential phase ∆φ − − 10 deg. Intermodulation (1,1 MHz) (note 1) − −80 −60 dB Frequency shift Vb = 5%, f = 600 MHz ∆f − − 100 kHz Frequency shift Vb = 5%, f = 800 MHz ∆f − tbf − kHz Frequency drift 25 to 40 °C ∆f − − 100 kHz Frequency drift 15 to 55 °C ∆f − − 300 kHz Positive modulation (see Fig.3) Residual carrier voltage Vr − − 2,5 % Cross modulation (note 2) α − 0,1 0,25 % Notes 1. Input signal: d.c. 0,45 V (V8-4 = 1,85 V) 4,4 MHz; input voltage (p-p) = 0,6 V 5,5 MHz; input voltage (p-p) = 1,26 V measured with respect to picture carrier, at f = 600 MHz. 2. Input signal: d.c. 1 V (V8-4 = 3,5 V) 5,5 MHz AM modulated, fm = 100 kHz m = 0,8; input voltage (p-p) = 2,27 V (including modulation) measured with respect to the picture carrier, at f = 600 MHz. March 1986 4, * Close to output transformer. Fig.2 Application for negative modulation. * Close to output transformer Fig.3 Application for positive modulation. March 1986 5, * Close to output transformer. Fig.4 Application for general purpose modulation. March 1986 6,

PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

D ME A2ALA1cZwMb1 e (e 1 )

MH

b b285pin 1 index

E

140510 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) (1) UNITAA1A2(1) (1) Zmax. min. max. b b1 b2cDEee1 L ME MH w max. mm 1.73 0.53 1.07 0.36 9.8 6.48 3.60 8.25 10.04.2 0.51 3.2 1.14 0.38 0.89 0.23 9.2 6.20 2.54 7.62 3.05 7.80 8.3 0.254 1.15 inches 0.068 0.021 0.042 0.014 0.39 0.26 0.14 0.32 0.390.17 0.020 0.13 0.045 0.015 0.035 0.009 0.36 0.24 0.10 0.30 0.12 0.31 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION ISSUE DATE IEC JEDEC EIAJ PROJECTION 92-11-17 SOT97-1 050G01 MO-001AN 95-02-04

March 1986 7

seating plane,

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

DEA

X

c y HEvMA

Z

8 5

Q

A2 A (A 3 ) A1 pin 1 index θ Lp14LewMdetail X bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNITAAAbcD(1) E(2)max. 123peHE L LpQvwyZ(1) θ mm 0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.71.75 1.270.10 1.25 0.25 0.36 0.19 4.8 3.8 5.8 1.05 0.4 0.6 0.25 0.25 0.1 0.3 8o o 0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0 inches 0.069 0.0500.004 0.049 0.01 0.014 0.0075 0.19 0.15 0.228 0.041 0.016 0.024 0.01 0.01 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION ISSUE DATE IEC JEDEC EIAJ PROJECTION 95-02-04 SOT96-1 076E03S MS-012AA 97-05-22

March 1986 8

, SOLDERING method. Typical reflow temperatures range from 215 to 250 °C. Introduction Preheating is necessary to dry the paste and evaporate There is no soldering method that is ideal for all IC the binding agent. Preheating duration: 45 minutes at packages. Wave soldering is often preferred when 45 °C. through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is WAVE SOLDERING not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these Wave soldering techniques can be used for all SO situations reflow soldering is often used. packages if the following conditions are observed: This text gives a very brief insight to a complex technology. • A double-wave (a turbulent wave with high upward A more in-depth account of soldering ICs can be found in pressure followed by a smooth laminar wave) soldering our “IC Package Databook” (order code 9398 652 90011). technique should be used. • The longitudinal axis of the package footprint must be DIP parallel to the solder flow. SOLDERING BY DIPPING OR BY WAVE • The package footprint must incorporate solder thieves at the downstream end. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact During placement and before soldering, the package must with the joint for more than 5 seconds. The total contact be fixed with a droplet of adhesive. The adhesive can be time of successive solder waves must not exceed applied by screen printing, pin transfer or syringe 5 seconds. dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the Maximum permissible solder temperature is 260 °C, and specified maximum storage temperature (T maximum duration of package immersion in solder isstg max). If the printed-circuit board has been pre-heated, forced cooling 10 seconds, if cooled to less than 150 °C within may be necessary immediately after soldering to keep the 6 seconds. Typical dwell time is 4 seconds at 250 °C. temperature within the permissible limit. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the REPAIRING SOLDERED JOINTS lead(s) of the package, below the seating plane or not Fix the component by first soldering two diagonally- more than 2 mm above it. If the temperature of the opposite end leads. Use only a low voltage soldering iron soldering iron bit is less than 300 °C it may remain in (less than 24 V) applied to the flat part of the lead. Contact contact for up to 10 seconds. If the bit temperature is time must be limited to 10 seconds at up to 300 °C. When between 300 and 400 °C, contact may be up to 5 seconds. using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between SO 270 and 320 °C. REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating March 1986 9,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1986 10]
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