Download: INTEGRATED CIRCUITS DATA SHEET TDA8722 I2C-bus programmable modulator for negative video modulation and FM sound Product specification 1998 Jun 23 Supersedes data of 1995 Mar 21

INTEGRATED CIRCUITS

DATA SHEET TDA8722 I2C-bus programmable modulator

for negative video modulation and

FM sound

Product specification 1998 Jun 23 Supersedes data of 1995 Mar 21 File under Integrated Circuits, IC02,

FEATURES

• Video amplifier with clamp and white clip circuits • FM sound modulator • Asymmetrical and symmetrical RF outputs available • Symmetrical RF oscillator using only a few external components GENERAL DESCRIPTION • External adjusting of modulation depth and level of the The TDA8722 is a programmable modulator which sound subcarrier generates an RF TV channel from a baseband video • I2C-bus receiver for frequency setting and test-mode signal and a baseband audio signal in the event of selection negative video and FM sound standards (PAL B/G, I, D/K • One I2C programmable output port and NTSC). • On-chip Phase-Locked Loop (PLL) frequency It is especially suited for satellite receivers, video synthesizer recorders and cable converters. The video carrier • On-chip power supply regulator frequency is set exactly to the correct channel frequency by a PLL synthesizer which is programmed in accordance • Bus switchable oscillator with the I2C-bus format. • On-chip Test Pattern Signal Generator (TPSG).

APPLICATIONS

• Video recorders • Cable converters • Satellite receivers. ORDERING INFORMATION TYPE PACKAGE NUMBER NAME DESCRIPTION VERSION TDA8722T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 TDA8722M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 1998 Jun 23 2, QUICK REFERENCE DATA VDDA = VDDD = 5 V; Tamb = 25 °C after the IC has reached thermal equilibrium; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDDA analog supply voltage 4.5 5.0 5.5 V VDDD digital supply voltage 4.5 5.0 5.5 V IDD total supply current normal mode 41 52 63 mA ∆m typical modulation depth range video level (pin 19) = 0.5 V (p-p); 65 − 90 % note 1; see Fig.10 ∆P/S typical picture-to-sound level note 2; see Fig.11 −18 − −10 dB range VRF RF output voltage level frequency between 77 80 83 dBµV asymmetrical on a 75 Ω load 471.25 and 855.25 MHz δf FM deviation on audio fi = 400 Hz; V1 = 0.5 V (RMS); 20 25 30 kHz subcarrier before pre-emphasis filter Notes 1. Value depends on value of resistor R17 (see Fig.7). 2. Value depends on value of capacitor C17 (see Fig.7). 1998 Jun 23 3, BLOCK DIAGRAM handbook, full pagewidth VIDEO ADJUST AGND VDDA RFA RFB 19 17 18 20 16 15 TDA8722 ASYMMETRICALCLAMP VOLTAGE OUTPUT REGULATOR BUFFER VIDEO AMP

CLIP AUDIO TPSG

2 SWITCH

MIXER

SOSCA AUDIO 3 FM MODULATOR

SOSCB

TPSG on PC balance test

UOSCA

13 PRESCALER UHF 5 SDA (8) OSCILLATOR OGNDI2C-BUS 12-BIT

UOSCB DIVIDER

12 RECEIVER (N) SCL 10 bits enable/ RF oscillator on 14 8 P0 select f CPDIV PHASE CHARGE 7 LOGIC AMPDETECTOR PUMP AMP f ref enable DIVIDER 4 MHz 9 31.25 kHz (M = 128) OSCILLATOR

XTAL

11 10 V MBE401DDD DGND Fig.1 Block diagram. 1998 Jun 23 4,

PINNING

SYMBOL PIN DESCRIPTION AUDIO 1 audio input SOSCA 2 sound oscillator A SOSCB 3 sound oscillator B UOSCB 4 UHF oscillator B handbook, halfpage AUDIO 1 20 VDDA OGND 5 RF oscillator ground SOSCA 2 19 VIDEO UOSCA 6 UHF oscillator A AMP 7 tuning amplifier output SOSCB 3 18 AGND CP 8 charge pump output UOSCB 4 17 ADJUST XTAL 9 crystal oscillator OGND 5 16 RFA TDA8722 DGND 10 digital ground UOSCA 6 15 RFB VDDD 11 digital supply voltage AMP 7 14 P0 SCL 12 serial clock input (I2C-bus) CP 8 13 SDA SDA 13 serial data input (I2C-bus) XTAL 9 12 SCL P0 14 NPN open-collector output Port

V

RFB 15 asymmetrical RF output B DGND 10 11 DDD RFA 16 asymmetrical RF output A MBE394 ADJUST 17 modulation depth and picture-to-sound distance adjustment pin AGND 18 analog ground VIDEO 19 video input Fig.2 Pin configuration. VDDA 20 analog supply voltage FUNCTIONAL DESCRIPTION and ground (R17). The value can change between 47 kΩ and infinite (R17 removed); see Fig.10. The TDA8722 is a programmable modulator which can be divided into two main blocks: The video part also contains a test pattern signal generator • A modulator for negative video modulation and to simplify the adjustment of the receiving channel of the FM sound TV standards TV set to the required channel of the modulator. The pattern consists of a synchronization pulse and two • A programmable PLL frequency synthesizer. vertical white bars on screen (see Fig.3). The video part of the modulator consists of a clamping The audio part of the modulator contains an FM sound circuit which sets the internal reference voltage to the modulator. The frequency of the sound subcarrier is set in bottom of the synchronizing pulse, followed by a white clip the application by external components (C3, L3 and R3). which avoids over modulation in case the video signal is The difference between the video carrier level and the too strong. Typically, the IC starts to clip the video signal sound subcarrier level is adjusted in the application by when the voltage at the video input (pin 19) is changing the value of the capacitor between pin 17 and >560 mV (p-p) while the normal voltage at the video input ground (C17). The value can change between is 500 mV (p-p). This clipping function ensures that the 0 and 47 pF. The distance between the video carrier and video modulation depth is not too high. The modulation the sound subcarrier can be adjusted between at least depth is adjusted in the application between at least −10 and −18 dB (see Fig.11). 65 and 90% by changing the resistor value between pin 17 1998 Jun 23 5, To bias the audio input it is necessary to put a resistor in N is a 12-bit dividing number (10 bits are programmable the application between pin 1 and ground. The resistor by the I2C-bus). has a typical value of 12 kΩ. fref is the crystal frequency (4 MHz) divided by 128 The RF part of the oscillator consists of: (31.25 kHz). • An oscillator which operates at the required video The circuit allows a step of 250 kHz but because only carrier frequency. The range of the oscillator is 10 bits are programmable, the programming steps are determined in the application by C5, C6, L5 and D5. 1 MHz. • An RF mixer. It first combines the video signal and the When the PLL loop is locked, both inputs of the phase sound subcarrier to build a baseband TV channel. comparator are equal, which gives equation: Then the baseband signal is mixed with the oscillator fosc fxtal signal to get the RF TV channel. The mixer has two fDIV = -×- = - = f8N128 ref outputs which can be used as two independent asymmetrical outputs, or as one symmetrical output. In During the test mode operation, fDIV and fref can be the event of asymmetrical use, the unused output must monitored on the output Port pin (pin 14). be loaded with a 75 Ω resistor (see Fig.7). Software information The oscillator frequency is set by a programmable PLL frequency synthesizer in accordance with equation: The synthesizer is controlled via a two-wire I2C-bus receiver. For programming, the address byte (C8 HEX) fosc = 8 × N × fref has to be sent first. Then one or two data bytes are used Where: to set the 10 programmable bits of the dividing number N, the test bits (see Table 1) and the output Port state. Note fosc is the local oscillator frequency. that after power-up of the IC, the two data bytes must be sent. handbook, full pagewidth MBE395 0 10 20 30 40 50 60 70 t (µs) 64 Fig.3 Test pattern signal. 1998 Jun 23 6, Table 1 Data format; notes 1 and 2 BIT 7 BIT 0 BYTE BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 ACKNOWLEDGE BIT MSB LSB Address byte C811001000ACK Data byte10b11 b10 b9 b8 b7 b6 b5 ACK Data byte21T0(3) T1(3) T2(3) P0(4) b4 b3 b2 ACK Notes 1. The 10 programmable bits of N are: b2 to b11. 2. Internal hardware sets: b1 = 0 and b0 = 1. 3. T0, T1 and T2 are bits used for test purposes (see Table 5). 4. P0 is a bit used for controlling the state of the output Port (see Table 6). Table 2 Structure of the dividing number N BITS(1)

RESULT

b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1(2) b0(2) Frequency (MHz)(3) 512 256 128 64 32 1684210.5 0.25 Notes 1. Bits b2 to b11 are programmable and represent the integer part of the frequency in MHz. Bits b1 and b0 are fixed internally to b1 = 0 and b0 = 1 to get the added 0.25 MHz, common for most TV channels. 2. Bits b1 and b0 are not programmable. 3. fosc = 512b11 + 256b10 + 128b9 + 64b8 + 32b7 + 16b6 + 8b5 + 4b4 + 2b3 + b2 + 0.25 (MHz). Table 3 Dividing number N for programming channel 21 (471.25 MHz)

BITS RESULT

b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1(1) b0(1) Value011101011101Frequency (MHz)(2) 0 256 128 64 0 16042100.25 Notes 1. Bits b1 and b0 are not programmable. 2. fosc = 0 + 256 + 128 + 64 + 0 + 16 + 0 + 4 + 2 + 1 + 0.25 (MHz) = 471.25 MHz. Table 4 Content of the data bytes to program channel 21 (471.25 MHz) BIT 7 BIT 0 BYTE BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 ACKNOWLEDGE BIT MSB LSB Address byte C811001000ACK Data byte100111010ACK Data byte210000111ACK It is possible to change only one data byte. The circuit will recognize which one is received with the value of MSB (0 for data byte 1 and 1 for data byte 2). It is possible to change the frequency by 1 MHz with data byte 2. It is easy to increment the channel frequency when its frequency width is 8 MHz by simply incrementing data byte 1. 1998 Jun 23 7, The bits T0 to T2 are available for test purposes and the possibilities are shown in Table 5. Table 5 Test modes T0 T1 T2 OPERATIONAL MODE000normal operation001Test Pattern Signal Generator (TPSG) on; note1010RF oscillator off; note2011balance test; note3100fref out (if p0 = 0); note4101high-impedance test; note5110fDIV out (if p0 = 0); note4111phase detector disabled; baseband signals on RF outputs; note 6 Notes 1. In ‘TPSG on’ mode the video carrier is modulated by the test signal consisting of a synchronization pulse and two vertical white bars on a black screen. This mode should be selected to adjust the TV set receiving the modulated signal to the right frequency. 2. In ‘RF oscillator off’ mode, the RF oscillator and the RF mixer are switched-off and there is no RF carrier coming out of the device. This mode can be selected to avoid RF radiation to other parts when the modulator output is not used. 3. In ‘balance test’, the video carrier is over modulated. This simplifies residual carrier measurements. 4. In ‘fref’ and ‘fDIV’ modes, the reference frequency fref in the phase comparator or the divided RF oscillator frequency fDIV is available on the output Port pin. This mode requires that bit P0 = 0. 5. The ‘high-impedance test’ mode may be used to inject an external tuning voltage to the RF tank circuit, to test the oscillator. In this mode, the phase detector is disabled and the external transistor of the tuning amplifier is switched-off. The AMP output (pin 7) is LOW (<200 mV). 6. In the ‘phase detector disabled’ mode, it is possible to measure the leakage current at the input of the tuning amplifier, on the CP pin. In this mode the RF oscillator is off, and the baseband TV channel signal is present on the RF outputs for testing the audio and video parts. The possibilities of bit P0, which controls the output Port Table 6 Output Port programming (pin 14) are given in Table 6. P0 OUTPUT PORT STATE The Port is an NPN open-collector type. For monitoring the 0 off; high impedance fref or fDIV frequency on the output Port, the P0 bit must be logic 0 to let the output Port free. 1 on; sinking current 1998 Jun 23 8, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VDDA analog supply voltage −0.3 +6 V VDDD digital supply voltage −0.3 +6 V VDD operating supply voltage 4.5 5.5 V Vmax maximum voltage on all pins −0.3 VDD V Tstg IC storage temperature −40 +125 °C Tamb operating ambient temperature −20 +85 °C

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits. Every pin withstands the ESD test in accordance with “MIL-STD-883C category B” (2000 V). Every pin withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM) 0 Ω, 200 pF (200 V). THERMAL RESISTANCE SYMBOL PARAMETER VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air SO20; SOT163-1 85 K/W SSOP20; SOT266-1 120 K/W 1998 Jun 23 9,

CHARACTERISTICS

VDDA = VDDD = 5 V; Tamb = 25 °C; valid over the whole UHF band; measured in circuit of Fig.7; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply IDD supply current normal mode 41 52 63 mA RF off test mode 30 38 46 mA Video characteristics I19 input current (AC) V19 = 3.2 V − 0.5 2.0 µA z19 video input impedance V19 = 3.2 V 30 − − kΩ m modulation depth V19 = 500 mV (p-p) EBU 77 82 87 % colour bars; R17 = 120 kΩ; see Fig.7 during clipping condition; 85 − 98 % note 1 TPSG mode; 72 82 92 % R17 = 120 kΩ balance test mode; 110 − − % R17 = 120 kΩ ∆m modulation depth range V19 = 500 mV (p-p) EBU 65 − 90 % colour bars; 47 kΩ ≤ R17 ≤ ∞ ∆mAPL variation of modulation depth with referenced to the value for −2 − +2 % change of APL between 10 and 90% APL = 50%; V19 = 500 mV (p-p) Vclip(p-p) video input level where clipping starts video level on pin 19; − 0.56 − V (peak-to-peak value) note 2 S/N video video signal-to-noise ratio fRF < 700 MHz; note 3 48 52 − dB fRF > 700 MHz; note 3 46 50 − dB Gdiff differential gain note 4 −8 − +8 % φdiff differential phase note 4 −8 − +8 deg V/S video-to-sync ratio V19 = 500 mV (p-p); 6.9/3.1 7/3 7.1/2.9 V/S = 7/3 fvideo frequency response for the video signal note 5 −1 − +1 dB Audio characteristics (for PAL G standard; audio subcarrier at 5.5 MHz) Z1 audio input impedance 30 − − kΩ δm modulation deviation f1 = 400 Hz; 20 25 30 kHz V1 = 0.5 V (RMS) before pre-emphasis filter δmmax maximum modulation deviation f1 = 400 Hz; 60 85 − kHz V1 = 2.0 V (RMS) before pre-emphasis filter THD total harmonic distortion f1 = 1 kHz; − 0.4 1.5 % V1 = 0.5 V (RMS) before pre-emphasis filter 1998 Jun 23 10, SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT S/N audio audio signal-to-noise ratio note 6 45 50 − dB faudio frequency response of the audio signal note 7 −1 − +1 dB P/S picture-to-sound ratio no audio signal; −16 −13 −10 dB FM = 5.5 MHz; C17 = 15 pF ∆P/S picture-to-sound ratio range no audio signal; −18 − −10 dB FM = 5.5 MHz; 0 pF ≤ C17 ≤ 39 pF Channel characteristics fRF RF frequency range using tank circuit of Fig.7 471.25 − 855.25 MHz VRF output level on RFA and RFB asymmetrical output 77 80 83 dBµV loaded with 75 Ω; f = 471.25 to 855.25 MHz ∆VRF difference between the level of measurement is made012dB modulated carrier and the level of the during synchronization unmodulated carrier pulse for the modulated carrier SPO spurious outside channel note 8 − −62 − dBc RFsh RF second harmonic level on fRF = 471.25 MHz − −30 −25 dBc asymmetrical output fRF = 855.25 MHz − −20 −15 dBc SCsh sound carrier second harmonic level fs = 5.5 MHz; − −65 −60 dBc C17 = 15 pF; fRF < 700 MHz fs = 5.5 MHz; − −63 −58 dBc C17 = 15 pF; fRF > 700 MHz SCth sound carrier third harmonic level fs = 5.5 MHz; C17 = 15 pF − −65 −60 dBc video signal harmonics note 9 − −60 −55 dBc fref reference frequency spurious fp + 31.25 kHz − −65 −60 dBc IM chrominance beat note 10 − −65 −60 dBc Charge pump output (CP) I8 output current − ±100 − µA V7 output voltage in lock 1.5 − 2.5 V IOZ OFF-state leakage current VCP = 2 V; T0 = 1; T1 = 1; − − 10 nA T2 = 1 Amplifier output (AMP) G amplifier current gain VCP = 2 V; IAMP = 10 µA − 4000 − V7sat output saturation voltage VCP = 0 V; T0 = 1; T1 = 0; − 140 200 mV T2 = 1 Crystal oscillator characteristics (XTAL) Z9 oscillator input impedance − − −500 Ω 1998 Jun 23 11, SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Output Port characteristics (P0) VOL LOW level output voltage P0 = 1; I14 = 5 mA − 150 400 mV IOZ OFF-state leakage current P0 = 0; VDD = 5.5 V − − 10 µA I14(max) maximum Port current P0 = 1 − − 10 mA I2C-bus receiver characteristics (SDA and SCL) VIH HIGH level input voltage 3 − 5.5 V VIL LOW level input voltage 0 − 1.5 V IIH HIGH level input current VIH = 5 V; VDD = 0 or5V− − 10 µA IIL LOW level input current VIL = 0 V; VDD = 0 or5V−10 − − µA Vo output voltage on SDA during acknowledge − − 0.4 V pulse; IIL = 3 mA Notes 1. Modulation depth when the video signal is between 560 and 1000 mV (peak-to-peak value) at pin 19. R17 = 120 kΩ in the application. 2. For application information only. 3. Ratio between the CCIR 17 line bar amplitude (corresponding to the level difference between black and white; see Fig.4 and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after demodulation for PAL G standard. Measurement is unweighted, done between 200 kHz and 5 MHz. 4. Measured for PAL G standard on 4 first steps of CCIR 330 line, corresponding toa5step staircase with 300 mV (peak-to-peak value) chrominance carrier when the level between synchronization pulse and white is 1 V; see Fig.5. 5. Measured with a spectrum analyzer with ‘peak hold’ function, applying a 500 mV (peak-to-peak value) sine wave at the video input of the IC, with a frequency of 0.5, 2.0, 4.0 and 4.8 MHz. The reference is the value measured for 1.0 MHz. 6. Measured using CCIR 468-3 weighting filter and quasi-peak detection, with an audio frequency of 1 kHz and a deviation of 50 kHz. Video signal is EBU colour bars of 500 mV (peak-to-peak value) on pin 19. 7. Measured in PAL G standard with no pre-emphasis on the audio input and no de-emphasis in the receiver. Audio input level is adjusted for having a deviation of 25 kHz at 1 kHz audio frequency. Measurement is done for frequencies between 50 Hz and 15 kHz, reference is the level measured for 1 kHz. 8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator frequency and the sound oscillator frequency (fRF + 2fs, 2fRF + fs, etc.). This measurement includes the spurious at the 1⁄4f , 1RF ⁄2fRF and 3⁄4fRF. 9. Corresponding to the harmonics of the video signal. Measured by puttinga1MHz sine wave of 500 mV (peak-to-peak value) at the video input (pin 19) and checking the level at fRF + 2 MHz, fRF + 3 MHz, etc. 10. Measured with a 4.43 MHz sine wave of 350 mV (peak-to-peak value) at the video input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 1.07 MHz. C17 = 15 pF in the application diagram of Fig.7. 1998 Jun 23 12, handbook, full pagewidth MBE3961V0.3V0V010 20 30 40 50 60 70 t (µs) 64 Fig.4 CCIR insertion line N.17. handbook, full pagewidth MBE3971V0.3V0V010 20 30 40 50 60 70 t (µs) 64 Fig.5 CCIR insertion line N.330. 1998 Jun 23 13, INTERNAL PIN CONFIGURATION handbook, full pagewidth VOLTAGE 20 V REGULATOR DDA

AUDIO VIDEO SOSCA AGND SOSCB

4 ADJUST

UOSCB RFA

5 15 OGND RFB UOSCA 14

AMP SDA CP XTAL SCL DGND

11 VDDD MBE402 ESD protection components are not shown in the diagram. Fig.6 Pin equivalent circuit for each pin. 1998 Jun 23 14, APPLICATION INFORMATION handbook, full pagewidthR20 100 nF RF VIDEO 470 Ω C19 75 Ω R18 R19 R15 Ω PORT82 470 Ω 75Ω1kΩ 100 pF 100 pF R14 15 pF R17 C16 C15 100 nF Ω SCLC17 120 k C20 SDA 20 19 18 17 16 15 14 13 12 11 Q9 10 nF 4 MHz TDA8722 C11 27 pF12345678910 C9 L5(2) 150 nF K1(1) 33 pF 33 pF C8C3 C5 C6 D5 R8 56 pF 12 kΩ AUDIO C1 R3 BB215 R9 33 V 220 pF 15 kΩ R5 R6 22 kΩΩ Ω R1 (3) 22 k 22 k L35VR7 220 kΩ 15 µH 12 kΩ C30 C31 C21 R4 R2 10 nF 10 nF 2.2 µF 2.2 µF 220 Ω 12 kΩ C7 T8 K2(4) BC547B

GND

MBE403 (1) K1: switches the pre-emphasis filter on or off. (2) L5: air coil; 1.5 turns; diameter of 2 mm. (3) L3: to adjust the application to the right sound carrier frequency (5.5 MHz for PAL G). (4) K2: Switches the FM sound oscillator on or off. Fig.7 Reference measuring set-up. 1998 Jun 23 15, Application design handbook, full pagewidth RF R20 100 nF VIDEO 75 Ω470 Ω C19 R15 75 Ω R18 R19 82 Ω 470 Ω PORT 100 kΩ 82 kΩ RV1 (1) 100 pF 100 pFR17 C16 C15 SCL 100 nF 15 pF

SDA

C20 C175V20 19 18 17 16 15 14 13 12 11 Q9 TDA8722 10 nF 4 MHz C11 27 pF12345678910 C9 L5 150 nF 33 pF 33 pF C8 C3 C5 C6 D5 R8 56 pF 12 kΩ AUDIO C1 R3 BB215 R9 33 V 220 pF 15 kΩ R5 R6 22 kΩ 22 kΩ 22 kΩ R1 L3 R7 220 kΩ 15 µH 12 kΩ C30 R2 10 nF 10 nF 12 kΩ C7 T8 BC547B

GND

MBE405 (1) RV1 allows fine adjustment of the modulation depth between 70 and 90%. Fig.8 Application using an asymmetrical output. 1998 Jun 23 16, handbook, full pagewidth RF 75 Ω R20 100 nF VIDEO 470 Ω C1964TOKO - B4F TR1 617DB - 1010R18 R19 82 Ω 470Ω123

PORT

R17 100 nF R15120 kΩ SCL C17 300 Ω C20 100 pF 100 pF SDA 15 pF C16 C155V20 19 18 17 16 15 14 13 12 11 Q9 10 nF TDA8722 4 MHz C1112345678910 27 pF C9 150 nF L5 C3 C8 33 pF 33 pF 56 pF R8 AUDIO C1 C5 C6R3 D5 12 kΩ R9 220 pF 15 kΩ 33 VBB215 R1 R6 22 kΩ L3 R5 22 kΩ 220 kΩ 22 kΩ R7 R2 15 µH 10 nF 12 kΩ 12 kΩ C30C7 T8 10 nF BC547B

GND

MBE404 Fig.9 Application using a symmetrical output with a balun transformer. In the design of the application, it is highly recommended similar as possible to the load connected to the used pin, to separate the part of the RF oscillator as much as see Fig.8. possible from the part of the RF outputs in order to avoid A good improvement in performance is obtained using a parasitic coupling between these two parts. 1 : 4 symmetrical to asymmetrical transformer A good solution is shielding the RF oscillator part to avoid (balun; balance-to-unbalance) connected between the radiation from and to this part. The pin 5 (OGND) must be two outputs. In this event both outputs have their loads connected to the shielding box and to ground. matched. The level of the RF second harmonic, and the spurious outside channel is decreasing. The parasitic RF outputs coupling between RF outputs and RF oscillator is also reduced (see Fig.9). For inexpensive applications, it is possible to use the IC with an asymmetrical output (pins 15 or 16). In this event, the unused output pin must be loaded with a load as 1998 Jun 23 17, Modulation depth Table 7 Value of resistor for several Q factor ranges With 500 mV (peak-to-peak value) video input signal, the COIL QUALITY PROPOSED VALUE FOR R3 wanted modulation depth must be set by the value of R17 FACTOR (kΩ) (resistor between pin 17 and ground) as shown Fig.10. For 30 to 40 82 to 33 a good accuracy, it is recommended to use a 1% type resistor. 40 to 50 33 to 27 50 to 60 27 to 22 It is also possible to use an adjustable resistor, see Fig.8. 60 to 80 22 to 18 Depending on the layout of the PCB, it may be necessary 80 to >100 18 to 15 to slightly change the value of R17 from the one given in Fig.10 to get the wanted modulation depth. The use of a coil with a quality factor <30 may result in a Sound oscillator design non operating oscillator. For safety, it is recommended to use a coil with a quality factor ≥50. The frequency of the sound subcarrier is fixed by the tank circuit connected between pins 2 and 3. This frequency Picture-to-sound ratio can be adjusted between 4.5 and 6.5 MHz covering all existing standards in the world. The picture-to-sound ratio can be adjusted in the application by changing the value of C17 (capacitor The damping resistor R3 between pins 2 and 3 is between pin 17 and ground); see Fig.11. necessary to decrease the quality factor of the tank circuit allowing the frequency to be modulated by the audio Figure 11 shows us that the picture-to-sound ratio will signal. The value of this resistor is calculated for several change for a constant value of C17 when the sound Q factor ranges of the coil for a sound frequency of subcarrier frequency will change. 5.5 MHz (see Table 7). RF harmonics This IC has been designed to have the lowest level of unwanted RF harmonics at the frequencies where these are the hardest to be filtered out, especially for the second MBE398 harmonic of the RF carrier at the lowest frequencies of the handbook, halfpage UHF band. modulation depth The level of the second and third RF harmonic is shown in (%) Fig.12 for an asymmetrical application. This chart gives a 90 typical value while the level of these harmonics can vary depending on the design of the application. It is possible to reduce the level of the second harmonic by using a wide band transformer at the output of the IC and create a symmetrical application (see Fig.9). 70 To reduce the out-of-band harmonics and especially the third one, it is necessary to use a low-pass filter at the output of the IC. 10 102 3R17 (kΩ) 10 Fig.10 Typical modulation depth as a function of the value of R17. 1998 Jun 23 18, MBE399 MBE400 handbook, halfpage 14handbook, halfpage

RF

P/S harmonics (dB) (dBc) third harmonic (1) (2) 26 (3) (4) second harmonic 20 30 0 10 20 30 40 450 550 650 750 850 C17 (pF) Ω RF (MHz)R17 = 120 k . (1) 4.5 MHz. (2) 5.5 MHz. (3) 6.0 MHz. (4) 6.5 MHz. Fig.11 Typical picture-to-sound ratio as a function Fig.12 Typical level of RF harmonics for an of the value of C17. asymmetrical application. VHF operation The input impedance on pin 17 is approximately 3500 Ω, the incoming signal must be capacitive coupled, the This IC can operate on frequencies as low as 200 MHz resistor R17 between pin 17 and ground must remain to (and especially for VHF 3 band) provided the impedance adjust the modulation depth, the capacitor C17 between of the tuned circuit between pins 4 and 6 is >1 kΩ. pin 17 and ground may be changed depending on the capacitance brought on by the incoming network. If this NICAM and stereo capacitance is large, it is possible to remove C17. Because of the fact that the ADJUST pin (pin 17) is an Figure 13 shows a possible application for injecting such access point to the RF mixer, it is possible to use this pin kind of signal into the modulator IC. to inject an external modulated subcarrier into the IC. Following this application, to get a picture-to-second This is especially interesting when it is necessary to sound carrier ratio of −20 dB, it is necessary to apply a transmit a second frequency modulated audio subcarrier level of approximately 800 mV (peak-to-peak value) at for stereo sound (f = 5.72 MHz) or a NICAM QPSK the second carrier input, when the picture-to-first sound modulated carrier for digital audio transmission carrier ratio is approximately −13 dB. (f = 5.85 or 6.552 MHz). In addition, the internal FM sound modulator can be The incoming signal must be externally modulated either switched off by short-circuiting pins 2 and 3. in FM with the desired signal corresponding to PAL B/G specification for stereo sound transmission, or in QPSK in accordance with the NICAM transmission system. 1998 Jun 23 19, RF 75 Ω handbook, full pagewidth R15 75 Ω

SECOND

CARRIER R21 10 pF 10 kΩ C21 R20 100 nF VIDEO R17470 Ω C19 120 kΩ 100 pF 100 pF C16 C15 R18 R19 82 Ω 470 Ω C17

PORT

100 nF C20 20 19 18 17 16 15 14 TDA8722 MGC419 Fig.13 Possible application for a second sound subcarrier. 1998 Jun 23 20, PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1DEA

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1 10 detailXewMbp0510 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT (1) (1) (1)max. A1 A2 A3 bpcDEeHE L LpQvwyZθmm 2.65 0.30 2.45 0.49 0.32 13.0 7.6 10.65 1.1 1.1 0.9 0.10 2.25 0.25 0.36 0.23 12.6 7.4 1.27 10.00 1.4 0.4 1.0 0.25 0.25 0.1 0.4 8o o inches 0.10 0.012 0.096 0.019 0.013 0.51 0.30 0.419 0.043 0.043 0.035 0.004 0.089 0.01 0.014 0.009 0.49 0.29 0.050 0.394 0.055 0.016 0.039 0.01 0.01 0.004 0.016 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC EIAJ PROJECTION ISSUE DATE 95-01-24 SOT163-1 075E04 MS-013AC 97-05-22 1998 Jun 23 21, SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1DEA

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20 11

Q

A2 (A 3 ) A pin 1 index A1 θ Lp

L

1 10 detailXwMebp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

A

UNIT (1)max. A1 A2 A3 bpcDE(1) e HE L LpQvwyZ(1) θ mm 0.15 1.4 0.32 0.20 6.6 4.5 6.6 0.75 0.65 0.481.5 10o01.2 0.25 0.20 0.13 6.4 4.3 0.65 6.2 1.0 0.45 0.45 0.2 0.13 0.1 0.18 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION ISSUE DATE IEC JEDEC EIAJ PROJECTION 90-04-05 SOT266-1 95-02-25 1998 Jun 23 22, SOLDERING SSOP Introduction Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to There is no soldering method that is ideal for all IC closely-spaced leads and the possibility of incomplete packages. Wave soldering is often preferred when solder penetration in multi-lead devices. through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is If wave soldering cannot be avoided, the following not always suitable for surface mounted ICs, or for conditions must be observed: printed-circuits with high population densities. In these • A double-wave (a turbulent wave with high upward situations reflow soldering is often used. pressure followed by a smooth laminar wave) This text gives a very brief insight to a complex technology. soldering technique should be used. A more in-depth account of soldering ICs can be found in • The longitudinal axis of the package footprint must our “IC Package Databook” (order code 9398 652 90011). be parallel to the solder flow and must incorporate solder thieves at the downstream end. Reflow soldering Even with these conditions, only consider wave Reflow soldering techniques are suitable for all SO and soldering SSOP packages that have a body width of SSOP packages. 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or METHOD (SO AND SSOP) pressure-syringe dispensing before package placement. During placement and before soldering, the package must Several techniques exist for reflowing; for example, be fixed with a droplet of adhesive. The adhesive can be thermal conduction by heated belt. Dwell times vary applied by screen printing, pin transfer or syringe between 50 and 300 seconds depending on heating dispensing. The package can be soldered after the method. Typical reflow temperatures range from adhesive is cured. 215 to 250 °C. Maximum permissible solder temperature is 260 °C, and Preheating is necessary to dry the paste and evaporate maximum duration of package immersion in solder is the binding agent. Preheating duration: 45 minutes at 10 seconds, if cooled to less than 150 °C within 45 °C. 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal Wave soldering of corrosive residues in most applications.

SO

Repairing soldered joints Wave soldering techniques can be used for all SO Fix the component by first soldering two diagonally- packages if the following conditions are observed: opposite end leads. Use only a low voltage soldering iron • A double-wave (a turbulent wave with high upward (less than 24 V) applied to the flat part of the lead. Contact pressure followed by a smooth laminar wave) soldering time must be limited to 10 seconds at up to 300 °C. When technique should be used. using a dedicated tool, all other leads can be soldered in • The longitudinal axis of the package footprint must be one operation within 2 to 5 seconds between parallel to the solder flow. 270 and 320 °C. • The package footprint must incorporate solder thieves at the downstream end. 1998 Jun 23 23,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1998 Jun 23 24,

NOTES

1998 Jun 23 25,

NOTES

1998 Jun 23 26,

NOTES

1998 Jun 23 27,

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