Download: INTEGRATED CIRCUITS DATA SHEET TDA8725T Antenna signal processor Product specification 1995 Mar 21 File under Integrated Circuits, IC02 Philips Semiconductors

INTEGRATED CIRCUITS

DATA SHEET TDA8725T Antenna signal processor

Product specification 1995 Mar 21 File under Integrated Circuits, IC02 Philips Semiconductors, FEATURES For PIP applications, the antenna input signal is split and fed to the main TV tuner and the PIP tuner. Good signal • 75 Ω antenna input stage suppression between the two outputs enables good quality • 75 Ω VCR RF input stage of the main picture when the PIP tuner is in use. • 75 Ω VCR tuner output For VCR applications, the antenna input signal is split and • 75 Ω TV tuner output. then fed directly to the VCR tuner and the TV tuner after being combined with the VCR - RF signal. Good signal suppression between the two outputs enables good quality GENERAL DESCRIPTION pictures when the TV and VCR tuners are both operating. The TDA8725T has been designed to split and combine Good signal suppression between the VCR input and the RF signals for Picture-In-Picture (PIP) and VCR antenna input reduces the amount of unwanted signal on applications. the antenna. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage (pins 8 and 9) 4.75 5.0 5.25 V IP supply current (pins 8 and 9) − 65 − mA fi input frequency 40 − 860 MHz Gp power gain from antenna to VCR 3.5 5.0 6.5 dB from antenna to TV 4 5.5 7 dB from VCR − 0 − dB F noise figure 6.5 9.0 10 dB IP2 antenna linearity 2nd order at 40 MHz 137 140 − dBµV intercept point at 860 MHz 119 124 − dBµV IP3 antenna linearity 3rd order at 40 MHz 121 124 − dBµV intercept point at 860 MHz 108 111 − dBµV ssup signal suppression VCR input to antenna 0 to 1 GHz 32 37 − dB 1 to 3 GHz 25 30 − dB VCR output to TV output 0 to 300 MHz 35 40 − dB 300 to 860 MHz 22 27 − dB TV output to VCR output 0 to 300 MHz 35 40 − dB 300 to 860 MHz 22 27 − dB VSWR voltage standing wave ratio at the antenna input − 2.5 4 at the outputs − 1.5 3 Pi(max) maximum input power on antenna − −10 − dBm for 1 dB gain compression 1995 Mar 21 2, ORDERING INFORMATION

PACKAGE

TYPE NUMBER NAME DESCRIPTION VERSION TDA8725T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 BLOCK DIAGRAM (1) (2) (1) TV tuner or main tuner. (2) VCR tuner or PIP tuner. Fig.1 Block diagram. 1995 Mar 21 3,

PINNING

SYMBOL PIN DESCRIPTION TVOUT 1 output to TV tuner (VCR+TV) and to main tuner (PIP) AAGND1 2 antenna amplifier ground 1 AAGND2 3 antenna amplifier ground 2 AAGND3 4 antenna amplifier ground 3 ANTIN 5 antenna input n.c. 6 not connected AAGND4 7 antenna amplifier ground 4 VP1 8 power supply for the antenna amplifier VP2 9 power supply for the VCR output amplifier n.c. 10 not connected VCROUT 11 output to VCR and PIP tuner VCRGND1 12 VCR amplifier ground 1 VCRGND2 13 VCR amplifier ground 2 VCRIN 14 VCR RF input TVGND1 15 TV amplifier ground 1 Fig.2 Pin configuration. TVGND2 16 TV amplifier ground 2 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage −0.36VTstg storage temperature −55 +150 °C Tamb operating ambient temperature −10 +80 °C Tj junction temperature − +150 °C Ves electrostatic handling note 1 −2000 +2000 V note 2 −200 +200 V Notes 1. Human Body Model: UZW-BO/FQ-A302 (R = 1500 Ω, C = 100 pF). The IC withstands the ESD test class 2 (2000 V). 2. Machine Model: UZW-BO/FQ-B302 (R = 0 Ω, C = 200 pF). All pins withstand 200 V. THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air 115 K/W 1995 Mar 21 4,

CHARACTERISTICS

VP = 5 V; Tamb = 25 °C; measured in circuit of Fig.4; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage (pins 8 and 9) 4.75 5.0 5.25 V IP supply current (pins 8 and 9) 55 65 75 mA fi input frequency 40 − 860 MHz Gp power gain 40 to 860 MHz from antenna to VCR 3.5 5.0 6.5 dB from antenna to TV 4 5.5 7 dB from VCR − 0 − dB F noise figure 6.5 9.0 10 dB IP2 antenna linearity 2nd order at 40 MHz 137 140 − dBµV intercept point at 860 MHz 119 124 − dBµV IP3 antenna linearity 3rd order at 40 MHz 121 124 − dBµV intercept point at 860 MHz 108 111 − dBµV ssup signal suppression VCR input to antenna 0 to 1 GHz 32 37 − dB 1 to 3 GHz 25 30 − dB VCR output to TV output 0 to 300 MHz 35 40 − dB 300 to 860 MHz 22 27 − dB TV output to VCR output 0 to 300 MHz 35 40 − dB 300 to 860 MHz 22 27 − dB VSWR voltage standing wave ratio at the antenna input − 2.5 4 at the outputs − 1.5 3 Pi(max) maximum input power on antenna − −10 − dBm for 1 dB gain compression 1995 Mar 21 5, Fig.3 Reflection coefficient (S11) antenna input. 1995 Mar 21 6, APPLICATION INFORMATION Fig.4 Picture-in-picture (PIP) application. 1995 Mar 21 7, Fig.5 VCR and TV application. 1995 Mar 21 8,

PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

DEA

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A2 A (A 3 ) A1 pin 1 index θ Lp18LewMdetail X bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT max. A1 A2 A3 bpcD(1) E(1) e HE L LpQvwyZ(1) θ mm 0.25 1.45 0.49 0.25 10.0 4.0 6.2 1.0 0.7 0.71.75 1.27 1.050.10 1.25 0.25 0.36 0.19 9.8 3.8 5.8 0.4 0.6 0.25 0.25 0.1 0.3 8o o 0.0098 0 inches 0.0098 0.057 0.019 0.39 0.16 0.24 0.039 0.028 0.0280.069 0.0039 0.049 0.01 0.050 0.041 0.014 0.0075 0.38 0.15 0.23 0.016 0.020 0.01 0.01 0.004 0.012 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION ISSUE DATE IEC JEDEC EIAJ PROJECTION 91-08-13 SOT109-1 076E07S MS-012AC 95-01-23 1995 Mar 21 9, SOLDERING Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and Plastic small-outline packages vapour-phase reflow. Dwell times vary between 50 and BY WAVE 300 s according to method. Typical reflow temperatures range from 215 to 250 °C. During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the Preheating is necessary to dry the paste and evaporate adhesive, the component can be soldered. The adhesive the binding agent. Preheating duration: 45 min at 45 °C. can be applied by screen printing, pin transfer or syringe dispensing. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is Fix the component by first soldering two, diagonally 10 s, if allowed to cool to less than 150 °C within 6 s. opposite, end pins. Apply the heating tool to the flat part of Typical dwell time is4sat 250 °C. the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be A modified wave soldering technique is recommended soldered in one operation within 2 to5sat between 270 using two solder waves (dual-wave), in which a turbulent and 320 °C. (Pulse-heated soldering is not recommended wave with high upward pressure is followed by a smooth for SO packages.) laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most For pulse-heated solder tool (resistance) soldering of VSO applications. packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package BY SOLDER PASTE REFLOW placement. Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement.

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1995 Mar 21 10]

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