Download: INTEGRATED CIRCUITS DATA SHEET TDA8822 Universal I2C-bus programmable RF modulator Preliminary specification 1997 Jan 08 File under Integrated Circuits, IC02

INTEGRATED CIRCUITS

DATA SHEET TDA8822 Universal I2C-bus programmable RF modulator

Preliminary specification 1997 Jan 08 File under Integrated Circuits, IC02,

FEATURES

• 5 V power supply • Video amplifier with clamp and white clip circuits • Programmable video modulation depth • FM sound modulator (4.5, 5.5, 6.0 and 6.5 MHz) • Programmable picture-to-sound ratio GENERAL DESCRIPTION • Programmable deviation of the sound subcarrier The TDA8822 is a programmable modulator which • Input for modulated NICAM sound subcarrier or second generates an RF TV channel from a baseband video frequency modulated sound subcarrier signal and a baseband audio signal in the event of • Asymmetrical or symmetrical RF output buffer negative video and FM sound standards (B/G, I, D/K, M • Symmetrical RF oscillator for UHF or VHF band and N standards). according to the application Two PLL frequency-synthesizers set the picture carrier • One I2C-bus programmable output port frequency and the sound subcarrier frequency to the • On-chip Phase-Locked Loop (PLL) frequency required frequencies. These PLL frequency-synthesizers synthesizer for the RF carrier are programmed via the I 2C-bus. • On-chip PLL frequency synthesizer for the sound carrier The I2C-bus controls these features: • On-chip power supply regulator • Video modulation depth • On-chip I2C-bus and/or hardware controlled Test • Sound subcarrier modulation deviation Pattern Signal Generator (TPSG) with LED driver • Picture-to-sound ratio. • RF output switch-off during tuning. This makes the IC suitable for multistandard applications without any adjustment into the application. APPLICATIONS Additional features are provided like an input for the • Video recorders NICAM or second FM carrier, a test pattern signal • Cable converters generator with a LED driver and a general purpose output port. • Satellite receivers • Set top boxes. ORDERING INFORMATION TYPE PACKAGE NUMBER NAME DESCRIPTION VERSION TDA8822T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 TDA8822M SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 1997 Jan 08 2, QUICK REFERENCE DATA VCCA = VCCD = 5 V; Tamb = 25 °C; in PAL B/G, PAL I, PAL D/K or NTSC; MD setting = 4; DEV setting = 2; PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p); 1 kHz sine wave; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCCA analog supply voltage 4.5 5.0 5.5 V VCCD digital supply voltage 4.5 5.0 5.5 V ICC(tot) total supply current − 60 72 mA md modulation depth adjustment typical value for MD setting between 72.5 − 90.0 % range 0 and 7 P/S picture-to-sound ratio typical value for PS setting between −18 − −11 dB adjustment range 0 and 7 VRF RF output voltage level frequency between 45 and 860 MHz 77 80 83 dBµV asymmetrical on a 75 Ω load fsc sound subcarrier frequency 4.5 − 6.5 MHz ∆fsc sound subcarrier frequency for B/G, I, D/K, SC setting = 1, 2 or 3; 20 − 45 kHz deviation range typical value for DEV setting between 0 and 7 for M, N, SC setting = 0; typical value 10 − 22.5 kHz for DEV setting between 0 and 7 1997 Jan 08 3,

BLOCK DIAGRAM V

handbook, full pagewidth VIDEO AGND CCA RFA RFB 24 23 1 19 18 VOLTAGE OUTPUT CLAMP REGULATOR BUFFER

TPSG SWITCH

VIDEO CLIP AMP. MD setting TPSG ON/OFF 21 20 NICAM NICAM ADDER MIXER RFGND AMP. SND-IF AMP. AUDIO AUDIO VCO PS AMP. setting

DEV

setting sound oscillator TDA8822 PREEMPH ON/OFF RF oscillator 4 test test ON/OFF RFOSCA PROG. 5 2 AUDIO AUDIO frequencyDIVIDER RFOSCB ACP CHARGE PHASE setting RF 6 PUMP DETECTOR OSCILLATOR OGND frequency 14 BITS PRESCALER RFOSCC setting PROG. DIVIDE-BY-8 8 DIVIDER RFOSCD 14 I2C-bus control VCP

SCL

15 fdiv(audio) test test SDA I2C-BUS testf VIDEO RECEIVER div(video) VIDEO 9 PHASE LOOP AND CHARGE VVT DETECTOR AMP.16 P0 LOGIC in-lock flag PUMP 17 fref(video)

TPSG

fref(audio) REFERENCE CRYSTAL 12 XTAL DIVIDER OSCILLATOR 11 13 MGE674 VCCD DGND

Fig.1 Block diagram.

1997 Jan 08 4,

PINNING

SYMBOL PIN DESCRIPTION VCCA 1 analog power supply ACP 2 audio charge pump output PREEMPH 3 audio pre-emphasis network RFOSCA 4 RF oscillator A (collector) output RFOSCB 5 RF oscillator B (base) input handbook, halfpage OGND 6 RF oscillator ground VCCA 1 24 VIDEO RFOSCC 7 RF oscillator C (base) input ACP 2 23 AGND RFOSCD 8 RF oscillator D (collector) output PREEMPH 3 22 AUDIO VVT 9 video tuning voltage output RFOSCA 4 21 NICAM VCP 10 video charge pump output RFOSCB 5 20 RFGND VCCD 11 digital power supply XTAL 12 crystal oscillator input OGND 6 19 RFATDA8822 DGND 13 digital ground RFOSCC 7 18 RFB SCL 14 serial clock (I2C-bus) input RFOSCD 8 17 TPSG SDA 15 serial data (I2C-bus) input/output VVT 9 16 P0 P0 16 general purpose output VCP 10 15 SDA TPSG 17 test pattern signal generator

V

input/output pin CCD 11 14

SCL

RFB 18 RF output B XTAL 12 13 DGND RFA 19 RF output A MGE673 RFGND 20 ground for the RF outputs NICAM 21 NICAM input AUDIO 22 audio input AGND 23 analog ground Fig.2 Pin configuration. VIDEO 24 video input 1997 Jan 08 5, FUNCTIONAL DESCRIPTION The TPSG is activated in two ways: The TDA8822 is a programmable RF modulator which can – Forcing the pin TPSG to DGND in the application be divided into the following parts: (see Fig.8) • – Setting the TPSG bit to 1 via the I2Video part C-bus, then the TPSG pin acts as an output port, sinking current to • Audio part allow the indication of the use of the TPSG in the • RF part. application e.g. with an LED (see Fig.9). Video part Table 1 Modulation depth setting (typical values) The video part provides the following: MD BIT MODULATION • The video part includes a clamping circuit which sets the SETTING MD2 MD1 MD0 DEPTH (%) internal reference voltage to the bottom of the synchronizing pulse. The modulation depth is adjusted000072.5 using 3 bits of the I2C-bus programming, called MD2, 100175.0 MD1 and MD0. These 3 bits make 8 different values for201077.5 the modulation depth possible (see Table 1). 301180.0 • After the modulation depth is set, the signal is fed through a clip control circuit that clips the video signal to410082.5 avoid that the modulation depth becomes higher than510185.0 100%. 611087.5 • The video part also contains a TPSG. This TPSG711190.0 generates a pattern that helps to tune the TV set to the programmed channel of the modulator. The pattern consists of a sync pulse and two vertical white bars on the screen (see Fig.3) handbook, full pagewidth MGE6750510 15 20 25 30 35 40 45 50 55 60 65 t (µs) Fig.3 Test pattern signal. 1997 Jan 08 6, Audio part • fref(audio) and fdiv(audio) can be monitored on the general purpose output port during a special test mode. The audio part provides the following: • The frequency deviation of the sound subcarrier is set • The sound subcarrier is created in an integrated VCO. using 3 bits DEV2, DEV1 and DEV0 of the I2C-bus The signal at the output of this VCO is fed to a stage that programming (see Table 3), when a signal of 1 kHz with adjusts the picture-to-sound ratio and to the audio a level of 50 mV (p-p) is applied on the audio input pin. programmable divider. • The difference between the picture carrier level and the • The frequency of the sound subcarrier is set by sound subcarrier level is adjusted using 3 bits PS2, PS1 programming the bits SC1 and SC0 of the I2C-bus (see and PS0 (see Table 4). Table 2). These two bits set the dividing ratio of the audio programmable divider to get the divided frequency • The NICAM amplifier has a constant gain, and is f . designed for adding a second sound subcarrier in the TVdiv(audio) channel. This subcarrier can be either a second FM • The audio phase detector compares the carrier for dual-sound/stereo system used in PAL B/G or phase/frequency of the divided audio frequency fdiv(audio) a modulated NICAM carrier. The level between the and the reference frequency for the audio, fref(audio) and picture carrier and the NICAM carrier (P/N) will depend drives the Charge Pump (CP) that charges or on the input level on the NICAM input. discharges the audio loop filter connected between pins ACP and AGND to get the VCO oscillating to the programmed frequency. Table 2 Sound subcarrier frequency setting BIT SOUND SUBCARRIER SC SETTING STANDARD SC1 SC0 FREQUENCY (MHz) 0004.5 M, N1015.5 B, G2106.0I3116.5 D, K Table 3 Sound subcarrier frequency deviation setting (typical values) BIT DEVIATION DEVIATION (kHz) DEV SETTING DEV2 DEV1 DEV0 (%) B, G, I, D, K M, N000040.0 20.0 10.0100145.0 22.5 11.3201050.5 25.3 12.6301156.5 28.3 14.1410063.5 31.8 15.9510171.5 35.8 17.9611080.0 40.0 20.0711190.0 45.0 22.5 1997 Jan 08 7, Table 4 Picture-to-sound ratio setting (typical values) BIT P/S RATIO PS SETTING PS2 PS1 PS0 (dB) 0000−111001−122010−133011−144100−155101−166110−177111−18 RF part • fref(video) and fdiv(video) can also be monitored on the output port during a special test mode. The RF part provides the following: • The I2C-bus receiver and control logic includes the • The RF oscillator can produce any frequency used for control of: TV transmission, from 35 to 890 MHz. The frequency range depends on the components used in the – Picture carrier frequency application (see Table 11). – Sound subcarrier frequency • The RF mixer combines the video signal, the sound – Sound subcarrier frequency deviation subcarrier and the carrier from the NICAM input to build – Video modulation depth a baseband TV channel. This baseband signal is then mixed with the RF oscillator signal to get the RF TV – Picture-to-sound ratio channel. – TPSG on/off and LED drive control • The two signals from the RF mixer are sent to the output – RF oscillator on/off buffer. This output buffer can be used either as two – Sound oscillator on/off asymmetrical outputs or as one symmetrical output. – General purpose output port on/off • The output buffer is switched-off while the PLL is not in-lock, to avoid parasitic output signal during the tuning – Test modes setting. of the RF oscillator. The in-lock information is given by the phase detector of the loop. Software information • The signal from the RF oscillator is fed to the PLL which The transmission is made using 4 words in I2C-bus format. controls the picture carrier frequency. The RF signal is First the address CA has to be sent, then at least two first divided by 8 in the prescaler, and then divided in the consecutive words have to be sent, either the two words programmable 14-bits divider. The dividing ratio of this F1 and F0, or the two words C1 and C0. divider is programmed via the I2C-bus. The minimum The two words C1 and F1 are differentiated inside the IC frequency that can be synthesized is 16 MHz, and the by the first bit being logic 1 or logic 0 respectively. maximum frequency is 1023.9375 MHz. The contents of the 4 bytes is shown in Table 5. • The divided frequency called fdiv(video) is compared to the At the power-up of the TDA8822, the I2C-bus state is the reference frequency called fref(video) coming from the following: crystal oscillator and divided in the reference divider. The crystal oscillator is intended to be used with a • N13 to N0 are not fixed crystal of 4 MHz. • SC setting = 1: the sound carrier is fixed to 5.5 MHz • The comparison between fref(video) and fdiv(video) is done • MD is set to 4 (82.5%), PS is set to 1 (−12 dB) and DEV in the video phase detector. The resulting signal is fed is set to 2 (50.5%) via the video charge pump to the loop amplifier, including the tuning voltage drive (33 V) inside the IC. 1997 Jan 08 8, • T0 is set to logic 1, RF0 is set to logic 1, TPSG is set to • N is the programmable divider ratio: logic 1 and P0 is set to logic 0 to select the video high N = N 13 1213 × 2 + N12 × 2 + ... + N1 × 2 + N0 impedance test mode because it is in this mode that the • fosc is the RF oscillator frequency. RF oscillator starts in the best conditions. DEV2, DEV1 and DEV0 are the bits to set the sound The TPSG bit is used to switch on or off the TPSG using subcarrier frequency deviation (see Table 3). the I2C-bus. It is also possible to switch the TPSG on in the application, connecting the pin TPSG to DGND. This PS2, PS1 and PS0 are the bits to set the picture-to-sound pin TPSG has a double function and acts as an input or as ratio (see Table 4). an output. MD2, MD1 and MD0 are the bits to set the modulation These are the two functions: depth (see Table 1). • Output: if the TPSG is set using the I2C-bus, the SC1 and SC0 are the bits to set the sound subcarrier pin TPSG is used as an output open collector NPN port. frequency according to Table 2. This port can be used to indicate with an LED that the RF0 is a bit that controls the RF oscillator on/off. In normal TPSG is on. This is especially useful in systems using mode, it should be set to logic 1. If the modulator is not an on-screen display. If the TV set is not tuned to the used and may create some interferences with other right channel there is an alternate indication that the signals in the application, it should be set to logic 0 TPSG is on (see Fig.9). (see Table 6). • Input: if the TPSG is set with an hardware switch in the application, the TPSG pin is used as one of the inputs to Notice that if the bit RF0 is logic 0 while the bit TPSG is select the TPSG mode (see Fig.8). logic 1, then the RF oscillator is still running, but the sound oscillator is off, and the TPSG is also off (see Table 8). Notice that if the TPSG bit is set to logic 1 while the RF0 bit is set to logic 0, the TPSG is turned off, and the sound The bit P0 controls the output port P0, which is an open oscillator is off (see Table 8). collector NPN port, able to drive up to 10 mA (see Table 7). N13 to N0 are the 14 bits to set the video programmable divider ratio and then to set the picture carrier frequency T0 is a bit used for test purposes. If this bit is set to logic 0, following the formula: f = f × 8 × N, the IC operates in normal configuration. If it is set toosc ref(video) logic 1, then the use of bits TPSG, RF0 and P0 is changed where: to select 1 of the 8 test modes as explained in Table 9. • fref(video) is the frequency on pin XTAL divided by the reference divider ratio. For example, witha4MHz crystal connected to 4 000 000 pin XTAL, fref (video) = - = 7812.5 Hz512 Table 5 Contents of programming words MSB LSB BYTE ACKNOWLEDGE BIT BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Address byte CA11001010ACK F1: frequency 0 TPSG N13 N12 N11 N10 N9 N8 ACK byte 1 F0: frequency N7 N6 N5 N4 N3 N2 N1 N0 ACK byte 0 C1: control byte11DEV2 DEV1 DEV0 PS2 PS1 PS0 0 ACK C0: control byte 0 MD2 MD1 MD0 SC1 SC0 RF0 P0 T0 ACK 1997 Jan 08 9, Table 6 RF oscillator on/off setting (see note 1) STATE OF RF0 ACTION ON RF OSCILLATOR 0 stopped; no RF carrier 1 operating; normal use Note 1. This table is valid only if bit TPSG is set to logic 0. Table 7 Output port programming VOLTAGE ON PORT STATE OF P0 PORT STATE (with a pull-up resistor to VCCD) 0 high impedance close to VCCD 1 sinking current close to0VTable 8 Overview of the normal modes T0 RF0 TPSG P0 PIN TPSG MODE010X(1) input: open RF on; TPSG off010X(1) input: to DGND RF on; TPSG on011X(1) output: sinking current RF on; TPSG on000X(1) input: open or to DGND RF off001X(1) input: open RF on; TPSG off; sound oscillator off001X(1) input: to DGND RF on; TPSG on; sound oscillator off 0 X(1) X(1) 0 X(1) Port P0 off (high impedance) 0 X(1) X(1) 1 X(1) Port P0 on (sinking current) Note 1. X means logic 0 or logic 1, don’t care. 1997 Jan 08 10, Table 9 Overview of the test modes T0 RF0 TPSG P0 PIN(1) TPSG TEST MODES1000Xfref(audio) on P0; both CP sinking current; notes 2 and61001Xfdiv(audio) on P0; note31010Xfref(video) on P0; both CP sourcing current; notes 4 and61011Xfdiv(video) on P0; note51100Xvideo charge pump off; note71101Xaudio charge pump off and balance test; notes 8 and 111110Xvideo high impedance test; note91111Xbaseband signal on RF outputs; note 10 Notes 1. During the test mode (bit T0 set to logic 1), the pin TPSG is unused, meaning that the input information does not have any effect, and that the output port does not sink any current. 2. In ‘fref(audio) on P0’ mode, the reference frequency of the audio PLL is available on the port P0. f 3. In ‘fdiv(audio) on P0’ mode, - d-i-v-(-a-u-d-i-o-) is available on the port P0 (fdiv(audio) is the frequency from the sound oscillator2 divided by the dividing ratio of the audio programmable divider). 4. In ‘fref(video) on P0’ mode, the reference frequency of the video PLL is available on the port P0. f 5. In ‘fdiv(video) on P0’ mode, - d-i-v-(-v-i-d-e-o-)- is available on the port P0 (fdiv(video) is the frequency of the RF oscillator divided2 by the dividing ratio of the video programmable divider). 6. In ‘both CP sinking or sourcing current’ modes, the charge pump of the audio PLL and the one of the video PLL are sinking or sourcing their nominal current. 7. The ‘video charge pump off’ mode allows to measure the leakage current on the video PLL charge pump. 8. The ‘audio charge pump off’ mode allows to measure the leakage current on the audio PLL charge pump. 9. In the ‘video high-impedance’ mode, it is possible to inject an external tuning voltage for the RF carrier setting. In this mode, the video PLL is off. 10. In the ‘baseband signal on RF outputs’ mode, the RF oscillator is off, and it is possible to measure the baseband video and audio subcarrier signals on the RF output pins. 11. During the ‘balance test’ mode the picture carrier is over-modulated allowing the measurement of the residual carrier. 1997 Jan 08 11, Example of programming We want to program the TDA8822 in a UHF application, on channel 21 (picture carrier at 471.25 MHz) in a B/G standard (sound carrier at 5.5 MHz from the picture carrier) with a Picture-to-Sound ratio of −12 dB, a modulation depth of 82.5% and a deviation set to 50.5% in normal mode, without TPSG, output port on. These are the values of the bits that must be programmed: f • The video dividing ratio will be N = 471 250 000-o-s-c- = - = 7540 = 01110101110100 fref × 8 7 812.5 × - • TPSG bit will be set to logic 0 • DEV2 will be set to logic 0, DEV1 to logic 1 and DEV0 to logic 0 • PS2 will be set to logic 0, PS1 to logic 0 and PS0 to logic 1 • MD2 will be set to logic 1, MD1 to logic 0 and MD0 to logic 0 • SC1 will be set to logic 0 and SC0 to logic 1 • P0 will be set to logic 1 • RF0 will be set to logic 1 • T0 will be set to logic 0. The protocol to the TDA8822 is illustrated in Table 10. Table 10 Example of programming for the TDA8822. MSB LSB BYTE ACKNOWLEDGE BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Address byte CA11001010ACK F1: frequency00011101ACK byte 1 F0: frequency01110100ACK byte 0 C1: control byte110100010ACK C0: Control byte010001110ACK 1997 Jan 08 12, LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VCCA analog supply voltage −0.3 +7.0 V VCCD digital supply voltage −0.3 +7.0 V VCC operating supply voltage 4.5 5.5 V Vmax maximum voltage on all pins except SCL, SDA and VVT −0.3 VCC V VBUS(max) maximum voltage on SCL and SDA pins −0.3 +7.0 V VVVT(max) maximum voltage on VVT pin −0.3 +35.0 V Tstg storage temperature −40 +125 °C Tamb operating ambient temperature −20 +85 °C

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits. The IC withstands the ESD test in accordance with the “UZW-B0/FQ-A302” specification equivalent to the “MIL-STD-883C category B” (2000 V). The IC withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM), specification “UZW-B0/FQ-B302”, issue date November 6th, 1990,(0 Ω, 200 pF, 200 V). THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT Rth j-a thermal resistance from junction to ambient in free air SO24; SOT137-1 74 K/W SSOP24; SOT340-1 120 K/W 1997 Jan 08 13,

CHARACTERISTICS

VCCA = VCCD = 5 V; Tamb = 25 °C; in PAL B/G, PAL I, PAL D/K, or NTSC; MD setting = 4; DEV setting = 2; PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p) 1 kHz sine wave; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply IP power supply current analog and digital parts − 60 72 mA Video characteristics IVIDEO video input current − 0.5 2.0 µA zVIDEO video input impedance 30 − − kΩ md modulation depth part-to-part variation; 77.5 82.5 87.5 % MD setting = 4 md(clip) modulation depth during clipping video input level lower − − 99 % condition than1V(p-p) md(TPSG) modulation depth when TPSG mode part to part variation, 72.5 82.5 92.5 % on MD setting = 4 md(APL) variation of the modulation depth with reference for APL = 50% −2 0 +2 % change of APL between 10 and 90% S/N video signal-to-noise ratio note 1 48 52 − dB Gdiff differential gain note 2 − 3 6 % ϕdiff differential phase note 2 − 3 6 deg V/S video-to-sync ratio input signal: V/S = 7 : 3 6.9 : 3.1 7 : 3 7.1 : 2.9 fvideo frequency response for the video note 3 −1 − +1 dB signal Audio characteristics ZAUDIO audio input impedance without any resistor 30 − − kΩ between AUDIO and

AGND

∆fm modulation deviation SC setting = 1, 2 or 3; 20 25 30 kHz DEV setting = 2 SC setting = 0; 10 12.5 15 kHz DEV setting = 2 ∆fm(max) maximum modulation deviation VAUDIO = 500 mV (p-p); 180 250 − kHz note 4 THD total harmonic distortion 50 mV (p-p) sine wave at − 0.4 1.0 % 1 kHz on AUDIO pin S/N audio signal-to-noise ratio note 5 44 47 − dB fAUDIO frequency response of the audio signal note 6 −1 − +1 dB ∆fsc(acc) sound subcarrier accuracy note 7 −1 0 +1 kHz P/S picture-to-sound ratio no audio signal; no video −15 −12 −9 dB signal; PS setting = 1 1997 Jan 08 14, SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT NICAM characteristics ZNICAM NICAM input impedance 10 − − kΩ P/N level between picture carrier and NICAM input −23 −20 −17 dB NICAM carrier level = 150 mV (p-p); no video signal fNICAM frequency response of the NICAM for frequencies between 5 −1 − +1 dB input and 8 MHz; reference for 6.5 MHz BER bit error rate note 11 − 10−6 − EHD eye-height degradation note 11 − 4 − % Channel characteristics fRF RF frequency range with application VHF 1 47 − 88 MHz with application VHF 3 174 − 230 MHz with application UHF 470 − 860 MHz fRF(acc) picture carrier accuracy note 7 −75 − +75 kHz VRF output level on RF outputs during sync. between 45 and 860 MHz 77 80 83 dBµV pulse, loaded with 75 Ω VRF(flat) flatness of the RF output level across reference is centre of −202dB each band each band Zo(RF) RF output impedance single ended − 75 − Ω SPUo spurious outside channel note 8 − − −40 dBc SPU2PC RF second harmonic level on asymmetrical output at − − −10 dBc low end of UHF band SPU2SC sound carrier second harmonic level − −65 −60 dBc SPU3SC sound carrier third harmonic level − −65 −60 dBc SPUfref reference frequency spurious measured with Philips − − −40 dBc application board CHRBEAT chroma beat note 9 − − −63 dBc NICBEAT NICAM beat note 10 − − −63 dBc Video charge pump output and video tuning amplifier: VCP and VVT IVCP output current − 50 − µA IVCP(lk) off-state leakage current −10 − 10 nA VVVT(min) minimum tuning voltage on pin VVT 27 kΩ resistor between − − 0.2 V pin VVT and +33 V IVVT(lk) leakage current on pin VVT 27 kΩ resistor between − − 10 µA pin VVT and +33 V; high impedance test mode Audio charge pump output: ACP IACP output current − 3 − µA IACP(lk) off-state leakage current −10 − 10 nA VACP tuning voltage range for the audio PLL, 1.5 − 4.5 V on pin ACP 1997 Jan 08 15, SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT XTAL characteristics |ZXTAL| XTAL input impedance absolute value; 600 1200 − Ω witha4MHz crystal Output Port characteristics VPORT low voltage port on; IPORT = 10 mA − 150 400 mV IPORT(lk) off-state leakage current port off; VCCD = 5.5 V − − 10 µA IPORT(sink) sinking current in the port port on 10 − − mA TPSG pin characteristics VTPSG(on) voltage on pin TPSG to switch the 0 − 1.5 V TPSG on VTPSG(off) voltage on pin TPSG to switch the 3.0 − VCCD V TPSG off ITPSGL LOW input current in pin TPSG TPSG to DGND −100 − − µA ITPSGH HIGH input current in pin TPSG TPSG to VCCD − − 100 µA ITPSG(sink) output sinking current in pin TPSG TPSG set on using 10 − − mA I2C-bus VTPSG(sink) voltage on pin TPSG used as output TPSG set on using − 150 400 mV I2C-bus I2C-bus receiver characteristics, pins SCL and SDA fSCL frequency on SCL line − − 100 kHz VIH HIGH level input voltage 3 − 5.5 V VIL LOW level input voltage 0 − 1.5 V IIH HIGH level input current VIH = 5 V; VCCD = 0 or5V− − 10 µA IIL LOW level input current VIL = 0 V; VCCD = 0 or5V−10 − − µA VSDA(ack) acknowledge output voltage on SDA during acknowledge − − 0.4 V pulse; IIL = 3 mA Notes 1. Ratio between the CCIR 17-line bar amplitude (corresponding to the level difference between black and white; see Fig.4) and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after demodulation. Measurement is done for frequencies between 200 kHz and 5 MHz. Measurement is unweighted. 2. Measured on CCIR 330 line, corresponding to a 5-step staircase with a chroma carrier of amplitude equal to 0.3 times the voltage between sync pulse and white (see Fig.5). The video signal is 500 mV (p-p). The modulation depth is adjusted using the I2C-bus to MD setting = 4 (82.5% typical modulation depth). 3. Measured with a spectrum analyser with ‘peak hold’ function, applying a 500 mV (p-p) sine wave at the video input of the IC, with a sweeping frequency between 0.5 and 6.0 MHz. The reference is the value measured at 1.0 MHz. 4. To have a deviation between 50 and 250 kHz, the audio frequency must be higher than 100 Hz. 5. Measured with an audio frequency of 1 kHz with a level adjusted to get a deviation of 50 kHz with DEV setting = 2, using CCIR 468-3 weighting filter, with a quasi-peak detection. The input signal has pre-emphasis and the receiver has de-emphasis. Video signal is 500 mV (p-p) EBU colour bars on pin VIDEO. 1997 Jan 08 16, 6. Measured with no pre-emphasis on the audio input and no de-emphasis in the receiver. Measurement is done for frequencies between 50 Hz and 15 kHz, reference is the level measured at 1 kHz. 7. The accuracy only depends on the accuracy of the reference frequency (accuracy of the crystal). Notice that the value of the capacitor in series with the crystal must be chosen to be as close as possible to the load capacitance of the crystal. 8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator frequency and the sound oscillator frequency (fRF + 2fs, 2fRF + fs, etc.). This measurement includes the spurious at the 1⁄ f , 1⁄ f and 34 RF 2 RF ⁄4fRF. 9. Chroma beat a) For PAL: measured applying a 4.43 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 1.07 MHz for PAL B/G, 1.57 MHz for PAL I and 2.07 MHz for PAL D/K. b) For NTSC: measured applying a 3.58 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 920 kHz. 10. NICAM beat a) For PAL B/G: measured applying a sine wave of 150 mV (p-p) at 5.85 MHz on the NICAM input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 350 kHz or 5.15 MHz. b) For PAL I: measured applying a sine wave of 150 mV (p-p) at 6.552 MHz on the NICAM input. Measurement is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency of the picture carrier plus 552 kHz or 5.448 MHz. 11. NICAM eye height and Bit Error Rate measurement conditions: a) A NICAM frame is applied from a Textronix 728E in B/G mode on the NICAM input of the TDA8822 through an attenuator to get 150 mV (p-p). The sound subcarrier is set to 5.5 MHz (SC = 1) and the picture to sound ratio is set to -12 dB (PS = 1). There is no video signal applied to the video input and no audio signal on the audio input. b) The RF carrier is demodulated with a Rohde & Schwartz EMFP demodulator for PAL B/G, the sound trap filter is set off, and the video signal is fed to a Textronix 728D NICAM demodulator for B/G. Measurements of the eye height and bit error rate are done on the 728D. 1997 Jan 08 17, handbook, full pagewidth MBE3961V0.3V0V010 20 30 40 50 60 70 t (µs) 64 Fig.4 CCIR insertion line 17. handbook, full pagewidth MBE3971V0.3V0V010 20 30 40 50 60 70 t (µs) 64 Fig.5 CCIR insertion line 330. 1997 Jan 08 18,

INTERNAL PIN CONFIGURATION

handbook, full pagewidth 1 VOLTAGE VCCA REGULATOR VCCA

VCCA

regulated VIDEO 2 voltage

ACP AGND AGND

regulator voltage

AGND

V 22CCD AUDIO

AGND VCCA NICAM DGND VCCA

regulated voltage

AGND RFGND

3 VCCA

PREEMPH

AGND RFA regulated voltage RFB

RFOSCA RFOSCB VCCD

6 17 OGND TPSG

RFOSCC RFOSCD VVT DGND VCCD DGND

V 16CCD P0

DGND VCP VCCD SDA DGND

VCCD DGND

VCCD VCCD SCL XTAL DGND

DGND DGND MGE681

Fig.6 Pin equivalent circuit for each pin.

1997 Jan 08 19,

APPLICATION INFORMATION

R14

SCL

270 Ω R15

SDA

C21 270 Ω NICAM RFB R21 1 nF C22 51 Ω RFA 220 pF R27

AUDIO

220 kΩ R22 C19 C18 R18 12 100 100 R24 C24 kΩ pF pF 1 kΩ VIDEO P0 470 Ω 100 nF R26 R25 VIDEO AGND AUDIO NICAM RFGND RFA RFB TPSG P0 SDA SCL DGND 82 Ω 470 Ω 24 23 22 21 20 19 18 17 16 15 14 13 TDA882212345678910 11 12 VCCA ACP PRE RFOSCA RFOSCB OGND RFOSCC RFOSCD VVT VCP VCCD XTAL

EMPH

C4 C5 C7 C8 C2 C1 (1) (1) (1) (1) C10 R10 XTAL12.2 100 4.7 33µF 4 MHz nF L1 (1) nF kΩ C6 (1) C27 C12(1) R7 R8 R2 100 nF 18 pF C26 4.7 D1 22 kΩ 15 kΩ kΩ 68 nF R5 22 kΩ C9 R9 C25 10 nF 27 kΩ C11 10 10 nF nF VCC = 5 V VVT = 33 V MGE678 (1) The components marked: C4, C5, C6, C7, C8, L1 and D1 must be chosen from Table 11 to get the desired frequency range.

Fig.7 Reference application.

1997 Jan 08 20 handbook, full pagewidth, Application design In the design of the application, it is highly recommended to separate the part of the RF oscillator as much as possible from the part of the RF outputs in order to avoid parasitic coupling between these two parts. A good solution is shielding the RF oscillator part to avoid radiation from and to this part. The pin OGND must be connected to the shielding box and to ground. The frequency range the IC covers is fixed by the choice of the components marked with a note (1) in Fig.7. For these components, it is recommended to use the values indicated in Table 11. Table 11 Components to be used for the RF oscillator FREQUENCY VALUE FOR VALUE L1: NUMBER L1:COIL L1: WIRE BAND D1 RANGE C4, C5, C7, C8 FOR C6 OF TURNS DIAMETER DIAMETER VHF1 47 to 130 MHz 5.6 pF 100 pF BB132 14.5 3.0 mm 0.3 mm VHF3 130 to 350 MHz 4.7 pF 150 pF BB133 4.5 3.0 mm 0.4 mm UHF 470 to 860 MHz 1.8 pF 22 pF BB134 1.5 2.5 mm 0.5 mm Video input (pin 24) Audio input (pin 22) The video input level on the IC is of 500 mV (p-p). In most The IC is sensitive to 45 mV (p-p) on pin AUDIO and the of the cases, the available video signals are of1V(p-p) DC voltage on this pin is close to 0 V. with a source impedance of 75 Ω. This pin needs to be grounded through a 12 kΩ resistor To handle this kind of signal, we use a resistive divider with (R22 in Fig.7). Care must then be taken if a coupling two 470 Ω resistors (R24 and R25 in Fig.7) to divide the capacitor needs to be implemented on the audio path to1V(p-p) signal down to 500 mV (p-p). In order to get an connect it between the signal source and the input, with input impedance of 75 Ω, a resistor of 82 Ω is implemented the resistor of 12 kΩ still connected to the AUDIO pin. in parallel to the divider (R26 in Fig.7). NICAM input (pin 21) Audio pre-emphasis The NICAM pin is sensitive to 150 mV (p-p) to reach a The capacitor C22 connected in parallel with R27 is level between picture carrier and NICAM carrier of typical defining the time constant for the pre-emphasis following −20 dBc. Table 12. It is possible to put on this pin either a NICAM modulated carrier for a NICAM application or a frequency modulated Table 12 Choice of the pre-emphasis constant carrier for the stereo system with a second FM carrier used CAPACITOR TIME e.g. in Germany.

STANDARD

C22 CONSTANT In a specific application where the main sound subcarrier NTSC 330 pF 75 µs would be generated outside the IC, it is also possible to PAL 220 pF 50 µs inject the main sound carrier to this pin, with a level − depending on the wanted P/S. In this event, it is necessaryspecial; note 1 no capacitor to stop the internal sound oscillator by setting RF0 to Note logic 0 and TPSG to logic 1 (see Table 8). 1. This mode has to be considered if the pre-emphasis is applied else-where on the path of the audio signal, or if there is no need for pre-emphasis in specific applications. Note also that the pre-emphasis can be done by connecting a capacitor between pin PREEMPH (pin 3) and ground. The value for this capacitor is 10 nF for PAL and 15 nF for NTSC. 1997 Jan 08 21, TPSG input/output (pin 17) If a cutoff frequency slightly higher than 20 Hz can be accepted, it is possible to reduce the value of the 2.2 µF As already mentioned, this pin can be used either as an capacitor (C2) to 220 nF. In this case C26 needs to be input or as an output. changed from 68 nf to 22 nF and R3 needs to be changed • As an input, it allows to turn on the TPSG, without from 4.7 kΩ to 33 kΩ. changing anything to the word the TDA8822 is programmed through the I2C-bus. RF outputs (pins 18 and 19) In this mode, it is simply necessary to connect a switch For inexpensive applications, it is possible to use the IC between the pin TPSG and DGND (see Fig.8). If the with an asymmetrical output. switch is open, then the TPSG is selected corresponding to the I2C-bus programming; if the switch In an asymmetrical application, the unused output pin is closed, then the TPSG is on. must be loaded with a load as close as possible to the load • As an output, it allows to indicate e.g. with an LED that connected to the used pin. the TPSG has been programmed on using the I2C-bus. A good improvement in performance is obtained using a In this mode, the pin acts as an open-collector output symmetrical to asymmetrical transformer port, it is possible to connect a LED to the5Vpower (balun; balance-to-unbalance) connected between the two supply with a series resistor to limit the current to about outputs. In this event both outputs have their loads 10 mA (see Fig.9). matched. The level of the RF second harmonic, and the spurious outside channel is decreasing. The parasitic XTAL pin (pin 12) coupling between RF outputs and RF oscillator is also reduced. This pin is connected toa4MHz crystal in series with a capacitor. The value of this capacitor has to be as close as RF harmonics possible to the load capacitance of the crystal. This IC has been designed to have the lowest level of It is also possible to drive the IC with an external 4 MHz unwanted RF harmonics at the frequencies where these signal from a voltage source. A level of 50 mV(RMS) are the hardest to be filtered out, especially for the second insures stable operation. A capacitor of about 18 pF and a harmonic of the RF carrier at the lowest frequencies of the resistor of 680 Ω needs to be placed in series with the UHF band. voltage source. It is possible to reduce the level of the second harmonic by ACP pin (pin 2) using a wide-band transformer at the output of the IC and create a symmetrical application. This pin is the charge pump output for the sound subcarrier PLL as well as the input of the sound subcarrier VCO. To reduce the out-of-band harmonics and especially the third one, it is necessary to use a low-pass filter at the It is necessary to connect the loop filter between this pin output of the IC. and ground. The loop filter indicated in Fig.7 gives a cut-off frequency lower than 20 Hz. 1997 Jan 08 22, handbook, halfpage RFGND handbook, halfpage 20 RFGND20 C19 RFA C19RFA 19 RFA VCC = 5 V 19 RFA VCC = 5 V 100 pF 100 pF C18 R15 1 kΩ C18 R15 1 kΩRFB RFB 18 RFB 18 RFB 100 pF 100 pF R17 330 Ω TPSG TPSG 17 17 P0 P0 16 P0 16 P0 SDA R15 SDA R15 15 SDA 15 SDA 270 Ω S1 270 Ω SCL R14 SCL SCL R14 14 14 SCL 270 Ω 270 Ω DGND DGND 13 13 MGE679 MGE680 Fig.8 Use of the pin TPSG as an input. Fig.9 Use of the pin TPSG as an output. 1997 Jan 08 23,

PACKAGE OUTLINES SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

DEA

X

c y HEvMA

Z

24 13

Q

A2AA(A 3 )1 pin 1 index θ Lp

L

1 12 detailXewMbp0510 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNITAAAbcD(1) E (1) eHLLQvwy(1)max. 123pEpZθmm 2.65 0.30 2.45 0.49 0.32 15.6 7.6 10.65 1.1 1.1 0.9 0.10 2.25 0.25 0.36 0.23 15.2 7.4 1.27 10.00 1.4 0.4 1.0 0.25 0.25 0.1 0.4 8o o inches 0.10 0.012 0.096 0.019 0.013 0.61 0.30 0.419 0.043 0.043 0.035 0.004 0.089 0.01 0.014 0.009 0.60 0.29 0.050 0.394 0.055 0.016 0.039 0.01 0.01 0.004 0.016 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION PROJECTION ISSUE DATE IEC JEDEC EIAJ 95-01-24 SOT137-1 075E05 MS-013AD 97-05-22 1997 Jan 08 24, SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1DEA

X

c y HEvMA

Z

24 13

Q

A2AA(A 3 )1 pin 1 index θ Lp

L

1 12 detailXwMebp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

A

UNITAAAbcD(1) (1) (1)max. 123pEeHE L LpQvwyZθmm 0.21 1.80 0.38 0.20 8.4 5.4 7.9 1.03 0.9 0.8 o 2.0 0.05 1.65 0.25 0.25 0.09 8.0 5.2 0.65 7.6 1.25 0.63 0.7 0.2 0.13 0.1 0.4 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION ISSUE DATE IEC JEDEC EIAJ PROJECTION 93-09-08 SOT340-1 MO-150AG 95-02-04 1997 Jan 08 25, SOLDERING SSOP Introduction Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to There is no soldering method that is ideal for all IC closely-spaced leads and the possibility of incomplete packages. Wave soldering is often preferred when solder penetration in multi-lead devices. through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is If wave soldering cannot be avoided, the following not always suitable for surface mounted ICs, or for conditions must be observed: printed-circuits with high population densities. In these • A double-wave (a turbulent wave with high upward situations reflow soldering is often used. pressure followed by a smooth laminar wave) This text gives a very brief insight to a complex technology. soldering technique should be used. A more in-depth account of soldering ICs can be found in • The longitudinal axis of the package footprint must our “IC Package Databook” (order code 9398 652 90011). be parallel to the solder flow and must incorporate solder thieves at the downstream end. Reflow soldering Even with these conditions, only consider wave Reflow soldering techniques are suitable for all SO and soldering SSOP packages that have a body width of SSOP packages. 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or METHOD (SO AND SSOP) pressure-syringe dispensing before package placement. During placement and before soldering, the package must Several techniques exist for reflowing; for example, be fixed with a droplet of adhesive. The adhesive can be thermal conduction by heated belt. Dwell times vary applied by screen printing, pin transfer or syringe between 50 and 300 seconds depending on heating dispensing. The package can be soldered after the method. Typical reflow temperatures range from adhesive is cured. 215 to 250 °C. Maximum permissible solder temperature is 260 °C, and Preheating is necessary to dry the paste and evaporate maximum duration of package immersion in solder is the binding agent. Preheating duration: 45 minutes at 10 seconds, if cooled to less than 150 °C within 45 °C. 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal Wave soldering of corrosive residues in most applications.

SO

Repairing soldered joints Wave soldering techniques can be used for all SO Fix the component by first soldering two diagonally- packages if the following conditions are observed: opposite end leads. Use only a low voltage soldering iron • A double-wave (a turbulent wave with high upward (less than 24 V) applied to the flat part of the lead. Contact pressure followed by a smooth laminar wave) soldering time must be limited to 10 seconds at up to 300 °C. When technique should be used. using a dedicated tool, all other leads can be soldered in • The longitudinal axis of the package footprint must be one operation within 2 to 5 seconds between parallel to the solder flow. 270 and 320 °C. • The package footprint must incorporate solder thieves at the downstream end. 1997 Jan 08 26,

DEFINITIONS

Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1997 Jan 08 27,

Philips Semiconductors – a worldwide company

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Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Middle East: see Italy For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Internet: http://www.semiconductors.philips.com Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 © Philips Electronics N.V. 1997 SCA53 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/50/01/pp28 Date of release: 1997 Jan 08 Document order number: 9397 750 01601]

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